ʻO ka 12 inch Silicon Wafer no ka Semiconductor Fabrication i hāʻawi ʻia e VET Energy ua hana ʻia e hoʻokō i nā kūlana kūpono i koi ʻia i ka ʻoihana semiconductor. E like me kekahi o nā huahana koʻikoʻi i kā mākou lineup, hōʻoia ʻo VET Energy e hana ʻia kēia mau wafers me ka palahalaha pololei, ka maʻemaʻe, a me ka maikaʻi o ka ʻili, e hoʻolilo iā lākou i kūpono no nā noi semiconductor ʻokiʻoki, me nā microchips, sensors, a me nā mea uila kiʻekiʻe.
Hoʻopili kēia wafer me kahi ākea o nā mea e like me Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, a me Epi Wafer, e hāʻawi ana i ka versatility maikaʻi loa no nā kaʻina hana hana. Eia hou, hui maikaʻi ia me nā ʻenehana holomua e like me Gallium Oxide Ga2O3 a me AlN Wafer, e hōʻoia ana e hiki ke hoʻohui ʻia i nā noi kūikawā. No ka hana maʻemaʻe, hoʻomaʻamaʻa ʻia ka wafer no ka hoʻohana ʻana me nā ʻōnaehana Cassette maʻamau o ka ʻoihana, e hōʻoiaʻiʻo ana i ka mālama pono ʻana i ka hana semiconductor.
ʻAʻole i kaupalena ʻia ka laina huahana o VET Energy i nā wafer silika. Hāʻawi pū mākou i kahi ākea o nā mea semiconductor substrate, me SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, etc., a me nā mea semiconductor broadgap hou e like me Gallium Oxide Ga2O3 a me AlN Wafer. Hiki i kēia mau huahana ke hoʻokō i nā pono noi o nā mea kūʻai like ʻole i ka uila uila, ka lekiō lekiō, nā sensor a me nā kahua ʻē aʻe.
Nā wahi noi:
•ʻO nā ʻāpana logic:ʻO ka hana ʻana i nā ʻāpana loiloi kiʻekiʻe e like me CPU a me GPU.
•Nā pahu hoʻomanaʻo:Ka hana ʻana i nā pahu hoʻomanaʻo e like me DRAM a me NAND Flash.
•Nā ʻāpana analog:Ka hana ʻana i nā ʻāpana analog e like me ADC a me DAC.
•Nā mea nānā:Nā meaʻike MEMS, nā meaʻike kiʻi, a pēlā aku.
Hāʻawi ʻo VET Energy i nā mea kūʻai aku i nā hoʻonā wafer maʻamau, a hiki iā ia ke hana i nā wafers me nā resistivity ʻokoʻa, ʻokoʻa oxygen ʻokoʻa, ʻokoʻa ka mānoanoa a me nā kikoʻī ʻē aʻe e like me nā pono kikoʻī o nā mea kūʻai. Eia kekahi, hāʻawi pū mākou i ke kākoʻo ʻenehana loea a me ka lawelawe ma hope o ke kūʻai aku e kōkua i nā mea kūʻai aku e hoʻomaikaʻi i nā kaʻina hana a hoʻomaikaʻi i ka hua huahana.
OLELO HOOLAHA WAFERING
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
'ikamu | 8-Inika | 6-Iniha | 4-Iniha | ||
nP | n-Pm | n-Ps | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Kakaka (GF3YFCD)-Waiwai Loa | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
Warp(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR)-10mmx10mm | <2μm | ||||
Wafer Edge | ʻO ka beveling |
PAPA IHO
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
'ikamu | 8-Inika | 6-Iniha | 4-Iniha | ||
nP | n-Pm | n-Ps | SI | SI | |
Hoʻopau ʻili | ʻaoʻao ʻelua Optical Polish, Si- Face CMP | ||||
ʻAhaʻulaʻula | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
ʻOpi ʻEke | ʻAʻohe ʻae ʻia (lōʻihi a laula≥0.5mm) | ||||
Indents | ʻAʻole ʻae ʻia | ||||
Nā ʻōpala (Si-Face) | Ka nui.≤5, Huihui | Ka nui.≤5, Huihui | Ka nui.≤5, Huihui | ||
māwae | ʻAʻole ʻae ʻia | ||||
Hoʻokuʻu Edge | 3mm |