Ibice 12 bya Silicon Wafer kubikoresho bya Semiconductor bitangwa na VET Energy byakozwe kugirango byuzuze ibipimo nyabyo bisabwa mu nganda zikoresha. Nka kimwe mu bicuruzwa biza ku isonga mu murongo wacu, ingufu za VET zemeza ko izo waferi zakozwe hamwe n’uburinganire bwuzuye, ubuziranenge, hamwe n’ubuziranenge bw’ubuso, bigatuma biba byiza mu bikoresho bigezweho, harimo microchips, sensor, hamwe n’ibikoresho bya elegitoroniki bigezweho.
Iyi wafer irahujwe nibikoresho byinshi nka Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, na Epi Wafer, itanga ibintu byinshi muburyo butandukanye bwo guhimba. Byongeye kandi, ihuza neza na tekinoroji igezweho nka Gallium Oxide Ga2O3 na AlN Wafer, ikemeza ko ishobora kwinjizwa mubikorwa byihariye. Kugirango imikorere ikorwe neza, wafer itezimbere kugirango ikoreshwe na sisitemu ya Cassette yinganda-nganda, itume ikora neza mubikorwa bya semiconductor.
Umurongo wibicuruzwa bya VET ntabwo bigarukira gusa kuri wafer ya silicon. Dutanga kandi ibikoresho byinshi bya semiconductor substrate, harimo SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, nibindi, hamwe nibikoresho bishya bigari bya semiconductor nka Gallium Oxide Ga2O3 na AlN Wafer. Ibicuruzwa birashobora guhaza ibyifuzo byabakiriya batandukanye mumashanyarazi ya elegitoroniki, radiyo yumurongo, sensor hamwe nizindi nzego.
Ahantu ho gusaba:
•Imvugo yumvikana:Gukora ibicuruzwa bikora neza cyane nka CPU na GPU.
•Imashini yibuka:Gukora chip yibikoresho nka DRAM na NAND Flash.
•Ibishushanyo bisa:Gukora ibishushanyo bisa nka ADC na DAC.
•Sensors:Ibyuma bya MEMS, ibyuma bifata amashusho, nibindi.
Ingufu za VET zitanga abakiriya ibisubizo byabigenewe byabigenewe, kandi birashobora guhitamo wafer ifite imbaraga zitandukanye, ibintu bitandukanye bya ogisijeni, ubunini butandukanye nibindi bisobanuro ukurikije ibyo abakiriya bakeneye. Mubyongeyeho, dutanga kandi inkunga ya tekiniki yumwuga na serivisi nyuma yo kugurisha kugirango dufashe abakiriya kunoza imikorere yumusaruro no kuzamura umusaruro wibicuruzwa.
KUBONA UMWIHARIKO
* n-Pm = n-ubwoko bwa Pm-Urwego, n-Ps = n-ubwoko bwa Ps-Urwego, Sl = Semi-lnsulating
Ingingo | 8-Inch | 6-Inch | 4-Inch | ||
nP | n-Pm | n-Zab | SI | SI | |
TTV (GBIR) | ≤6um | ≤6um | |||
Umuheto (GF3YFCD) -Agaciro keza | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
Intambara (GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV (SBIR) -10mmx10mm | <2 mm | ||||
Wafer Edge | Beveling |
BURUNDU
* n-Pm = n-ubwoko bwa Pm-Urwego, n-Ps = n-ubwoko bwa Ps-Urwego, Sl = Semi-lnsulating
Ingingo | 8-Inch | 6-Inch | 4-Inch | ||
nP | n-Pm | n-Zab | SI | SI | |
Kurangiza | Impande ebyiri Optical Polonye, Si- Isura CMP | ||||
Ubuso | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Isura Ra≤0.2nm | |||
Imipira | Nta na kimwe cyemewe (uburebure n'ubugari≥0.5mm) | ||||
Ibimenyetso | Nta na kimwe cyemewe | ||||
Igishushanyo (Si-Isura) | Qty.≤5, Guhuriza hamwe | Qty.≤5, Guhuriza hamwe | Qty.≤5, Guhuriza hamwe | ||
Ibice | Nta na kimwe cyemewe | ||||
Guhezwa | 3mm |