12 inch Silicon Wafer yeSemiconductor Kugadzirwa

Tsanangudzo Pfupi:

VET Energy 12-inch silicon wafers ndiwo musimboti wezvigadzirwa zveiyo semiconductor yekugadzira indasitiri. VET Energy inoshandisa tekinoroji yekukura kweCZ kuti ive nechokwadi chekuti mawafer ane mhando yekristaro yakanakisa, yakaderera density uye yakakwirira kufanana, ichipa yakasimba uye yakavimbika substrate yemidziyo yako yesemiconductor.


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Iyo 12 inch Silicon Wafer yeSemiconductor Fabrication inopihwa neVET Energy inogadzirwa kuti isangane nemayero chaiwo anodiwa muindasitiri yesemiconductor. Seimwe yezvigadzirwa zvinotungamira mumutsara wedu, VET Energy inova nechokwadi chekuti mawaferi anogadzirwa nekunyatso kupfava, kuchena, uye mhando yepamusoro, zvichiita kuti ive yakanakira yekucheka-kumucheto semiconductor application, zvinosanganisira microchips, sensors, uye advanced electronic michina.

Iyi wafer inoenderana neyakasiyana siyana yezvinhu zvakaita seSi Wafer, SiC Substrate, SOI Wafer, SiN Substrate, uye Epi Wafer, ichipa kugona kwakasiyana-siyana kwemaitiro akasiyana ekugadzira. Pamusoro pezvo, inofamba zvakanaka nehunyanzvi hwepamberi seGallium Oxide Ga2O3 uye AlN Wafer, ichive nechokwadi chekuti inogona kubatanidzwa mukushandisa zvakanyanya. Kuti ishande yakatsetseka, iyo wafer yakagadziridzwa kuti ishandiswe neindasitiri-yakajairwa Cassette masisitimu, kuve nechokwadi chekubata kwakanaka mukugadzira semiconductor.

VET Energy's chigadzirwa mutsara haina kuganhurirwa kune silicon wafers. Isu tinopawo huwandu hwakasiyana hwema semiconductor substrate zvinhu, zvinosanganisira SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, nezvimwewo, pamwe neakafara bandgap semiconductor zvinhu zvakaita seGallium Oxide Ga2O3 uye AlN Wafer. Izvi zvigadzirwa zvinogona kusangana nezvinodiwa zvevatengi vakasiyana mumagetsi emagetsi, radio frequency, sensors uye mamwe minda.

Nzvimbo dzekushandisa:
Logic chips:Kugadzira yepamusoro-inoshanda logic machipi akadai seCPU neGPU.
Memory chips:Kugadzira ndangariro machipisi akadai seDRAM neNAND Flash.
Analog chips:Kugadzira analog machipi akadai seADC neDAC.
Sensors:MEMS sensors, mifananidzo sensors, nezvimwe.

VET Energy inopa vatengi zvigadziriso zvewafer, uye inogona kugadzirisa mawafer ane akasiyana resistivity, akasiyana okisijeni emukati, ukobvu hwakasiyana uye zvimwe zvinotsanangurwa zvinoenderana nezvinodiwa chaizvo nevatengi. Uye zvakare, isu tinopawo nyanzvi yehunyanzvi rutsigiro uye mushure mekutengesa-sevhisi kubatsira vatengi kukwirisa maitiro ekugadzira uye kugadzirisa goho rechigadzirwa.

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WAFERING SECIFICATIONS

*n-Pm=n-type Pm-Giredhi,n-Ps=n-type Ps-Giredhi,Sl=Semi-lnsulating

Item

8-Inch

6-Inch

4-inch

nP

n-Pm

n-Mapisarema

SI

SI

TTV(GBIR)

≤6um

≤6um

Bow(GF3YFCD)-Absolute Value

≤15μm

≤15μm

≤25μm

≤15μm

Warp(GF3YFER)

≤25μm

≤25μm

≤40μm

≤25μm

LTV(SBIR) -10mmx10mm

<2μm

Wafer Edge

Beveling

SURFACE FINISH

*n-Pm=n-type Pm-Giredhi,n-Ps=n-type Ps-Giredhi,Sl=Semi-lnsulating

Item

8-Inch

6-Inch

4-inch

nP

n-Pm

n-Mapisarema

SI

SI

Surface Finish

Kaviri divi Optical Polish, Si- Face CMP

SurfaceRoughness

(10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm

Edge Chips

Hapana Inobvumidzwa (kureba nehupamhi≥0.5mm)

Indents

Hapana Inobvumirwa

Makwara (Si-Face)

Uk.≤5,Kuwedzera
Kureba≤0.5×wafer dhayamita

Uk.≤5,Kuwedzera
Kureba≤0.5×wafer dhayamita

Uk.≤5,Kuwedzera
Kureba≤0.5×wafer dhayamita

Mitswe

Hapana Inobvumirwa

Kusabatanidzwa kumucheto

3mm

tech_1_2_size
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