O le 12 inisi Silicon Wafer mo Semiconductor Fabrication ofo mai e le VET Energy ua fa'ainisinia e fa'afetaui tulaga sa'o mana'omia i le semiconductor industry. I le avea ai o se tasi o oloa taʻutaʻua i totonu o la matou laina, VET Energy faʻamautinoaina o loʻo gaosia nei meaʻai ma le saʻo saʻo, mama, ma le lelei o luga, ma faʻaogaina lelei mo faʻaoga semiconductor pito sili ona lata mai, e aofia ai microchips, sensors, ma masini faʻaeletoroni.
O lenei wafer e fetaui lelei ma le tele o mea e pei o Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, ma Epi Wafer, e maua ai le faʻaogaina lelei mo faiga faʻavae eseese. E le gata i lea, e fetaui lelei ma tekonolosi faʻapitoa e pei o Gallium Oxide Ga2O3 ma AlN Wafer, faʻamautinoa e mafai ona tuʻufaʻatasia i totonu o faʻaoga faʻapitoa. Mo le fa'agaioiga lelei, o le wafer e fa'amalieina mo le fa'aogaina i faiga fa'a-Kaseti fa'apitoa fa'apisinisi, fa'amautinoaina le fa'atinoina lelei i le gaosiga o semiconductor.
Ole laina ole oloa ole VET Energy e le fa'atapula'aina ile u'u masi fa'a'oloa. Matou te tuʻuina atu foʻi le tele o mea faʻapipiʻi semiconductor substrate, e aofia ai le SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, ma isi, faʻapea foʻi ma mea fou faʻapipiʻi semiconductor e pei o Gallium Oxide Ga2O3 ma AlN Wafer. O nei oloa e mafai ona faʻamalieina manaʻoga o tagata faʻatau eseese ile eletise eletise, leitio, masini ma isi matāʻupu.
Vaega o talosaga:
•Tala fa'atatau:Fausiaina o tupe meataalo maualuga-faatinoga pei ole PPU ma le GPU.
•meataalo manatua:Le gaosiga o meataalo manatua e pei ole DRAM ma le NAND Flash.
•tupe meataalo analog:Fausiaina o meataalo analog e pei ole ADC ma le DAC.
•Sensors:MEMS sensors, ata fa'atusa, ma isi.
O le VET Energy e tu'uina atu ai i tagata fa'atau ni fa'aputuga fa'apitoa, ma e mafai ona fa'avasegaina wafers ma fa'afete'ese'ese eseese, ese'ese mea okesene, eseese mafiafia ma isi fa'amatalaga e tusa ai ma mana'oga patino o tagata fa'atau. E le gata i lea, matou te tuʻuina atu foʻi le lagolago faʻapitoa faʻapolofesa ma le maeʻa ona faʻatau atu auaunaga e fesoasoani ai i tagata faʻatau e faʻamalieina le gaosiga o gaosiga ma faʻaleleia le gaosiga o oloa.
FAAMATALAGA WAFERING
*n-Pm=n-ituaiga Pm-Vaega,n-Ps=n-ituaiga Ps-Vaega,Sl=Semi-lnsulating
Aitema | 8-Inisi | 6-Inisi | 4-Inisi | ||
nP | n-Pm | n-Sa | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Aufana(GF3YFCD)-Taua atoatoa | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
A'ai(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR)-10mmx10mm | <2μm | ||||
Wafer Edge | Fa'ata'oto |
FA'ATA'U LUGA
*n-Pm=n-ituaiga Pm-Vaega,n-Ps=n-ituaiga Ps-Vaega,Sl=Semi-lnsulating
Aitema | 8-Inisi | 6-Inisi | 4-Inisi | ||
nP | n-Pm | n-Sa | SI | SI | |
Fa'ai'uga | Itulua Optical Polish, Si- Face CMP | ||||
Lau'ele'ele | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
Tipi Chips | Leai se Fa'ataga (umi ma le lautele≥0.5mm) | ||||
Indents | Leai se Fa'ataga | ||||
Manu'ese(Si-Fua'i) | Qty.≤5, Fa'aopoopo | Qty.≤5, Fa'aopoopo | Qty.≤5, Fa'aopoopo | ||
Ta'eta'ei | Leai se Fa'ataga | ||||
Tuusaunoaga Tupito | 3mm |