Silicon Carbide (SiC) Epitaxial Wafer

Tlhaloso e Khutšoanyane:

Silicon Carbide (SiC) Epitaxial Wafer e tsoang ho VET Energy ke setsi sa tšebetso se phahameng se etselitsoeng ho fihlela litlhoko tse batloang ke matla a moloko o latelang le lisebelisoa tsa RF. VET Energy e etsa bonnete ba hore epitaxial wafer e 'ngoe le e' ngoe e etsoa ka hloko ho fana ka conductivity e phahameng ea mocheso, motlakase oa ho senya, le motsamao oa thepa, e leng se etsang hore e be se loketseng bakeng sa lisebelisoa tse kang likoloi tsa motlakase, puisano ea 5G le lisebelisoa tsa elektronike tse sebetsang hantle haholo.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

VET Energy silicon carbide (SiC) epitaxial wafer ke sesebelisoa sa semiconductor se sebetsang hantle haholo se nang le semiconductor se nang le mocheso o phahameng o matla, maqhubu a phahameng le litšobotsi tse matla tsa matla. Ke substrate e loketseng bakeng sa moloko o mocha oa lisebelisoa tsa elektroniki tsa matla. VET Energy e sebelisa theknoloji e tsoetseng pele ea MOCVD epitaxial ho holisa likarolo tsa boleng bo holimo tsa SiC epitaxial holim'a li-substrates tsa SiC, ho netefatsa ts'ebetso e ntle haholo le botsitso ba sephaphatha.

Silicon Carbide (SiC) Epitaxial Wafer ea rona e fana ka tšebelisano e ntle haholo le lisebelisoa tse fapaneng tsa semiconductor tse kenyelletsang Si Wafer, SiC Substrate, SOI Wafer, le SiN Substrate. Ka sekhahla sa eona se matla sa epitaxial, e ts'ehetsa lits'ebetso tse tsoetseng pele joalo ka kholo ea Epi Wafer le kopanyo le lisebelisoa tse kang Gallium Oxide Ga2O3 le AlN Wafer, e netefatsang ts'ebeliso e fapaneng ho mahlale a fapaneng. E etselitsoe hore e lumellane le mekhoa ea ho sebetsana le lik'hasete tse tloaelehileng tsa indasteri, e tiisa ts'ebetso e sebetsang hantle le e bonolo libakeng tsa tlhahiso ea semiconductor.

Mohala oa sehlahisoa oa VET Energy ha o felle feela ho li-wafers tsa SiC epitaxial. Re boetse re fana ka mefuta e mengata e fapaneng ea lisebelisoa tsa semiconductor substrate, ho kenyeletsoa Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, joalo-joalo. Ho feta moo, re ntse re nts'etsapele lisebelisoa tse ncha tse pharalletseng tsa semiconductor tse kang Gallium Oxide Ga2O3 le AlN. Wafer, ho fihlela tlhoko ea indasteri ea lisebelisoa tsa elektroniki tsa nako e tlang bakeng sa lisebelisoa tse phahameng tsa ts'ebetso.

Libeke tse 6-36
Libeke tse 6-35

LIEKETSENG TSIETSO

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho

8-Intshi

6-Intshi

4-Intshi

nP

n-Pm

n-Pes

SI

SI

TTV(GBIR)

≤6um

≤6um

Bow(GF3YFCD)-Boleng bo Felletseng

≤15μm

≤15μm

≤25μm

≤15μm

Warp(GF3YFER)

≤25μm

≤25μm

≤40μm

≤25μm

LTV(SBIR) -10mmx10mm

<2μm

Wafer Edge

Beveling

SEBAKA PHETHA

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho

8-Intshi

6-Intshi

4-Intshi

nP

n-Pm

n-Pes

SI

SI

Surface Finish

Mahlakore a mabeli a Optical Polish, Si- Face CMP

SurfaceRoughness

(10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm

Li-Chips tsa Edge

Ha ho e dumellwe (bolelele le bophara≥0.5mm)

Li-indent

Ha ho le e 'ngoe e Lumelloang

Scratches(Si-Face)

Kty.≤5, Kakaretso
Bolelele≤0.5× bophara ba wafer

Kty.≤5, Kakaretso
Bolelele≤0.5× bophara ba wafer

Kty.≤5, Kakaretso
Bolelele≤0.5× bophara ba wafer

Mapetso

Ha ho le e 'ngoe e Lumelloang

Kenyelletso ea Edge

3mm

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