ʻO ka 6 Inch Semi Insulating SiC Wafer mai VET Energy kahi hopena holomua no nā noi mana kiʻekiʻe a me nā alapine kiʻekiʻe, e hāʻawi ana i ka conductivity thermal kiʻekiʻe a me ka insulation uila. Pono kēia mau wafers semi-insulating i ka hoʻomohala ʻana i nā mea hana e like me RF amplifier, hoʻololi mana, a me nā mea kiʻekiʻe-voltage ʻē aʻe. Mālama ʻo VET Energy i ka maikaʻi a me ka hana ʻana, e hana ana i kēia mau wafers i kūpono no kahi ākea o nā kaʻina hana semiconductor.
Ma waho aʻe o kā lākou mau waiwai insulating koʻikoʻi, ua kūpono kēia mau wafers SiC me nā ʻano mea like ʻole me Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, a me Epi Wafer, e hoʻolilo iā lākou i mea maʻalahi no nā ʻano hana hana like ʻole. Eia kekahi, hiki ke hoʻohana ʻia nā mea kiʻekiʻe e like me Gallium Oxide Ga2O3 a me AlN Wafer i hui pū ʻia me kēia mau wafers SiC, e hāʻawi ana i ka maʻalahi o nā mea uila uila kiʻekiʻe. Hoʻolālā ʻia nā wafers no ka hoʻohui pono ʻana me nā ʻōnaehana lawelawe maʻamau e like me nā ʻōnaehana Cassette, e hōʻoiaʻiʻo ana i ka maʻalahi o ka hoʻohana ʻana i nā hoʻonohonoho hana nui.
Hāʻawi ʻo VET Energy i kahi kōpili piha o nā substrate semiconductor, me Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, Gallium Oxide Ga2O3, a me AlN Wafer. Hāʻawi kā mākou laina huahana like ʻole i nā pono o nā noi uila like ʻole, mai ka uila uila a hiki i ka RF a me ka optoelectronics.
Hāʻawi ʻo 6 inch semi-insulating SiC wafer i nā pono he nui:
Kiʻekiʻe breakdown voltage: ʻO ka bandgap ākea o SiC hiki ke kiʻekiʻe kiʻekiʻe breakdown voltages, e ʻae ai i nā mea mana paʻa a maikaʻi.
ʻO ka hana wela kiʻekiʻe: ʻO ka conductivity thermal maikaʻi loa o SiC e hiki ai ke hana i nā wela kiʻekiʻe, e hoʻomaikaʻi i ka hilinaʻi o ka mea hana.
Haʻahaʻa ma ke kū'ē: hōʻike nā mea SiC i ka haʻahaʻa ma ke kū'ē, e hōʻemi ana i ka nalowale o ka mana a me ka hoʻomaikaʻi ʻana i ka ikehu.
Hāʻawi ʻo VET Energy i nā wafers SiC maʻamau e hoʻokō i kāu mau koi kikoʻī, me nā mānoanoa like ʻole, nā pae doping, a me ka pau ʻana o ka ʻili. Hāʻawi kā mākou hui loea i ke kākoʻo ʻenehana a me ka lawelawe ma hope o ke kūʻai aku e hōʻoia i kāu kūleʻa.
OLELO HOOLAHA WAFERING
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
'ikamu | 8-Inika | 6-Iniha | 4-Iniha | ||
nP | n-Pm | n-Ps | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Kakaka (GF3YFCD)-Waiwai Loa | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
Warp(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR)-10mmx10mm | <2μm | ||||
Wafer Edge | ʻO ka beveling |
PAPA IHO
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
'ikamu | 8-Inika | 6-Iniha | 4-Iniha | ||
nP | n-Pm | n-Ps | SI | SI | |
Hoʻopau ʻili | ʻaoʻao ʻelua Optical Polish, Si- Face CMP | ||||
ʻAhaʻulaʻula | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
ʻOpi ʻEke | ʻAʻohe ʻae ʻia (lōʻihi a laula≥0.5mm) | ||||
Indents | ʻAʻole ʻae ʻia | ||||
Nā ʻōpala (Si-Face) | Ka nui.≤5, Huihui | Ka nui.≤5, Huihui | Ka nui.≤5, Huihui | ||
māwae | ʻAʻole ʻae ʻia | ||||
Hoʻokuʻu Edge | 3mm |