12 inch SOI Wafer

Tlhaloso e Khutšoanyane:

Eba le boqapi ho feta leha e le neng pele ka 12 Inch SOI Wafer ea morao-rao, mohlolo oa theknoloji o tlisitsoeng ho uena ke VET Energy. E entsoe ka boqhetseke le botsebi, sephaphatha sena sa Silicon-On-Insulator se hlalosa maemo a indasteri bocha, se fana ka boleng bo ke keng ba lekanngoa le ts'ebetso.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

VET Energy 12-inch SOI wafer ke sesebelisoa sa semiconductor se sebetsang hantle haholo, se ratoang haholo bakeng sa thepa ea sona e ntle ea motlakase le sebopeho se ikhethileng. VET Energy e sebelisa mekhoa e tsoetseng pele ea ho etsa li-wafer tsa SOI ho netefatsa hore sephaphatha se na le ho lutla ha hona joale, lebelo le phahameng le ho hanyetsa mahlaseli, ho fana ka motheo o tiileng bakeng sa li-circuits tsa hau tse sebetsang hantle tse sebetsang hantle.

Mohala oa sehlahisoa oa VET Energy ha o felle feela ho li-wafers tsa SOI. Re boetse re fana ka lisebelisoa tse ngata tse fapaneng tsa semiconductor substrate, ho kenyelletsa Si Wafer, SiC Substrate, SiN Substrate, Epi Wafer, joalo-joalo, hammoho le lisebelisoa tse ncha tse pharalletseng tsa semiconductor tse kang Gallium Oxide Ga2O3 le AlN Wafer. Lihlahisoa tsena li ka fihlela litlhoko tsa ts'ebeliso ea bareki ba fapaneng ka matla a elektroniki, RF, li-sensor le likarolo tse ling.

Re tsepamisitse maikutlo holim'a bokhabane, li-wafers tsa rona tsa SOI li boetse li sebelisa lisebelisoa tse tsoetseng pele tse kang gallium oxide Ga2O3, lik'hasete le li-wafers tsa AlN ho netefatsa ho tšepahala le ho sebetsa hantle boemong bo bong le bo bong ba ts'ebetso. Tšepa VET Energy ho fana ka litharollo tsa morao-rao tse bulang tsela bakeng sa tsoelo-pele ea theknoloji.

Hlahisa bokhoni ba projeke ea hau ka ts'ebetso e phahameng ea VET Energy 12-inch SOI wafers. Matlafatsa bokhoni ba hau ba boqapi ka li-wafers tse kenyelletsang boleng, ho nepahala le boqapi, ho rala motheo oa katleho lefapheng le matla la theknoloji ea semiconductor. Khetha VET Energy bakeng sa litharollo tsa premium SOI wafer tse fetang tebello.

Libeke tse 6-36
Libeke tse 6-35

LIEKETSENG MATS'OA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho

8-Intshi

6-Intshi

4-Intshi

nP

n-Pm

n-Pes

SI

SI

TTV(GBIR)

≤6um

≤6um

Bow(GF3YFCD)-Boleng bo Felletseng

≤15μm

≤15μm

≤25μm

≤15μm

Warp(GF3YFER)

≤25μm

≤25μm

≤40μm

≤25μm

LTV(SBIR) -10mmx10mm

<2μm

Wafer Edge

Beveling

SEBAKA PHETHA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho

8-Intshi

6-Intshi

4-Intshi

nP

n-Pm

n-Pes

SI

SI

Surface Finish

Mahlakore a mabeli a Optical Polish, Si- Face CMP

SurfaceRoughness

(10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm

Li-Chips tsa Edge

Ha ho e dumellwe (bolelele le bophara≥0.5mm)

Li-indent

Ha ho le e 'ngoe e Lumelloang

Scratches(Si-Face)

Kty.≤5, Kakaretso
Bolelele≤0.5× bophara ba wafer

Kty.≤5, Kakaretso
Bolelele≤0.5× bophara ba wafer

Kty.≤5, Kakaretso
Bolelele≤0.5× bophara ba wafer

Mapetso

Ha ho le e 'ngoe e Lumelloang

Kenyelletso ea Edge

3mm

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