I-waferukusika kungenye yezixhumanisi ezibalulekile ekukhiqizeni kwe-semiconductor yamandla. Lesi sinyathelo siklanyelwe ukuhlukanisa ngokunembile amasekhethi ahlanganisiwe angawodwana noma ama-chips kumawafa we-semiconductor.
Isihluthulelo sokuisilucwecwanaukusika kungukukwazi ukuhlukanisa ama-chips ngamanye ngenkathi uqinisekisa ukuthi izakhiwo ezintekenteke namasekethe ashunyekiweisilucwecwanaazilimele. Ukuphumelela noma ukwehluleka kwenqubo yokusika akuthinti nje kuphela ikhwalithi yokuhlukanisa kanye nesivuno se-chip, kodwa futhi kuhlobene ngokuqondile nokusebenza kahle kwayo yonke inqubo yokukhiqiza.
▲ Izinhlobo ezintathu ezijwayelekile zokusika i-wafer | Umthombo: KLA CHINA
Okwamanje, ezivamileisilucwecwanaizinqubo zokusika zihlukaniswa zibe:
Ukusika i-blade: izindleko eziphansi, ngokuvamile ezisetshenziselwa ukushubaizinkwa eziwucwecwe
Ukusika i-Laser: izindleko eziphezulu, ngokuvamile ezisetshenziselwa ama-wafers anogqinsi olungaphezu kuka-30μm
Ukusika i-Plasma: izindleko eziphezulu, imikhawulo eyengeziwe, imvamisa isetshenziselwa ama-wafers anogqinsi olungaphansi kwama-30μm
Ukusika i-Mechanical blade
Ukusika i-blade kuyinqubo yokusika eduze komugqa wababhali ngediski yokugaya egijima ngesivinini esikhulu (i-blade). I-blade ngokuvamile yenziwe ngezinto zedayimane ezilumayo noma ezacile kakhulu, ezifanele ukusika noma ukugoba kumawafa e-silicon. Kodwa-ke, njengendlela yokusika ngomshini, ukusika i-blade kuncike ekukhishweni kwezinto ezibonakalayo, okungaholela kalula ekuchotsheni noma ekuqhekekeni konqenqema lwe-chip, ngaleyo ndlela kuthinte ikhwalithi yomkhiqizo nokunciphisa isivuno.
Izinga lomkhiqizo wokugcina okhiqizwa inqubo yokusaha ngomshini lithintwa imingcele eminingi, okuhlanganisa isivinini sokusika, ukujiya kwe-blade, ububanzi be-blade, nesivinini sokuzungezisa i-blade.
Ukusika okugcwele kuyindlela eyisisekelo kakhulu yokusika i-blade, enqamula ngokuphelele ucezu lokusebenza ngokusika endaweni engaguquki (njenge-tape yokusika).
▲ I-Mechanical blade cut-full cut | Inethiwekhi yomthombo wesithombe
Ukusika isigamu kuyindlela yokucubungula ekhiqiza i-groove ngokusika phakathi nendawo yokusebenza. Ngokuqhubeka nokwenza inqubo ye-grooving, amaphuzu ekamu kanye nenaliti angakhiqizwa.
▲ I-Mechanical blade cut-half cut | Inethiwekhi yomthombo wesithombe
Ukusika kabili kuyindlela yokucubungula esebenzisa isaha lokusika eliphindwe kabili elinama-spindle amabili ukwenza ukusikeka okugcwele noma uhhafu emigqeni yokukhiqiza emibili ngesikhathi esisodwa. Isaha eliphindwe kabili lokusika linezimbazo ezimbili zokuphotha. Ukusebenza okuphezulu kungafinyelelwa ngale nqubo.
▲ I-Mechanical blade cut-double cut | Inethiwekhi yomthombo wesithombe
Isinyathelo sokusika sisebenzisa isaha sokusika kabili esinamaphinifa amabili okuphotha ukwenza ukusikeka okugcwele nohhafu ngezigaba ezimbili. Sebenzisa ama-blade alungiselelwe ukusika isendlalelo sezintambo ebusweni be-wafer nama-blade alungiselelwe ikristalu eyodwa ye-silicon esele ukuze uzuze ukucutshungulwa kwekhwalithi ephezulu.
▲ Ukusika i-blade ngomshini – ukusika isinyathelo | Inethiwekhi yomthombo wesithombe
Ukusika i-Bevel kuyindlela yokucubungula esebenzisa i-blade enomkhawulo omise okwe-V onqenqemeni olusike uhhafu ukuze usike isinkwa esilucwecwana ngezigaba ezimbili phakathi nenqubo yokusika isinyathelo. Inqubo ye-chamfering yenziwa ngesikhathi sokusika. Ngakho-ke, amandla esikhunta aphezulu kanye nokucubungula okuphezulu kungafinyelelwa.
▲ Ukusika i-bevel | Inethiwekhi yomthombo wesithombe
Ukusika i-laser
Ukusika i-laser ubuchwepheshe bokusika obungathinteki obusebenzisa i-laser beam egxilile ukuhlukanisa ama-chips ngamanye kuma-wafers we-semiconductor. I-laser enamandla amakhulu igxile ebusweni be-wafer bese iyahwamuka noma isuse izinto ezihambisana nomugqa wokusika onqunywe kusengaphambili ngezinqubo zokubola noma zokubola okushisayo.
▲ Umdwebo wokusika i-laser | Umthombo wesithombe: KLA CHINA
Izinhlobo zamalaser asetshenziswa kabanzi okwamanje zifaka amalaser e-ultraviolet, ama-laser e-infrared, namalaser e-femtosecond. Phakathi kwazo, ama-laser e-ultraviolet avame ukusetshenziselwa ukukhipha okubandayo okunembile ngenxa yamandla awo aphezulu e-photon, futhi indawo ethinteke ukushisa incane kakhulu, enganciphisa ngempumelelo ingozi yokulimala okushisayo kwe-wafer nama-chips azungezile. Ama-laser e-infrared afaneleka kangcono ama-wafer aminyene ngoba angangena ajule ezintweni. Ama-laser e-Femtosecond afinyelela ukususwa kwezinto ezibonakalayo ezinembayo nezisebenzayo ngokudluliswa kokushisa okucishe kunganakwa ngokusebenzisa ama-ultrashort light pulses.
Ukusika i-laser kunezinzuzo ezibalulekile ngaphezu kokusika kwe-blade yendabuko. Okokuqala, njengenqubo engeyona yokuxhumana, ukusika kwe-laser akudingi ukucindezelwa ngokomzimba ku-wafer, ukunciphisa ukuhlukana nokuqhekeka kwezinkinga ezivamile ekusikeni komshini. Lesi sici senza i-laser cutting ifaneleke ikakhulukazi ukucubungula ama-wafers athambile noma amancane kakhulu, ikakhulukazi lawo anezakhiwo eziyinkimbinkimbi noma izici ezinhle.
▲ Umdwebo wokusika i-laser | Inethiwekhi yomthombo wesithombe
Ukwengeza, ukunemba okuphezulu nokunemba kokusika kwe-laser kuyenza ikwazi ukugxilisa umsebe we-laser kusayizi wendawo omncane kakhulu, isekele amaphethini okusika ayinkimbinkimbi, futhi izuze ukuhlukaniswa kwesikhala esincane phakathi kwama-chips. Lesi sici sibaluleke kakhulu kumadivayisi e-semiconductor athuthukile anosayizi abanciphayo.
Kodwa-ke, ukusika kwe-laser nakho kunemikhawulo ethile. Uma iqhathaniswa nokusikwa kwe-blade, ihamba kancane futhi ibiza kakhulu, ikakhulukazi ekukhiqizeni okukhulu. Ngaphezu kwalokho, ukukhetha uhlobo olulungile lwe-laser nokuthuthukisa amapharamitha ukuze kuqinisekiswe ukususwa kwezinto ezisebenzayo kanye nendawo encane ethinteke ukushisa kungaba inselele ezintweni ezithile nobukhulu.
Ukusika kwe-Laser ablation
Ngesikhathi sokusika i-laser ablation, i-laser beam igxile ngokunembile endaweni ecacisiwe ebusweni be-wafer, futhi amandla e-laser aqondiswa ngokwephethini yokusika enqunywe kusengaphambili, kancane kancane inqamule i-wafer iye phansi. Ngokuya ngezidingo zokusika, lokhu kusebenza kwenziwa kusetshenziswa i-pulsed laser noma i-wave wave laser eqhubekayo. Ukuze uvimbele ukulimala kwe-wafer ngenxa yokushisisa okweqile kwendawo kwe-laser, amanzi okupholisa asetshenziselwa ukupholisa phansi nokuvikela i-wafer emonakalweni oshisayo. Ngesikhathi esifanayo, amanzi okupholisa angakwazi futhi ukususa ngokuphumelelayo izinhlayiya ezikhiqizwa ngesikhathi sokusika, ukuvimbela ukungcola nokuqinisekisa ikhwalithi yokusika.
Ukusika okungabonakali kwe-Laser
I-laser ingaphinde igxile ekudluliseni ukushisa emzimbeni oyinhloko we-wafer, indlela ebizwa ngokuthi "i-laser cutting engabonakali". Ngale ndlela, ukushisa okuvela ku-laser kudala izikhala emigqeni yababhali. Lezi zindawo ezibuthakathaka zibe sezifinyelela umphumela ofanayo wokungena ngokuphuka lapho i-wafer yeluliwe.
▲Inqubo eyinhloko yokusika okungabonakali kwe-laser
Inqubo yokusika engabonakali iyinqubo ye-laser yokumuncwa yangaphakathi, kunokuba i-laser ablation lapho i-laser imuncwa phezulu. Ngokusikwa okungabonakali, kusetshenziswa amandla e-laser beam enobude begagasi obungafihli lutho ku-wafer substrate material. Inqubo ihlukaniswe ngezinyathelo ezimbili eziyinhloko, eyodwa inqubo esekelwe laser, kanti enye inqubo yokuhlukanisa ngomshini.
▲ I-laser beam idala ukubhoboza ngaphansi kwendawo eyiluphala, futhi izinhlangothi zangaphambili nezangemuva azithinteki | Inethiwekhi yomthombo wesithombe
Esinyathelweni sokuqala, njengoba i-laser beam iskena isicwecwe, i-laser beam igxila endaweni ethile ngaphakathi kwe-wafer, yakhe indawo yokuqhekeka ngaphakathi. Amandla e-beam abangela uchungechunge lwemifantu ukuthi yakheke ngaphakathi, okungakanwebeki kubo bonke ugqinsi lwe-wafer ukuya phezulu nangaphansi.
▲Ukuqhathaniswa kwamawafa e-silicon angu-100μm asikwe ngendlela ye-blade kanye nendlela yokusika engabonakali ye-laser | Inethiwekhi yomthombo wesithombe
Esinyathelweni sesibili, i-chip tape engaphansi kwe-wafer inwetshwa ngokomzimba, okubangela ukucindezeleka okuqinile emifantwini engaphakathi kwe-wafer, ebangelwa inqubo ye-laser esinyathelweni sokuqala. Lokhu kucindezeleka kubangela ukuthi imifantu inwebe iqonde phezulu nendawo ephansi ye-wafer, bese ihlukanisa i-wafer ibe ama-chips kulawa maphuzu okusika. Ekusikeni okungabonakali, ukusika uhafu noma ukusika uhafu ohlangothini olungezansi kuvame ukusetshenziselwa ukusiza ukuhlukaniswa kwama-wafers abe ama-chips noma ama-chips.
Izinzuzo ezibalulekile zokusika i-laser engabonakali ngaphezu kokukhishwa kwe-laser:
• Asikho isipholisi esidingekayo
• Akukho doti ekhiqizwayo
• Awekho amazoni athinteke ekushiseni angalimaza amasekhethi azwelayo
Ukusika i-Plasma
Ukusika i-Plasma (okubuye kwaziwe ngokuthi i-plasma etching noma i-etching eyomile) ubuchwepheshe bokusika obuyisicwecwana obuthuthukisiwe obusebenzisa i-ion etching esebenzayo (RIE) noma i-deep reactive ion etching (DRIE) ukuhlukanisa ama-chips ngamanye kumawafa ama-semiconductor. Ubuchwepheshe bufinyelela ukusika ngokususa izinto ngamakhemikhali emigqeni yokusika enqunywe kusengaphambili kusetshenziswa i-plasma.
Phakathi nenqubo yokusika i-plasma, i-wafer ye-semiconductor ifakwa ekamelweni le-vacuum, ingxube yegesi esebenzayo elawulwayo ifakwa ekamelweni, futhi insimu kagesi isetshenziswa ukuze kukhiqizwe i-plasma equkethe ukuhlushwa okuphezulu kwama-ion asebenzayo nama-radicals. Lezi zinhlobo zezilwane ezisebenzayo zisebenzisana ne-wafer material futhi ngokukhetha zisusa izinto ezilucwecwana emugqeni wababhali ngenhlanganisela yokusabela kwamakhemikhali kanye nokufafaza komzimba.
Inzuzo eyinhloko yokusika i-plasma ukuthi kunciphisa ukucindezeleka komshini ku-wafer kanye ne-chip futhi kunciphisa umonakalo ongaba khona obangelwa ukuthintana ngokomzimba. Kodwa-ke, le nqubo iyinkimbinkimbi kakhulu futhi idla isikhathi kunezinye izindlela, ikakhulukazi lapho usebenza nama-wafers aminyene noma izinto ezinokumelana okuphezulu kwe-etching, ngakho-ke ukusetshenziswa kwayo ekukhiqizeni ngobuningi kunomkhawulo.
▲Inethiwekhi yomthombo wesithombe
Ekwenziweni kwe-semiconductor, indlela yokusika i-wafer idinga ukukhethwa ngokusekelwe ezintweni eziningi, okuhlanganisa izakhiwo ze-wafer material, usayizi we-chip kanye nejometri, ukunemba okudingekayo nokunemba, kanye nezindleko zokukhiqiza zizonke kanye nokusebenza kahle.
Isikhathi sokuthumela: Sep-20-2024