Izinto ezikhethwayo zezingxenye ezinembayo zemishini ye-photolithography
Emkhakheni we-semiconductor,i-silicon carbide ceramicizinto zokwakha zisetshenziswa kakhulu kumishini ebalulekile yokukhiqiza isekethe edidiyelwe, njenge-silicon carbide worktable, ama-rails okuqondisa,izibonisi, i-ceramic suction chuck, izingalo, amadiski okugaya, izinto ezilungiswayo, njll. zemishini ye-lithography.
Izingxenye ze-silicon carbide ceramicye-semiconductor kanye nemishini yokubona
● I-Silicon carbide yokugaya i-ceramic disc. Uma i-disc yokugaya yenziwe nge-cast iron noma i-carbon steel, impilo yayo yesevisi ifushane futhi i-coefficient yayo yokwandisa okushisayo inkulu. Ngesikhathi sokucutshungulwa kwama-wafers e-silicon, ikakhulukazi ngesikhathi sokugaya noma ukupholishwa ngesivinini esiphezulu, ukuguga nokuguquka okushisayo kwediski yokugaya kwenza kube nzima ukuqinisekisa ukucaba nokuhambisana kwe-silicon wafer. Idiski yokugaya eyenziwe nge-silicon carbide ceramics inobulukhuni obuphezulu nokuguga okuphansi, futhi i-coefficient yokwandisa okushisayo iyafana naleyo yama-wafers e-silicon, ngakho-ke ingagaywa futhi ipholishwe ngesivinini esikhulu.
● I-silicon carbide ceramic fixture. Ukwengeza, lapho ama-wafers e-silicon ekhiqizwa, adinga ukuphathwa ngokushisa okushisayo futhi avame ukuhanjiswa kusetshenziswa izinto ze-silicon carbide. Azikwazi ukumelana nokushisa futhi azikonakali. Ikhabhoni efana nedayimane (i-DLC) nezinye izinto zokumboza zingafakwa phezulu ukuze kuthuthukiswe ukusebenza, kuncishiswe umonakalo ocekeceke, futhi kuvinjwe ukubhebhetheka kokungcola.
● Ithebula lokusebenza le-silicon carbide. Ukuthatha i-worktable emshinini we-lithography njengesibonelo, ithebula lokusebenza libophezelekile ngokuyinhloko ukuqedela ukunyakaza kokuchayeka, okudinga ukunyakaza okunesivinini esikhulu, ukushaywa okukhulu, amadigri ayisithupha enkululeko ye-nano-level ultra-precision movement. Isibonelo, emshinini we-lithography onesixazululo esingu-100nm, ukunemba kwembondela okungu-33nm, nobubanzi bomugqa obuyi-10nm, ukunemba kokuma okusebenzayo kuyadingeka ukuze kufinyelele ku-10nm, isicwecwana se-mask-silicon sokunyathela ngasikhathi sinye kanye nesivinini sokuskena singu-150nm/s. kanye no-120nm/s ngokulandelana, futhi isivinini sokuskena imaski siseduze no-500nm/s, futhi ithebula lokusebenza liyadingeka ukuze libe nokunemba okuphezulu kakhulu nokuzinza.
Umdwebo wohlelo lwethebula le-worktable kanye ne-micro-motion (isigaba esiyingxenye)
● Isibuko sesikwele se-silicon carbide ceramic. Izingxenye ezibalulekile kumishini yesekethe edidiyelwe eyinhloko efana nemishini ye-lithography inomumo oyinkimbinkimbi, ubukhulu obuyinkimbinkimbi, nezakhiwo ezingenalutho ezingasindi, okwenza kube nzima ukulungiselela izingxenye ezinjalo ze-silicon carbide ceramic. Njengamanje, abakhiqizi bemishini yesekethe edidiyelwe yamazwe ngamazwe, njenge-ASML eNetherlands, i-NIKON ne-CanON eJapane, basebenzisa inani elikhulu lezinto ezifana nengilazi ye-microcrystalline ne-cordierite ukulungisa izibuko eziyisikwele, izingxenye eziyinhloko zemishini ye-lithography, nokusebenzisa i-silicon carbide. izitsha zobumba ukuze kulungiswe ezinye izingxenye zesakhiwo ezisebenza kahle ezinobumo obulula. Kodwa-ke, ochwepheshe abavela e-China Building Materials Research Institute baye basebenzisa ubuchwepheshe bokulungiselela ubunikazi ukuze bafeze ukulungiswa kobukhulu obukhulu, obuyinkimbinkimbi, obungasindi kakhulu, obuvaleleke ngokugcwele izibuko zesikwele se-silicon carbide ceramic kanye nezinye izingxenye ze-optical ezihlelekile nezisebenzayo zemishini ye-lithography.
Isikhathi sokuthumela: Oct-10-2024