Inogona kuita advanced material yekucheka, micro jet laser processing equipment

Tsanangudzo Pfupi

Iyo yakatarisana nelaser beam inosanganiswa mujeti yemvura inomhanya-mhanya, uye danda resimba rine kugovera kwakafanana kwesimba remuchinjiko rinoumbwa mushure mekufungisisa kuzere pamadziro emukati membiru yemvura.Iine maitiro ehupamhi hwemutsara wakaderera, simba guru remasimba, hutungamiri hunodzoreka uye chaiyo-nguva kuderedzwa kwekushisa kwepamusoro kwezvinhu zvakagadziridzwa, zvichipa mamiriro ezvinhu akanaka ekugadzirisa uye kupedzisa kupedzisa kwezvinhu zvakaoma uye zvinoputika.

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Zvakanakira zveLMJ kugadzirisa

Iko kukanganiswa kweiyo yakajairwa laser kugadzirisa kunogona kukundwa nekushandisa kwakangwara kwelaser Laser micro jet (LMJ) tekinoroji kuparadzira hunhu hwemvura nemhepo.Iyi tekinoroji inobvumira iyo laser pulses inonyatso kuratidzwa mune yakagadziriswa yakakwirira kuchena yemvura jeti nenzira isina kukanganiswa kusvika kune machining pamusoro senge mune optical fiber.Kubva pamaonero ekushandiswa, iwo makuru maitiro eLMJ tekinoroji ndeaya anotevera:

1.Laser beam is a columnar (parallel) structure.

2.Laser pulse inoparadzirwa mumvura yejet se optical fiber, iyo inodzivirirwa kubva kune chero kukanganisa kwezvakatipoteredza.

3.Iyo laser beam inotariswa mumidziyo yeLMJ, uye hapana shanduko mukukwirira kwenzvimbo yakashongedzwa panguva yese yekugadzira machining, kuitira kuti pasave nechikonzero chekuenderera mberi nekutarisa nekuchinja kwekugadzirisa kudzika panguva yekugadzira machining process.

4.Kuwedzera pakubviswa kwechigadzirwa chebasa chakaitika panguva yega yega laser pulses, ingangoita 99% yenguva mune imwe neimwe unit nguva kubva pakutanga kwepuru yega yega kusvika kune inotevera pulse, iyo yakagadziriswa zvinhu iri mu real-time kutonhora kwe. mvura, nokudaro inenge ichidzima nzvimbo yakakanganiswa nekupisa uye remelting layer, asi kuchengetedza kushanda kwepamusoro kwekugadzirisa.

5.Ramba uchichenesa nzvimbo yakagadziriswa.

micro-jet laser yekucheka technolgoy (2)

micro-jet laser yekucheka technolgoy (1)

General specification	LCSA-100	LCSA-200
Countertop volume	125 x 200 x 100	460×460×300
Linear axis XY	Linear mota.Linear mota	Linear mota.Linear mota
Linear axis Z	100	300
Kuisa chokwadi μm	+/ - 5	+/ - 3
Kudzokororwa kwenzvimbo chaiyo μm	+/ - 2	+/ - 1
Kuwedzera G	0.5	1
Numerical control	3-axis	3-axis
Laser
Laser mhando	DPSS Nd: YAG	DPSS Nd: YAG, kupomba
Wavelength nm	532/1064	532/1064
Rated power W	50/100/200	200/400
Jet yemvura
Nozzle dhayamita μm	25-80	25-80
Nozzle pressure bar	100-600	0-600
Saizi/uremu
Dimensions (Muchina) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Dimensions (control cabinet) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Huremu (midziyo) kg	1170	2500-3000
Kurema (control cabinet) kg	700-750	700-750
Kushandiswa kwesimba kwakakwana
Input	AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1%	AC 400 V +6%/-10%, 3-chikamu50/60 Hz ±1%
Peak value	2.5kVA	2.5kVA
Join	10 m tambo yemagetsi: P+N+E, 1.5 mm2	10 m tambo yemagetsi: P+N+E, 1.5 mm2
Semiconductor indasitiri mushandisi application renji	≤4 inches yakapoteredza ingot ≤4 inches ingot zvimedu ≤4 inches ingot kunyora	≤6 inches yakapoteredza ingot ≤6 inch ingot zvimedu ≤6 inches ingot kunyora Muchina uyu unosangana ne8-inch denderedzwa / kucheka / kutema theoretical kukosha, uye chaiyo inoshanda mhedzisiro inoda kuve yakagadziridzwa yekucheka zano.