Le Wafer engu-6 Inch N yohlobo lwe-SiC yakhelwe ukusebenza okuthuthukisiwe ezimeni ezimbi kakhulu, iyenze ibe ukukhetha okuhle ezinhlelweni ezidinga amandla aphezulu nokumelana nezinga lokushisa. Imikhiqizo engukhiye ehlotshaniswa nale wafer ihlanganisa i-Si Wafer, i-SiC Substrate, i-SOI Wafer, ne-SiN Substrate. Lezi zinto ezisetshenziswayo ziqinisekisa ukusebenza okuphelele ezinqubweni ezihlukahlukene zokukhiqiza ama-semiconductor, okunika amandla amadivayisi awonga amandla futhi ahlala isikhathi eside.
Ezinkampanini ezisebenza nge-Epi Wafer, Gallium Oxide Ga2O3, Cassette, noma AlN Wafer, 6 Inch N Type SiC Wafer ye-VET Energy inikeza isisekelo esidingekayo sokuthuthukiswa komkhiqizo omusha. Kungakhathaliseki ukuthi iku-electronics enamandla amakhulu noma ubuchwepheshe bamuva nje be-RF, lawa mawafa aqinisekisa ukusebenza kahle kakhulu kanye nokumelana nokushisa okuncane, ecindezela imingcele yokusebenza kahle nokusebenza.
IMICIMBI YOKUFAKA
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation
Into | 8-Intshi | 6-Intshi | 4-Intshi | ||
nP | n-Pm | n-IHu | SI | SI | |
I-TTV(GBIR) | ≤6um | ≤6um | |||
Umnsalo(GF3YFCD)-Inani Eliphelele | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
I-Warp(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
I-LTV(SBIR)-10mmx10mm | <2μm | ||||
I-Wafer Edge | Beveling |
UBUHLUNGU QEDA
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation
Into | 8-Intshi | 6-Intshi | 4-Intshi | ||
nP | n-Pm | n-IHu | SI | SI | |
I-Surface Qeda | I-Double side Optical Polish, i-Si- Face CMP | ||||
I-SurfaceRoughness | (10um x 10um) I-Si-FaceRa≤0.2nm | (5umx5um) I-Si-Face Ra≤0.2nm | |||
Ama-Edge Chips | Akukho okuvunyelwe (ubude nobubanzi≥0.5mm) | ||||
Izindebe | Akukho Okuvunyelwe | ||||
Imihuzuko(Si-Face) | Ubuningi.≤5,Okuqongelelwe | Ubuningi.≤5,Okuqongelelwe | Ubuningi.≤5,Okuqongelelwe | ||
Imifantu | Akukho Okuvunyelwe | ||||
Ukukhishwa komkhawulo | 3mm |