Iindaba

Igraphite enokwaleka kwe-TaC
ngu admin on 24-11-21
I. Inkqubo yokuhlola iparamitha 1. Inkqubo ye-TaCl5-C3H6-H2-Ar 2. Ubushushu bokubekwa: Ngokwefomula ye-thermodynamic, kubalwa ukuba xa iqondo lobushushu lingaphezulu kwe-1273K, amandla asimahla e-Gibbs okusabela aphantsi kakhulu kwaye ukusabela kugqibelele. Isizathu...
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Inkqubo yokukhula kwekristale ye-silicon carbide kunye neteknoloji yezixhobo
ngu admin on 24-11-21
1. Indlela yeteknoloji ye-SiC ye-crystal yokukhula kwe-PVT (indlela ye-sublimation), i-HTCVD (i-CVD ephezulu yokushisa), i-LPE (indlela yesigaba solwelo) ziindlela ezintathu eziqhelekileyo zokukhula kwe-crystal ye-SiC; Eyona ndlela eyaziwayo kwishishini yindlela yePVT, kwaye ngaphezulu kwe-95% yeekristale zeSiC enye zikhuliswa yiPVT ...
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Ukulungiswa kunye nokuPhuculwa kokuSebenza kweePorous Silicon Carbon Composite Materials
ngu admin on 24-11-13
Iibhetri zeLithium-ion ziphuhliswa ikakhulu kwicala lokuxinana kwamandla aphezulu. Kwiqondo lobushushu begumbi, i-silicon-based negative electrode materials alloy kunye ne-lithium ukuvelisa i-lithium-rich product Li3.75Si isigaba, esinomthamo othile ukuya kuthi ga kwi-3572 mAh / g, ephezulu kakhulu kunethiyori...
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I-Thermal Oxidation yeSilicon yeCrystal enye
ngu admin on 24-11-13
Ukwenziwa kwesilicon dioxide kumphezulu wesilicon kubizwa ngokuba yi-oxidation, kunye nokudalwa kwesilicon dioxide ezinzileyo kunye nebambelela ngokuqinileyo kukhokelela ekuzalweni kwe-silicon edibeneyo yeteknoloji yeplani yesekethe. Nangona zininzi iindlela zokukhulisa isilicon dioxide ngqo kumphezulu we-silico...
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Ukwenziwa kweUV yeFan-Out Wafer-Level Packaging
ngu admin on 24-11-05
I-Fan out wafer level packaging (FOWLP) yindlela engabizi kakhulu kwishishini le-semiconductor. Kodwa iziphumo ebezingalindelekanga eziqhelekileyo zale nkqubo zi-warping kunye ne-chip offset. Ngaphandle kophuculo oluqhubekayo lwenqanaba le-wafer kunye nenqanaba lephaneli yetekhnoloji yefenitshala, le miba inxulumene nokubumba isaphuma...
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I-Silicon carbide ceramics: i-terminator ye-photovoltaic quartz components
ngu admin on 24-11-05
Ngophuhliso oluqhubekayo lwehlabathi lanamhlanje, amandla angahlaziyekiyo aya ephelelwa ngamandla, kwaye uluntu luya lungxamiseka ngakumbi ukuba lusebenzise amandla ahlaziyekayo amelwe “ngumoya, ukukhanya, amanzi nenyukliya”. Xa kuthelekiswa neminye imithombo yamandla ahlaziyekayo, abantu...
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I-reaction sintering kunye nenkqubo yokulungiselela i-silicon carbide ceramic ceramic
ngu admin on 24-10-29
I-reaction sintering I-reaction sintering silicon carbide inkqubo yokuvelisa i-ceramic iquka ukudibanisa i-ceramic, i-sintering flux infiltration agent idibanisa, i-reaction sintering yokulungiswa kwemveliso ye-ceramic, ukulungiswa kwe-silicon carbide ngamaplanga kunye namanye amanyathelo. I-silicon yokuphendula i-sintering ...
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I-Silicon carbide ceramics: amacandelo achanekileyo ayimfuneko kwiinkqubo ze-semiconductor
ngu admin on 24-10-29
Itekhnoloji ye-Photolithography igxile ikakhulu ekusebenziseni iisistim zamehlo ukubonisa iipatheni zesekethe kwii-silicone wafers. Ukuchaneka kwale nkqubo kuchaphazela ngokuthe ngqo ukusebenza kunye nemveliso yeesekethe ezidibeneyo. Njengesinye sezixhobo eziphezulu zokwenza i-chip, umatshini we-lithography uqulethe ...
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ukuqonda ungcoliseko lwe-semiconductor wafer kunye nenkqubo yokucoca
ngu admin on 24-10-29
Xa isidoda kwiindaba zoshishino, ukuqonda ubunzulu bokwenziwa kwe-semiconductor kuyimfuneko. I-semiconductor wafer yinxalenye ebalulekileyo kolu shishino, kodwa bahlala bejongana nokosulelwa bubumdaka obuhlukeneyo. Ezi zingcolisi, ziquka iathom, i-organic matter, i-ion element yesinyithi, i...
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