Iyo 12 inch Silicon Wafer yeSemiconductor Fabrication inopihwa neVET Energy inogadzirwa kuti isangane nemayero chaiwo anodiwa muindasitiri yesemiconductor. Seimwe yezvigadzirwa zvinotungamira mumutsara wedu, VET Energy inova nechokwadi chekuti mawaferi anogadzirwa nekunyatso kupfava, kuchena, uye mhando yepamusoro, zvichiita kuti ive yakanakira yekucheka-kumucheto semiconductor application, zvinosanganisira microchips, sensors, uye advanced electronic michina.
Iyi wafer inoenderana neyakasiyana siyana yezvinhu zvakaita seSi Wafer, SiC Substrate, SOI Wafer, SiN Substrate, uye Epi Wafer, ichipa kugona kwakasiyana-siyana kwemaitiro akasiyana ekugadzira. Pamusoro pezvo, inofamba zvakanaka nehunyanzvi hwepamberi seGallium Oxide Ga2O3 uye AlN Wafer, ichive nechokwadi chekuti inogona kubatanidzwa mukushandisa zvakanyanya. Kuti ishande yakatsetseka, iyo wafer yakagadziridzwa kuti ishandiswe neindasitiri-yakajairwa Cassette masisitimu, kuve nechokwadi chekubata kwakanaka mukugadzira semiconductor.
VET Energy's chigadzirwa mutsara haina kuganhurirwa kune silicon wafers. Isu tinopawo huwandu hwakasiyana hwema semiconductor substrate zvinhu, zvinosanganisira SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, nezvimwewo, pamwe neakafara bandgap semiconductor zvinhu zvakaita seGallium Oxide Ga2O3 uye AlN Wafer. Izvi zvigadzirwa zvinogona kusangana nezvinodiwa zvevatengi vakasiyana mumagetsi emagetsi, radio frequency, sensors uye mamwe minda.
Nzvimbo dzekushandisa:
•Logic chips:Kugadzira yepamusoro-inoshanda logic machipi akadai seCPU neGPU.
•Memory chips:Kugadzira ndangariro machipisi akadai seDRAM neNAND Flash.
•Analog chips:Kugadzira analog machipi akadai seADC neDAC.
•Sensors:MEMS sensors, mifananidzo sensors, nezvimwe.
VET Energy inopa vatengi zvigadziriso zvewafer, uye inogona kugadzirisa mawafer ane akasiyana resistivity, akasiyana okisijeni emukati, ukobvu hwakasiyana uye zvimwe zvinotsanangurwa zvinoenderana nezvinodiwa chaizvo nevatengi. Uye zvakare, isu tinopawo nyanzvi yehunyanzvi rutsigiro uye mushure mekutengesa-sevhisi kubatsira vatengi kukwirisa maitiro ekugadzira uye kugadzirisa goho rechigadzirwa.
WAFERING SECIFICATIONS
*n-Pm=n-type Pm-Giredhi,n-Ps=n-type Ps-Giredhi,Sl=Semi-lnsulating
Item | 8-Inch | 6-Inch | 4-inch | ||
nP | n-Pm | n-Mapisarema | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Bow(GF3YFCD)-Absolute Value | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
Warp(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR) -10mmx10mm | <2μm | ||||
Wafer Edge | Beveling |
SURFACE FINISH
*n-Pm=n-type Pm-Giredhi,n-Ps=n-type Ps-Giredhi,Sl=Semi-lnsulating
Item | 8-Inch | 6-Inch | 4-inch | ||
nP | n-Pm | n-Mapisarema | SI | SI | |
Surface Finish | Kaviri divi Optical Polish, Si- Face CMP | ||||
SurfaceRoughness | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
Edge Chips | Hapana Inobvumidzwa (kureba nehupamhi≥0.5mm) | ||||
Indents | Hapana Inobvumirwa | ||||
Makwara (Si-Face) | Uk.≤5,Kuwedzera | Uk.≤5,Kuwedzera | Uk.≤5,Kuwedzera | ||
Mitswe | Hapana Inobvumirwa | ||||
Kusabatanidzwa kumucheto | 3mm |