Iyi 6 Inch N Type SiC Wafer yakagadzirirwa kukwidziridzwa kuita mumamiriro akanyanya, zvichiita kuti ive sarudzo yakanaka kune maapplication anoda simba repamusoro uye tembiricha kuramba. Zvigadzirwa zvakakosha zvine chekuita neiyi wafer zvinosanganisira Si Wafer, SiC Substrate, SOI Wafer, uye SiN Substrate. Zvishandiso izvi zvinogonesa kuita kwakaringana mumhando dzakasiyana dzekugadzira semiconductor, zvichigonesa zvishandiso zviri zvese zvine simba uye zvinogara.
Kumakambani anoshanda neEpi Wafer, Gallium Oxide Ga2O3, Cassette, kana AlN Wafer, VET Energy's 6 Inch N Type SiC Wafer inopa hwaro hunodiwa hwekuvandudza chigadzirwa. Kunyangwe iri mumagetsi emagetsi epamusoro-soro kana ichangoburwa muRF tekinoroji, mawaferi aya anovimbisa kufambisa kwakanaka uye kushomeka kwekupisa kwemafuta, kusunda miganhu yekubudirira uye kuita.
WAFERING SECIFICATIONS
*n-Pm=n-type Pm-Giredhi,n-Ps=n-type Ps-Giredhi,Sl=Semi-lnsulating
Item | 8-Inch | 6-Inch | 4-inch | ||
nP | n-Pm | n-Mapisarema | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Bow(GF3YFCD)-Absolute Value | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
Warp(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR) -10mmx10mm | <2μm | ||||
Wafer Edge | Beveling |
SURFACE FINISH
*n-Pm=n-type Pm-Giredhi,n-Ps=n-type Ps-Giredhi,Sl=Semi-lnsulating
Item | 8-Inch | 6-Inch | 4-inch | ||
nP | n-Pm | n-Mapisarema | SI | SI | |
Surface Finish | Kaviri divi Optical Polish, Si- Face CMP | ||||
SurfaceRoughness | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
Edge Chips | Hapana Inobvumidzwa (kureba nehupamhi≥0.5mm) | ||||
Indents | Hapana Inobvumirwa | ||||
Makwara (Si-Face) | Uk.≤5,Kuwedzera | Uk.≤5,Kuwedzera | Uk.≤5,Kuwedzera | ||
Mitswe | Hapana Inobvumirwa | ||||
Kusabatanidzwa kumucheto | 3mm |