Mtundu wa SiC Wafer wa 6 Inchi N umapangidwira kuti ugwire bwino ntchito m'malo ovuta kwambiri, ndikupangitsa kukhala chisankho chabwino pamapulogalamu omwe amafunikira mphamvu yayikulu komanso kukana kutentha. Zopangira zazikulu zomwe zimagwirizana ndi chophikachi ndi Si Wafer, SiC Substrate, SOI Wafer, ndi SiN Substrate. Zidazi zimawonetsetsa kuti zimagwira ntchito bwino m'njira zosiyanasiyana zopangira semiconductor, zomwe zimathandizira zida zomwe zili ndi mphamvu komanso zolimba.
Kwa makampani omwe amagwira ntchito ndi Epi Wafer, Gallium Oxide Ga2O3, Cassette, kapena AlN Wafer, VET Energy's 6 Inch N Type SiC Wafer imapereka maziko ofunikira pakupanga zinthu zatsopano. Kaya ndi zamagetsi zamagetsi zamphamvu kwambiri kapena zamakono zamakono za RF, zophika izi zimatsimikizira kusinthasintha kwabwino komanso kukana kutentha pang'ono, kukankhira malire a magwiridwe antchito ndi magwiridwe antchito.
ZINTHU ZONSE
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
Kanthu | 8-inchi | 6-inchi | 4-inchi | ||
nP | n-pm | n-Zam | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Bow(GF3YFCD) -Mtheradi Wamtengo Wapatali | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
Warp(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR) -10mmx10mm | <2 mu | ||||
Wafer Edge | Beveling |
PAMENE MALIZA
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
Kanthu | 8-inchi | 6-inchi | 4-inchi | ||
nP | n-pm | n-Zam | SI | SI | |
Pamwamba Pamwamba | Mbali ziwiri za Optical Polish, Si- Face CMP | ||||
SurfaceRoughness | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
Chips za Edge | Palibe Chololedwa (kutalika ndi m'lifupi ≥0.5mm) | ||||
Inde | Palibe Chololedwa | ||||
Zikwapu (Si-Face) | Unyinji.≤5, Zowonjezera | Unyinji.≤5, Zowonjezera | Unyinji.≤5, Zowonjezera | ||
Ming'alu | Palibe Chololedwa | ||||
Kupatula M'mphepete | 3 mm |