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  • Uiga o le silicon carbide graphite mold

    Uiga o le silicon carbide graphite mold

    Silicon Carbide Graphite Mold Silicon carbide graphite mold o se mea faʻapipiʻi tuʻufaʻatasia ma le silicon carbide (SiC) o le faʻavae ma le kalafi e fai ma mea faʻamalosi. O lenei limu o loʻo i ai le faʻaleleia lelei o le vevela, teteʻe maualuga o le vevela, teteʻe o le pala ma le toe faʻaogaina ...
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  • Semiconductor fa'agasologa atoa o le photolithography

    Semiconductor fa'agasologa atoa o le photolithography

    O le gaosiga o oloa semiconductor taitasi e manaʻomia ai le faitau selau o faʻagasologa. Matou te vaevaeina le faagasologa atoa o le gaosiga i laasaga e valu: faʻapipiʻi faʻamaʻi-oxidation-photolithography-etching-thin film deposition-epitaxial growth-diffusion-ion implantation. Ina ia fesoasoani ia te oe...
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  • 4 piliona! SK Hynix fa'asalalau semiconductor fa'apipi'i fa'apipi'i fa'apipi'i i Purdue Research Park

    4 piliona! SK Hynix fa'asalalau semiconductor fa'apipi'i fa'apipi'i fa'apipi'i i Purdue Research Park

    West Lafayette, Indiana – SK hynix Inc. na fa'asalalauina fuafuaga e fa'aagaga le toeitiiti $4 piliona e fausia ai se fale gaosi oloa fa'apipi'i fa'apitoa ma le R&D mo oloa fa'apitoa i le Purdue Research Park. Fa'atuina se feso'ota'iga autu i le US semiconductor supply chain i West Lafayett...
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  • Tekinolosi leisa ta'ita'ia le suiga o le silicon carbide substrate faiga tekinolosi

    Tekinolosi leisa ta'ita'ia le suiga o le silicon carbide substrate faiga tekinolosi

    1. Va'aiga lautele o le silicon carbide substrate process technology O lo'o iai nei la'asaga o le gaosiga o le substrate silicon carbide e aofia ai: oloina le li'o fafo, slicing, chamfering, grinding, polishing, cleaning, etc. Slicing o se laasaga taua i le semiconductor substrate proc ...
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  • Mea fa'amea fa'aaluma fa'aa'oa'oga: C/C mea tu'ufa'atasi

    Mea fa'amea fa'aaluma fa'aa'oa'oga: C/C mea tu'ufa'atasi

    Carbon-carbon composite o se ituaiga o carbon fiber composite, faʻatasi ai ma alava kaponi e fai ma mea faʻamalosi ma teuina kaponi e fai ma mea matrix. O le matrix o C/C composite o le carbon. Talu ai e toetoe lava a aofia ai le carbon elemental, e sili ona lelei le maualuga o le vevela ...
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  • Tolu auala tetele mo le tuputupu aʻe tioata SiC

    Tolu auala tetele mo le tuputupu aʻe tioata SiC

    E pei ona faʻaalia i le Ata 3, e tolu auala faʻapitoa e faʻamoemoe e tuʻuina atu SiC tioata tasi ma le maualuga ma le aoga: epitaxy vaega vai (LPE), felauaiga ausa faaletino (PVT), ma le vevela vevela vevela (HTCVD). O le PVT o se faiga faʻavae lelei mo le gaosia o le SiC agasala ...
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  • Tulaga tolu-tupulaga semiconductor GaN ma feso'ota'iga epitaxial tekonolosi fa'amatalaga puupuu

    Tulaga tolu-tupulaga semiconductor GaN ma feso'ota'iga epitaxial tekonolosi fa'amatalaga puupuu

    1. Semiconductor augatupulaga lona tolu O le tekonolosi semiconductor muamua-tupulaga na atiae e faavae i luga o mea semiconductor e pei o Si ma Ge. O le faʻavae faʻavae mo le atinaʻeina o transistors ma fesoʻotaʻiga fesoʻotaʻiga tekonolosi. O mea muamua-augatupulaga semiconductor na faataatia ai le f...
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  • 23.5 piliona, Suzhou's super unicorn o le a alu i IPO

    23.5 piliona, Suzhou's super unicorn o le a alu i IPO

    Ina ua maeʻa le 9 tausaga o pisinisi, ua siitia e le Innoscience le sili atu i le 6 piliona yuan i le faʻatupeina atoa, ma o lona faʻatatauina ua oʻo i le 23.5 piliona yuan. O le lisi o tagata teu tupe e tusa ma le tele o kamupani: Fukun Venture Capital, Dongfang State-owned Assets, Suzhou Zhanyi, Wujian...
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  • E fa'afefea ona fa'aleleia e oloa fa'apipi'i tantalum carbide le tete'e atu o mea?

    E fa'afefea ona fa'aleleia e oloa fa'apipi'i tantalum carbide le tete'e atu o mea?

    Tantalum carbide coating ose fa'aoga masani fa'atekonolosi i luga ole laiga lea e mafai ona fa'aleleia atili ai le fa'alumaina o mea. Tantalum carbide coating e mafai ona faʻapipiʻi i luga o le substrate e ala i auala eseese sauniuni, e pei o le vailaʻau vailaʻau, physica ...
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