Ukufakwa kwefilimu ezacile kuwukumboza ungqimba lwefilimu ku-substrate eyinhloko ye-semiconductor. Le filimu ingenziwa ngezinto ezihlukahlukene, njenge-insulating compound silicon dioxide, semiconductor polysilicon, ithusi lensimbi, njll. Izinto ezisetshenziselwa ukumboza zibizwa ngokuthi ifilimu encane ...
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