Wafer warpage, ukwenza ntoni?

Kwinkqubo ethile yokupakisha, izinto zokupakisha ezinee-coefficients ezahlukeneyo zokwandiswa kwe-thermal zisetyenziswa. Ngethuba lenkqubo yokupakisha, i-wafer ifakwe kwi-substrate yokupakisha, kwaye emva koko amanyathelo okufudumeza kunye nokupholisa ayenziwa ukugqiba ukupakisha. Nangona kunjalo, ngenxa yokungahambelani phakathi kwe-coefficient yokwandiswa kwe-thermal yezinto zokupakisha kunye ne-wafer, uxinzelelo lwe-thermal lubangela ukuba i-wafer ijikeleze. Yiza ujonge kunye nomhleli ~

Yintoni iwafer warpage?

Waferiwarpage ibhekisa ekugobeni okanye ekujikeni kwewafer ngexesha lenkqubo yokupakisha.WaferI-warpage inokubangela ukutenxa kolungelelwaniso, iingxaki ze-welding kunye nokuthotywa kokusebenza kwesixhobo ngexesha lenkqubo yokupakisha.

Ukuchaneka okucuthiweyo kokupakishwa:WaferI-warpage inokubangela ukutenxa kolungelelwaniso ngexesha lenkqubo yokupakisha. Xa i-wafer deforms ngexesha lenkqubo yokupakisha, ukulungelelaniswa phakathi kwe-chip kunye nesixhobo esipakishweyo kunokuchaphazeleka, kubangele ukungakwazi ukulungelelanisa ngokuchanekileyo izikhonkwane zokudibanisa okanye i-solder joints. Oku kunciphisa ukuchaneka kokupakishwa kwaye kunokubangela ukungazinzi okanye ukusebenza kwesixhobo esingathembekanga.

Ukonyuka koxinzelelo koomatshini:WaferI-warpage yazisa uxinzelelo olongezelelweyo lomatshini. Ngenxa yokuguqulwa kwe-wafer ngokwayo, uxinzelelo lomatshini olusetyenziswa ngexesha lokupakisha lunokwanda. Oku kunokubangela uxinzelelo loxinzelelo ngaphakathi kwewafer, kuchaphazele kakubi imathiriyeli kunye nokwakheka kwesixhobo, kwaye kude kubangele umonakalo wangaphakathi we-wafer okanye ukusilela kwesixhobo. 

Ukuthotywa komgangatho wokusebenza:Iphepha lewafer linokubangela ukuthotywa kokusebenza kwesixhobo. Amacandelo kunye noyilo lwesekethe kwi-wafer yenzelwe ngokusekelwe kumphezulu osicaba. Ukuba i-wafer warps, inokuchaphazela uqhagamshelo lombane, ukuhanjiswa komqondiso kunye nolawulo lwe-thermal phakathi kwezixhobo. Oku kunokubangela iingxaki ekusebenzeni kombane, isantya, usetyenziso lwamandla okanye ukuthembeka kwesixhobo.

Iingxaki zokuwelda:I-wafer warpage inokubangela iingxaki ze-welding. Ngexesha lenkqubo ye-welding, ukuba i-wafer igobile okanye ijijekile, ukuhanjiswa kwamandla ngexesha lenkqubo ye-welding kunokungalingani, okukhokelela kumgangatho ombi we-solder joints okanye ukuphulwa kwe-solder joint. Oku kuya kuba nefuthe elibi ekuthembekeni kwephakheji.

Izizathu ze wafer warpage

Oku kulandelayo zezinye zezinto ezinokubangelaiqhekeza lesonkaiphepha lemfazwe:

1.Uxinzelelo lobushushu:Ngethuba lenkqubo yokupakisha, ngenxa yokutshintsha kweqondo lokushisa, izinto ezahlukeneyo kwi-wafer ziya kuba ne-coefficients yokwandisa i-thermal engahambelani, okukhokelela kwi-wafer warpage.

2.I-inhomogeneity yezinto eziphathekayo:Ngexesha lenkqubo yokwenziwa kwe-wafer, ulwabiwo olungalinganiyo lwemathiriyeli lunokubangela ukuba i-wafer warpage. Umzekelo, ukuxinana kwemathiriyeli eyahlukeneyo okanye ukutyeba kwiindawo ezahlukeneyo zewafer kuya kubangela ukuba i-wafer ibe nokonakala.

3.Iiparamitha zenkqubo:Ulawulo olungafanelekanga kwezinye iiparamitha zenkqubo kwinkqubo yokupakisha, efana nobushushu, ukufuma, uxinzelelo lomoya, njl.

Isisombululo

Eminye imilinganiselo yokulawula iwaferpage:

Uphuculo lwenkqubo:Nciphisa umngcipheko we-wafer warpage ngokulungiselela iiparamitha zenkqubo yokupakisha. Oku kubandakanya ukulawula iiparitha ezifana nobushushu kunye nokufuma, amazinga okufudumala kunye nokupholisa, kunye noxinzelelo lomoya ngexesha lenkqubo yokupakisha. Ukukhetha okufanelekileyo kweeparamitha zenkqubo kunokunciphisa impembelelo yoxinzelelo lwe-thermal kunye nokunciphisa ukuba nokwenzeka kwe-wafer warpage.

Ukukhetha izinto zokupakisha:Khetha izinto ezifanelekileyo zokupakisha ukunciphisa umngcipheko we-wafer warpage. I-coefficient yokwandisa i-thermal yezinto zokupakisha kufuneka ihambelane ne-wafer ukunciphisa i-wafer deformation ebangelwa uxinzelelo lwe-thermal. Ngexesha elifanayo, iipropati zomatshini kunye nokuzinza kwezinto zokupakisha nazo kufuneka ziqwalaselwe ukuqinisekisa ukuba ingxaki ye-wafer warpage inokupheliswa ngokufanelekileyo.

Uyilo lweWafer kunye nokwenza ngcono:Ngexesha loyilo kunye nenkqubo yokwenziwa kwe-wafer, amanye amanyathelo anokuthathwa ukunciphisa umngcipheko we-wafer warpage. Oku kubandakanya ukulungelelanisa ukuhanjiswa kwezinto ezifanayo, ukulawula ubukhulu kunye nokunyuka komphezulu we-wafer, njl. Ngokulawula ngokuchanekileyo inkqubo yokwenziwa kwe-wafer, umngcipheko wokuguqulwa kwe-wafer ngokwawo unokuncitshiswa.

Amanyathelo olawulo lobushushu:Ngexesha lenkqubo yokupakisha, amanyathelo olawulo lwe-thermal athathwa ukunciphisa umngcipheko we-wafer warpage. Oku kuquka ukusebenzisa izixhobo zokufudumeza kunye nokupholisa ngokulingana kwamaqondo obushushu, ukulawula ukuthambeka kobushushu kunye namazinga okutshintsha ubushushu, kunye nokuthatha iindlela zokupholisa ezifanelekileyo. Ulawulo olusebenzayo lwe-thermal lunokunciphisa impembelelo yoxinzelelo lwe-thermal kwi-wafer kunye nokunciphisa ukuba nokwenzeka kwe-wafer warpage.

Imilinganiselo yokubona kunye nohlengahlengiso:Ngexesha lenkqubo yokupakisha, kubaluleke kakhulu ukubona rhoqo kwaye uhlengahlengise i-wafer warpage. Ngokusebenzisa izixhobo zokubona ezichanekileyo, ezinje ngenkqubo yokulinganisa i-optical okanye izixhobo zokuvavanya oomatshini, iingxaki ze-wafer warpage zinokubonwa kwangethuba kwaye amanyathelo ahambelanayo okulungelelaniswa anokuthathwa. Oku kunokubandakanya ukulungiswa kwakhona kweeparamitha zokupakisha, ukutshintsha imathiriyeli yokupakisha, okanye ukulungelelanisa inkqubo yokwenziwa kwe-wafer.

Kufuneka kuqatshelwe ukuba ukusombulula ingxaki ye-wafer warpage ngumsebenzi onzima kwaye unokufuna ukuqwalaselwa ngokubanzi kwezinto ezininzi kunye nokulungiswa okuphindaphindiweyo kunye nohlengahlengiso. Kwizicelo zokwenyani, izisombululo ezithile zinokwahluka ngokuxhomekeke kwizinto ezifana neenkqubo zokupakisha, imathiriyeli yewafer, kunye nezixhobo. Ngoko ke, kuxhomekeke kwimeko ethile, amanyathelo afanelekileyo anokukhethwa kwaye athathwe ukuxazulula ingxaki ye-wafer warpage.