A isilucwecwanakufanele idlule izinguquko ezintathu ukuze ibe i-chip yangempela ye-semiconductor: okokuqala, ingot emise okwe-block inqunywa ibe ama-wafers; enqubweni yesibili, ama-transistors aqoshwa ngaphambili kwe-wafer ngokusebenzisa inqubo yangaphambilini; ekugcineni, ukupakishwa kwenziwa, okungukuthi, ngenqubo yokusika, iisilucwecwanaiba yi-chip ye-semiconductor ephelele. Kungabonakala ukuthi inqubo yokupakisha ingeyenqubo yokugcina emuva. Kule nqubo, i-wafer izosikwa ibe ama-chips amaningana e-hexahedron. Le nqubo yokuthola ama-chips azimele ibizwa ngokuthi "Singulation", futhi inqubo yokusaha ibhodi le-wafer libe yi-cuboid ezimele ibizwa ngokuthi "i-wafer cutting (Die Sawing)". Muva nje, ngokuthuthukiswa kokuhlanganiswa kwe-semiconductor, ukushuba kweizinkwa eziwucwecweiye yaba mncane futhi yaba mncane, okuyinto ngokuqinisekile iletha ubunzima obuningi enqubweni "yokuhlukanisa".
Ukuvela kwe-wafer dicing
Izinqubo zangaphambili nangemuva ziye zavela ngokusebenzisana ngezindlela ezihlukahlukene: ukuvela kwezinqubo zokubuyela emuva kunganquma ukwakheka kanye nokuma kwe-hexahedron chips ezincane ezihlukanisiwe nefaisilucwecwana, kanye nesakhiwo kanye nesimo samapads (izindlela zokuxhuma ugesi) ku-wafer; ngokuphambene nalokho, ukuvela kwezinqubo ze-front-end kushintshe inqubo kanye nendlelaisilucwecwanaukuncipha emuva kanye "nokufa kwe-dicing" kunqubo yokugcina emuva. Ngakho-ke, ukubukeka okuyinkimbinkimbi kwephakheji kuzoba nomthelela omkhulu enqubweni yokugcina emuva. Ngaphezu kwalokho, inombolo, inqubo kanye nohlobo lokudayela kuzophinde kushintshe ngokuhambisana nokushintsha kokubukeka kwephakheji.
I-Scribe Dicing
Ezinsukwini zokuqala, "ukuphuka" ngokusebenzisa amandla angaphandle kwakuwukuphela kwendlela yokudayela eyayingahlukanisaisilucwecwanaku-hexahedron iyafa. Kodwa-ke, le ndlela inemibi yokuqhekeka noma ukuqhekeka konqenqema lwe-chip encane. Ngaphezu kwalokho, njengoba ama-burrs endaweni yensimbi engasuswanga ngokuphelele, indawo enqunyiwe nayo inzima kakhulu.
Ukuze kuxazululwe le nkinga, indlela yokusika "Scribing" yaba khona, okungukuthi, ngaphambi "kokuphuka", ingaphezuluisilucwecwanaisikwe cishe ingxenye yokujula. "Ukubhala", njengoba igama liphakamisa, kubhekisela ekusebenziseni i-impeller ukuze ubone (ukusika uhhafu) uhlangothi olungaphambili lwe-wafer kusengaphambili. Ezinsukwini zokuqala, ama-wafers amaningi angaphansi kwama-intshi angu-6 asebenzisa le ndlela yokusika yokuqala "ukusika" phakathi kwama-chips bese "ukuphuka".
I-Blade Dicing noma i-Blade Sawing
Indlela yokusika ethi “Scribing” yakhula kancane kancane yaba indlela “yokusika i-Blade dicing” (noma yokusaha), okuyindlela yokusika usebenzisa i-blade izikhathi ezimbili noma ezintathu zilandelana. Indlela yokusika ye-"Blade" ingenza into eyenzeka kuma-chips amancane axebukayo lapho "ephuka" ngemuva "kokubhala", futhi ingavikela ama-chips amancane ngesikhathi senqubo "yokuhlukanisa". Ukusika "i-blade" kuhluke ekusikeni "kwe-dicing" yangaphambilini, okungukuthi, ngemuva kokusika "i-blade", akuyona "ukuphuka", kodwa ukusika futhi nge-blade. Ngakho-ke, ibizwa nangokuthi "isinyathelo sokudayela" indlela.
Ukuze uvikele i-wafer emonakalweni wangaphandle phakathi nenqubo yokusika, ifilimu izosetshenziswa ku-wafer kusengaphambili ukuze kuqinisekiswe "ukucula" okuphephile. Phakathi nenqubo "yokugaya emuva", ifilimu izoxhunywa ngaphambili kwe-wafer. Kodwa ngokuphambene nalokho, ekusikeni "kwe-blade", ifilimu kufanele ifakwe ngemuva kwe-wafer. Ngesikhathi se-eutectic die bonding (i-die bonding, ukulungisa ama-chips ahlukanisiwe ku-PCB noma ifreyimu engashintshi), ifilimu enamathiselwe ngemuva izowa ngokuzenzakalelayo. Ngenxa yokungqubuzana okuphezulu ngesikhathi sokusika, amanzi e-DI kufanele afuthwe ngokuqhubekayo kuzo zonke izinkomba. Ngaphezu kwalokho, i-impeller kufanele ihlanganiswe nezinhlayiya zedayimane ukuze izingcezu zingasikwa kangcono. Ngalesi sikhathi, ukusika (ukushuba kwe-blade: ububanzi be-groove) kufanele kube iyunifomu futhi akumele kudlule ububanzi be-dicing groove.
Sekuyisikhathi eside, ukusika kube yindlela yokusika yendabuko esetshenziswa kakhulu. Inzuzo yayo enkulu ukuthi ingakwazi ukusika inani elikhulu lama-wafers ngesikhathi esifushane. Kodwa-ke, uma isivinini sokuphakela socezu sanda kakhulu, amathuba okuxebuka konqenqema lwe-chiplet azokhula. Ngakho-ke, inani lokujikeleza kwe-impeller kufanele lilawulwe izikhathi ezingaba ngu-30,000 ngomzuzu. Kungabonakala ukuthi ubuchwepheshe benqubo ye-semiconductor ngokuvamile buyimfihlo eqoqwe kancane kancane phakathi nesikhathi eside sokuqoqwa kanye nokuhlolwa kanye namaphutha (esigabeni esilandelayo se-eutectic bonding, sizoxoxa ngokuqukethwe mayelana nokusika kanye ne-DAF).
Ukudayela ngaphambi kokugaya (DBG): ukulandelana kokusika kushintshe indlela
Uma ukusika kwe-blade kwenziwa ku-wafer engu-8-intshi ububanzi, asikho isidingo sokukhathazeka ngokuxebuka konqenqema lwe-chiplet noma ukuqhekeka. Kodwa njengoba i-diameter ye-wafer ikhula ibe amayintshi angu-21 futhi ukujiya kuba mncane kakhulu, izenzakalo ezixebukayo neziqhekeka ziqala ukuvela futhi. Ukuze kuncishiswe kakhulu umthelela womzimba ku-wafer ngesikhathi sokusika, indlela ye-DBG "yokugaya ngaphambi kokugaya" ithatha indawo yokulandelana kokusika kwendabuko. Ngokungafani nendlela evamile yokusika "i-blade" esika ngokuqhubekayo, i-DBG iqala ngokusika "i-blade", bese inciphisa kancane kancane ugqinsi lwe-wafer ngokuqhubeka nokunciphisa uhlangothi olungemuva kuze kube yilapho i-chip ihlukaniswa. Kungashiwo ukuthi i-DBG inguqulo ethuthukisiwe yendlela yokusika "i-blade" yangaphambilini. Ngenxa yokuthi inganciphisa umthelela wokusikwa kwesibili, indlela ye-DBG seyenziwe yaduma ngokushesha “ekufakweni kwe-wafer-level”.
I-Laser Dicing
Inqubo ye-wafer-level chip scale package (WLCSP) isebenzisa ngokuyinhloko ukusika nge-laser. Ukusika i-laser kunganciphisa izenzakalo ezinjengokuxebuka nokuqhekeka, ngaleyo ndlela kutholwe ama-chips ekhwalithi engcono, kodwa lapho ubukhulu be-wafer bungaphezu kuka-100μm, ukukhiqiza kuzoncipha kakhulu. Ngakho-ke, isetshenziswa kakhulu kuma-wafers anogqinsi olungaphansi kuka-100μm (amancane uma kuqhathaniswa). Ukusika i-laser kusike i-silicon ngokusebenzisa i-laser enamandla kakhulu endaweni yokubhala ye-wafer. Kodwa-ke, lapho usebenzisa indlela yokusika ye-laser evamile (i-Conventional Laser), ifilimu yokuvikela kufanele ifakwe endaweni eyi-wafer kusenesikhathi. Ngenxa yokuthi ukushisa noma ukukhanyisela ingaphezulu lewafa nge-laser, laba othintana nabo abangokwenyama bazoveza ama-grooves ebusweni be-wafer, futhi izingcezu ze-silicon ezisikiwe nazo zizonamathela phezulu. Kungabonakala ukuthi indlela yokusika ye-laser yendabuko iphinde isike ngokuqondile ingaphezulu le-wafer, futhi kulokhu, kufana nendlela yokusika "i-blade".
I-Stealth Dicing (SD) iyindlela yokuqala ukusika ingaphakathi lewafa ngamandla e-laser, bese usebenzisa ingcindezi yangaphandle kutheyiphu enamathiselwe ngemuva ukuze uyiphule, ngaleyo ndlela uhlukanise i-chip. Uma ingcindezi isetshenziswa ku-tape ngemuva, i-wafer izophakanyiswa ngokushesha phezulu ngenxa yokwelula kwe-tape, ngaleyo ndlela ihlukanise i-chip. Izinzuzo ze-SD ngaphezu kwendlela yokusika ye-laser yendabuko yilezi: okokuqala, ayikho imfucumfucu ye-silicon; okwesibili, i-kerf (i-Kerf: ububanzi be-groove yababhali) incane, ngakho-ke ama-chips amaningi angatholakala. Ngaphezu kwalokho, ukuxebuka nokuqhekeka kuzoncishiswa kakhulu kusetshenziswa indlela ye-SD, ebaluleke kakhulu kwikhwalithi yonke yokusika. Ngakho-ke, indlela ye-SD kungenzeka kakhulu ukuthi ibe ubuchwepheshe obudume kakhulu ngokuzayo.
I-Plasma Dicing
Ukusika i-Plasma ubuchwepheshe obusanda kuthuthukiswa obusebenzisa i-plasma etching ukusika ngesikhathi senqubo yokukhiqiza (Fab). Ukusika i-Plasma kusebenzisa izinto ze-semi-gas esikhundleni soketshezi, ngakho umthelela endaweni mncane uma kuqhathaniswa. Futhi indlela yokusika yonke i-wafer ngesikhathi esisodwa iyamukelwa, ngakho-ke isivinini "sokusika" sishesha kakhulu. Kodwa-ke, indlela ye-plasma isebenzisa igesi yokusabela ngamakhemikhali njengento eluhlaza, futhi inqubo yokufaka iyinkimbinkimbi kakhulu, ngakho-ke ukugeleza kwayo kuyinkimbinkimbi. Kodwa uma kuqhathaniswa nokusika “i-blade” kanye nokusikwa kwe-laser, ukusika kwe-plasma akubangeli monakalo endaweni eyi-wafer, ngaleyo ndlela kunciphisa izinga lokukhubazeka futhi kutholwe ama-chips amaningi.
Muva nje, njengoba ubukhulu be-wafer buncishisiwe baba ngu-30μm, futhi kusetshenziswe ithusi eningi (Cu) noma izinto ezihlala njalo ze-dielectric (Low-k). Ngakho-ke, ukuze kuvinjelwe ama-burrs (Burr), izindlela zokusika i-plasma nazo zizovunyelwa. Yiqiniso, ubuchwepheshe bokusika i-plasma buhlala buthuthuka. Ngikholelwa ukuthi esikhathini esizayo esiseduze, ngolunye usuku ngeke kube nesidingo sokugqoka imaski ekhethekile lapho ubhala, ngoba lokhu kuyisiqondiso esikhulu sokuthuthukiswa kokusika kwe-plasma.
Njengoba ukushuba kwama-wafers kuye kwancishiswa ngokuqhubekayo kusuka ku-100μm kuya ku-50μm bese kuya ku-30μm, izindlela zokusika zokuthola ama-chips azimele nazo bezilokhu zishintsha futhi zithuthuka kusukela ekusikeni "kwephuka" kanye "ne-blade" kuya ekusikeni kwe-laser nokusika i-plasma. Nakuba izindlela zokusika ezikhula ngokuvuthwa ziye zandisa izindleko zokukhiqiza zenqubo yokusika ngokwayo, ngakolunye uhlangothi, ngokunciphisa kakhulu izinto ezingathandeki ezifana nokuxebuka nokuqhekeka okuvame ukwenzeka ekusikeni kwe-semiconductor chip nokwandisa inani lama-chips atholakala ngeyunithi ngayinye ye-wafer. , izindleko zokukhiqiza ze-chip eyodwa zibonise ukwehla. Vele, ukwanda kwenani lama-chips atholwe endaweni ngayinye ye-wafer kuhlobene kakhulu nokwehliswa kobubanzi bomgwaqo wokudayela. Ngokusetshenziswa kwe-plasma cutting, cishe ama-chips angu-20% angatholakala uma kuqhathaniswa nokusebenzisa indlela yokusika "i-blade", okuyisizathu esikhulu futhi esenza abantu bakhethe ukusika i-plasma. Ngokuthuthuka kanye nezinguquko zama-wafers, ukubukeka kwe-chip nezindlela zokupakisha, izinqubo ezihlukahlukene zokusika ezifana nobuchwepheshe bokucubungula ama-wafer kanye ne-DBG nazo ziyavela.
Isikhathi sokuthumela: Oct-10-2024