12 iniha Silicon Wafer no ka hana Semiconductor

ʻO ka wehewehe pōkole:

ʻO VET Energy 12-inch silicon wafers ka mea kumu kumu o ka ʻoihana hana semiconductor. Hoʻohana ʻo VET Energy i ka ʻenehana ulu CZ kiʻekiʻe e hōʻoia i ka maikaʻi o nā wafers i ka maikaʻi o ke aniani, haʻahaʻa haʻahaʻa haʻahaʻa a me ke kūlike kiʻekiʻe, e hāʻawi ana i kahi substrate paʻa a hilinaʻi no kāu mau mea semiconductor.


Huahana Huahana

Huahana Huahana

ʻO ka 12 inch Silicon Wafer no ka Semiconductor Fabrication i hāʻawi ʻia e VET Energy ua hana ʻia e hoʻokō i nā kūlana kūpono i koi ʻia i ka ʻoihana semiconductor. E like me kekahi o nā huahana koʻikoʻi i kā mākou lineup, hōʻoia ʻo VET Energy e hana ʻia kēia mau wafers me ka palahalaha pololei, ka maʻemaʻe, a me ka maikaʻi o ka ʻili, e hoʻolilo iā lākou i kūpono no nā noi semiconductor ʻokiʻoki, me nā microchips, sensors, a me nā mea uila kiʻekiʻe.

Hoʻopili kēia wafer me kahi ākea o nā mea e like me Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, a me Epi Wafer, e hāʻawi ana i ka versatility maikaʻi loa no nā kaʻina hana hana. Eia hou, hui maikaʻi ia me nā ʻenehana holomua e like me Gallium Oxide Ga2O3 a me AlN Wafer, e hōʻoia ana e hiki ke hoʻohui ʻia i nā noi kūikawā. No ka hana maʻemaʻe, hoʻomaʻamaʻa ʻia ka wafer no ka hoʻohana ʻana me nā ʻōnaehana Cassette maʻamau o ka ʻoihana, e hōʻoiaʻiʻo ana i ka mālama pono ʻana i ka hana semiconductor.

ʻAʻole i kaupalena ʻia ka laina huahana o VET Energy i nā wafer silika. Hāʻawi pū mākou i kahi ākea o nā mea semiconductor substrate, me SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, etc., a me nā mea semiconductor broadgap hou e like me Gallium Oxide Ga2O3 a me AlN Wafer. Hiki i kēia mau huahana ke hoʻokō i nā pono noi o nā mea kūʻai aku i ka uila uila, ka lekiō, nā sensor a me nā ʻano ʻē aʻe.

Nā wahi noi:
ʻO nā ʻāpana logic:ʻO ka hana ʻana i nā ʻāpana loiloi kiʻekiʻe e like me CPU a me GPU.
Nā pahu hoʻomanaʻo:Ka hana ʻana i nā pahu hoʻomanaʻo e like me DRAM a me NAND Flash.
Nā ʻāpana analog:Ka hana ʻana i nā ʻāpana analog e like me ADC a me DAC.
Nā mea nānā:Nā meaʻike MEMS, nā kiʻi kiʻi, a pēlā aku.

Hāʻawi ʻo VET Energy i nā mea kūʻai aku i nā hoʻonā wafer maʻamau, a hiki iā ia ke hana i nā wafers me nā resistivity ʻokoʻa, ʻokoʻa oxygen ʻokoʻa, ʻokoʻa ka mānoanoa a me nā kikoʻī ʻē aʻe e like me nā pono kikoʻī o nā mea kūʻai. Eia kekahi, hāʻawi pū mākou i ke kākoʻo ʻenehana loea a me ka lawelawe ma hope o ke kūʻai aku e kōkua i nā mea kūʻai aku e hoʻomaikaʻi i nā kaʻina hana a hoʻomaikaʻi i ka hua huahana.

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第6页-35

OLELO HOOLAHA WAFERING

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating

'ikamu

8-Inika

6-Iniha

4-Iniha

nP

n-Pm

n-Ps

SI

SI

TTV(GBIR)

≤6um

≤6um

Kakaka (GF3YFCD)-Waiwai Loa

≤15μm

≤15μm

≤25μm

≤15μm

Warp(GF3YFER)

≤25μm

≤25μm

≤40μm

≤25μm

LTV(SBIR)-10mmx10mm

<2μm

Wafer Edge

ʻO ka beveling

ILI HOPE

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating

'ikamu

8-Inika

6-Iniha

4-Iniha

nP

n-Pm

n-Ps

SI

SI

Hoʻopau ʻili

ʻaoʻao ʻelua Optical Polish, Si- Face CMP

ʻAhaʻulaʻula

(10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm

ʻOpeʻa lihi

ʻAʻohe ʻae ʻia (lōʻihi a laula≥0.5mm)

Indents

ʻAʻole ʻae ʻia

Nā ʻōpala (Si-Face)

Ka nui.≤5, Huihui
Length≤0.5×wafer anawaena

Ka nui.≤5, Huihui
Length≤0.5×wafer anawaena

Ka nui.≤5, Huihui
Length≤0.5×wafer anawaena

māwae

ʻAʻole ʻae ʻia

Hoʻokuʻu Edge

3mm

tech_1_2_size
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