Fan out wafer level packaging (FOWLP) inzira inodhura-inoshanda muindasitiri yesemiconductor. Asi zvakajairika mhedzisiro yeiyi maitiro ari warping uye chip offset. Kunyangwe nekuenderera mberi kwekuvandudzwa kwewafer level uye panel level fan out tekinoroji, idzi nyaya dzine chekuita nekuumbwa dzichiripo.
Warping inokonzerwa nemakemikari shrinkage yemvura compression molding compound (LCM) panguva yekurapa uye kutonhora mushure mekuumbwa. Chikonzero chechipiri chekurwa ndeye kusawirirana mu coefficient yekuwedzera kwekupisa (CTE) pakati pesilicon chip, kuumba zvinhu, uye substrate. Offset imhaka yekuti viscous molding zvinhu zvine yakakwira filler zvemukati zvinowanzo shandiswa chete pasi pekushisa kwakanyanya uye kudzvanywa kwakanyanya. Sezvo iyo chip inogadziriswa kune inotakura kuburikidza nekubatana kwenguva pfupi, kuwedzera tembiricha kunopfavisa iyo inonamatira, nekudaro ichideredza simba rayo rekunamatira uye kuderedza kugona kwayo kugadzirisa chip. Chikonzero chechipiri chekugadzirisa ndechekuti kudzvanywa kunodiwa pakuumbwa kunogadzira kushushikana pane imwe neimwe chip.
Kuti vawane mhinduro kumatambudziko aya, DELO yakaita ongororo yekugoneka nekubatanidza iri nyore analogi chip pamutakuri. Panyaya yekuseta, iyo inotakura wafer yakashongedzwa neinonamatira yenguva pfupi, uye chip inoiswa yakatarisana pasi. Mushure meizvozvo, chidimbu chakaumbwa chichishandisa yakaderera viscosity DELO adhesive uye yakarapwa neultraviolet mwaranzi isati yabvisa chinotakura chinotakura. Mumashandisirwo akadai, yakakwira viscosity thermosetting molding composites inowanzoshandiswa.
DELO akafananidzawo iyo warpage ye thermosetting yekuumba zvinhu uye UV yakarapwa zvigadzirwa mukuyedza, uye mhedzisiro yakaratidza kuti zvakajairwa zvekuumba zvinhu zvaizoita kutenderera panguva yekutonhora mushure me thermosetting. Naizvozvo, kushandisa tembiricha yekamuri ultraviolet kurapa pachinzvimbo chekudziya kurapa kunogona kudzikisa zvakanyanya kukanganisa kwekupisa kwekuwedzera coefficient mismatch pakati pemuumbi wekuumba uye mutakuri, nekudaro kuderedza kurwa kusvika pamwero mukuru unobvira.
Iko kushandiswa kwe ultraviolet kurapa zvinhu kunogona zvakare kuderedza kushandiswa kwemafuta, nekudaro kuderedza viscosity uye Young's modulus. Iyo viscosity yemhando yekunamatira yakashandiswa muyedzo ndeye 35000 mPa · s, uye iyo Yechidiki modulus ndeye 1 GPa. Nekuda kwekushaikwa kwekudziya kana kudzvanywa kwepamusoro pazvinhu zvekuumba, chip offset inogona kudzikiswa kusvika pamwero mukuru unobvira. Mushonga wakajairwa wekuumba une viscosity ingangoita 800000 mPa · s uye Yechidiki's modulus muhuwandu hwemanhamba maviri.
Pakazere, tsvagiridzo yakaratidza kuti kushandisa UV yakarapwa zvinhu zvekuumba-nzvimbo yakakura kunobatsira kugadzira chip leader fan out wafer level kurongedza, uku uchideredza warpage uye chip offset kusvika pamwero mukuru unobvira. Pasinei nekusiyana kwakakura mumafuta ekuwedzera coefficients pakati pezvinhu zvinoshandiswa, iyi nzira ichine maitiro akawanda nekuda kwekushayikwa kwekusiyana kwekushisa. Uye zvakare, kurapa kweUV kunogona zvakare kuderedza kurapa nguva uye kushandiswa kwesimba.
UV pachinzvimbo chekurapa kwemafuta inoderedza warpage uye kufa kuchinja mune fan-out wafer-level kurongedza.
Kuenzanisa kwema 12-inch akafukidzwa mawaferi uchishandisa iyo thermally yakaporeswa, yakakwirira-yekuzadza komisheni (A) uye UV-yakaporeswa komisheni (B)
Nguva yekutumira: Nov-05-2024