Emva kweiqhekeza lesonkaidlulile kwinkqubo yangaphambili, ukulungiswa kwetshiphu kugqityiwe, kwaye kufuneka kunqunyulwe ukwahlula iitshiphusi kwi-wafer, kwaye ekugqibeleni zipakishwe. Iiqhekeza lesonkaInkqubo yokusika ekhethiweyo yeewafers ezinobunzima obahlukeneyo nayo yahlukile:
▪Ii-wafersezinobunzima obungaphezulu kwe-100um zisikwa ngokubanzi ngeencakuba;
▪Ii-wafersezinobunzima obungaphantsi kwe-100um zisikwa ngokubanzi ngeelaser. Ukusika i-Laser kunokunciphisa iingxaki zokuqhawula kunye nokuqhekeka, kodwa xa kungaphezulu kwe-100um, ukusebenza kakuhle kwemveliso kuya kuncitshiswa kakhulu;
▪Ii-wafersezinobunzima obungaphantsi kwe-30um zisikwa ngeplasma. Ukusika i-Plasma kukhawuleza kwaye akuyi konakalisa umphezulu we-wafer, ngaloo ndlela kuphuculwe isivuno, kodwa inkqubo yayo inzima kakhulu;
Ngethuba lenkqubo yokusika i-wafer, ifilimu iya kufakwa kwi-wafer kwangaphambili ukuze kuqinisekiswe "i-singling" ekhuselekileyo. Imisebenzi yayo ephambili yile ilandelayo.
Lungisa kwaye ukhusele i-wafer
Ngexesha lokusebenza kwe-dicing, i-wafer kufuneka isikwe ngokuchanekileyo.Ii-waferszidla ngokuba zibhityile kwaye zibhityile. I-tape ye-UV inokubambelela ngokuqinileyo i-wafer kwisakhelo okanye kwinqanaba le-wafer ukukhusela i-wafer ekutshintsheni kunye nokugubha ngexesha lenkqubo yokusika, ukuqinisekisa ukuchaneka kunye nokuchaneka kokusikwa.
Inokubonelela ngokhuseleko olufanelekileyo lomzimba kwi-wafer, ukuphepha umonakalo kwiiqhekeza lesonkaokubangelwa yimpembelelo yamandla angaphandle kunye nokungqubuzana okunokuthi kwenzeke ngexesha lenkqubo yokusika, njengokuqhekeka, ukudilika komphetho kunye nezinye iziphene, kunye nokukhusela isakhiwo se-chip kunye nesekethe kumphezulu we-wafer.
Ukusebenza ngokufanelekileyo kokusika
Iteyiphu ye-UV ine-elasticity efanelekileyo kunye nokuguquguquka, kwaye inokukhubazeka ngokumodareyitha xa i-blade yokusika isika ngaphakathi, yenza inkqubo yokusika ibe lula, inciphisa imiphumo emibi yokusika ukuchasana kwi-blade kunye ne-wafer, kunye nokunceda ukuphucula umgangatho wokusika kunye nobomi benkonzo. incakuba. Iimpawu zayo zomphezulu zenza ukuba i-debris eveliswa ngokusika ibambelele kwi-tape ngcono ngaphandle kokutshiza ngeenxa zonke, ekulungele ukucocwa okulandelayo kwendawo yokusika, ukugcina indawo yokusebenza icocekile, kunye nokuphepha i-debris ekungcoliseni okanye ukuphazamisa i-wafer kunye nezinye izixhobo. .
Kulula ukuphatha kamva
Emva kokuba i-wafer isikiwe, i-tape ye-UV inokunciphisa ngokukhawuleza kwi-viscosity okanye ilahlekelwe ngokupheleleyo ngokuyikhanyisa ngokukhanya kwe-ultraviolet ye-wavelength ethile kunye nobukhulu, ukwenzela ukuba i-chip chip ihlulwe ngokulula kwi-tape, ekulungeleyo okulandelayo. ukupakishwa kwe-chip, uvavanyo kunye nezinye iinkqubo zokuhamba, kwaye le nkqubo yokwahlukana inomngcipheko ophantsi kakhulu wokonakalisa i-chip.
Ixesha lokuposa: Dec-16-2024