8 Inch P Mofuta oa Silicon Wafer

Tlhaloso e Khutšoanyane:

Re hlahisa mofuta oa premium-grade 8 Inch P Silicon Wafer, e leng letšoao la bokhabane bo tsoang ho VET Energy. Sephaphatha sena se ikhethang, se nang le profil ea mofuta oa P, se entsoe ka boqhetseke ho fihlela maemo a holimo ka ho fetisisa a boleng le ts'ebetso.

Re romelle lengolo-tsoibila Khoasolla e le PDF

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Mofuta oa Silicon Wafer oa 8 Inch P o tsoang ho VET Energy ke sephaphatha sa silicon se sebetsang hantle se etselitsoeng mefuta e mengata ea lisebelisoa tsa semiconductor, ho kenyeletsa lisele tsa letsatsi, lisebelisoa tsa MEMS, le lipotoloho tse kopantsoeng. E tsebahala ka ho sebetsa ha eona hantle ha motlakase le ts'ebetso e tsitsitseng, sephaphatha sena ke khetho e ratoang ke baetsi ba batlang ho hlahisa likarolo tsa elektronike tse tšepahalang le tse sebetsang hantle. VET Energy e netefatsa maemo a nepahetseng a doping le pheletso ea boleng bo holimo bakeng sa tlhahiso e nepahetseng ea lisebelisoa.

Li-Silicon Wafers tsena tsa 8 Inch P li lumellana ka botlalo le lisebelisoa tse fapaneng tse kang SiC Substrate, SOI Wafer, SiN Substrate, 'me li loketse kholo ea Epi Wafer, e netefatsang ho feto-fetoha ha maemo bakeng sa lits'ebetso tse tsoetseng pele tsa tlhahiso ea semiconductor. Li-wafers li ka boela tsa sebelisoa hammoho le lisebelisoa tse ling tsa theknoloji e phahameng joaloka Gallium Oxide Ga2O3 le AlN Wafer, e leng se etsang hore e be tse loketseng bakeng sa lisebelisoa tsa elektroniki tsa moloko o latelang. Moralo oa bona o matla o boetse o lumellana hantle le lits'ebetso tse thehiloeng ho Cassette, ho netefatsa ts'ebetso ea tlhahiso e sebetsang hantle le e phahameng.

VET Energy e fa bareki litharollo tse ikhethileng tsa liphaephe. Re ka Customize li-wafers ka resistivity fapaneng, dikahare oksijene, botenya, joalo-joalo ho ea ka litlhoko tse khethehileng tsa bareki. Ntle le moo, re boetse re fana ka ts'ehetso ea botekgeniki le ts'ebeletso ea morao-rao ho thusa bareki ho rarolla mathata a fapaneng a kopaneng nakong ea tlhahiso.

LIEKETSENG MATS'OA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
Ntho	nP	n-Pm	n-Pes	SI	SI
TTV(GBIR)	≤6um	≤6um
Bow(GF3YFCD)-Boleng bo Felletseng	≤15μm	≤15μm	≤25μm		≤15μm
Warp(GF3YFER)	≤25μm	≤25μm	≤40μm		≤25μm
LTV(SBIR) -10mmx10mm	<2μm
Wafer Edge	Beveling

SEBAKA PHETHA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
	nP	n-Pm	n-Pes	SI	SI
Surface Finish	Mahlakore a mabeli a Optical Polish, Si- Face CMP
SurfaceRoughness	(10um x 10um) Si-FaceRa≤0.2nm C-Face Ra≤ 0.5nm			(5umx5um) Si-Face Ra≤0.2nm C-Face Ra≤0.5nm
Li-Chips tsa Edge	Ha ho e dumellwe (bolelele le bophara≥0.5mm)
Li-indent	Ha ho le e 'ngoe e Lumelloang
Scratches(Si-Face)	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer			Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer
Mapetso	Ha ho le e 'ngoe e Lumelloang
Kenyelletso ea Edge	3mm