12 inch Silicon Wafer bakeng sa Tlhahiso ea Semiconductor

12 inch Silicon Wafer bakeng sa Semiconductor Fabrication Featured Image

Tlhaloso e Khutšoanyane:

VET Energy 12-inch silicon wafers ke lisebelisoa tsa mantlha tsa indasteri ea tlhahiso ea semiconductor. VET Energy e sebelisa theknoloji e tsoetseng pele ea kholo ea CZ ho netefatsa hore liphaephe li na le boleng bo botle ba kristale, bofokoli bo tlase le ho tšoana ho holimo, ho fana ka substrate e tiileng le e tšepahalang bakeng sa lisebelisoa tsa hau tsa semiconductor.

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Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Silicon Wafer ea 12 inch bakeng sa Semiconductor Fabrication e fanoang ke VET Energy e entsoe ho fihlela litekanyetso tse nepahetseng tse hlokahalang indastering ea semiconductor. Joalo ka e 'ngoe ea lihlahisoa tse etelletseng pele lethathamong la rona, VET Energy e netefatsa hore li-wafers tsena li hlahisoa ka bokhabane bo hlakileng, bohloeki le boleng ba bokaholimo, e li etsang hore e be tse loketseng lits'ebetso tsa semiconductor tse tsoetseng pele, ho kenyeletsoa li-microchips, li-sensor le lisebelisoa tse tsoetseng pele tsa elektroniki.

Wafer ena e tsamaisana le lisebelisoa tse fapaneng tse kang Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, le Epi Wafer, e fana ka mekhoa e mengata e fapaneng bakeng sa lits'ebetso tse fapaneng tsa masela. Ho feta moo, e tsamaisana hantle le mahlale a tsoetseng pele joalo ka Gallium Oxide Ga2O3 le AlN Wafer, ho netefatsa hore e ka kopanngoa le lits'ebetso tse ikhethang haholo. Bakeng sa ts'ebetso e bonolo, sephaphatha se ntlafalitsoe hore se sebelisoe le lits'ebetso tsa Cassette tsa maemo a indasteri, ho netefatsa ts'ebetso e ntle ea tlhahiso ea semiconductor.

Mohala oa sehlahisoa oa VET Energy ha o felle feela ho li-wafers tsa silicon. Re boetse re fana ka lisebelisoa tse ngata tse fapaneng tsa semiconductor substrate, ho kenyeletsoa SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, joalo-joalo, hammoho le lisebelisoa tse ncha tse pharalletseng tsa semiconductor tse kang Gallium Oxide Ga2O3 le AlN Wafer. Lihlahisoa tsena li ka fihlela litlhoko tsa ts'ebeliso ea bareki ba fapaneng ho lisebelisoa tsa motlakase tsa motlakase, maqhubu a seea-le-moea, li-sensor le likarolo tse ling.

Libaka tsa kopo:
•Li-chips tsa logic:Ho hlahisa li-chips tse sebetsang hantle haholo tse kang CPU le GPU.
•Li-chips tsa memori:Ho hlahisa li-memory chips tse kang DRAM le NAND Flash.
•Li-chips tsa Analog:Ho etsoa ha lichipisi tsa analoge tse kang ADC le DAC.
•Sensora:Li-sensor tsa MEMS, li-sensor tsa litšoantšo, joalo-joalo.

VET Energy e fa bareki litharollo tsa liphaephe tse ikhethileng, 'me e khona ho etsa li-wafers ka mokhoa o fapaneng oa ho hanyetsa, likahare tse fapaneng tsa oksijene, botenya bo fapaneng le litlhaloso tse ling ho latela litlhoko tse ikhethileng tsa bareki. Ntle le moo, re fana ka ts'ehetso ea botekgeniki le ts'ebeletso ea kamora thekiso ho thusa bareki ho ntlafatsa ts'ebetso ea tlhahiso le ho ntlafatsa chai ea sehlahisoa.

LIEKETSENG TSIETSO

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
Ntho	nP	n-Pm	n-Pes	SI	SI
TTV(GBIR)	≤6um	≤6um
Bow(GF3YFCD)-Boleng bo Felletseng	≤15μm	≤15μm	≤25μm		≤15μm
Warp(GF3YFER)	≤25μm	≤25μm	≤40μm		≤25μm
LTV(SBIR) -10mmx10mm	<2μm
Wafer Edge	Beveling

SEBAKA PHETHA

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
	nP	n-Pm	n-Pes	SI	SI
Surface Finish	Mahlakore a mabeli a Optical Polish, Si- Face CMP
SurfaceRoughness	(10um x 10um) Si-FaceRa≤0.2nm C-Face Ra≤ 0.5nm			(5umx5um) Si-Face Ra≤0.2nm C-Face Ra≤0.5nm
Li-Chips tsa Edge	Ha ho e dumellwe (bolelele le bophara≥0.5mm)
Li-indent	Ha ho le e 'ngoe e Lumelloang
Scratches(Si-Face)	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer			Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer
Mapetso	Ha ho le e 'ngoe e Lumelloang
Kenyelletso ea Edge	3mm