fan out wafer degree packaging (FOWLP) muindasitiri yesemiconductor inozivikanwa nekudhura-inoshanda, asi haina dambudziko rayo. Imwe yenyaya huru inotarisana nayo ndeye warp uye zvishoma kutanga panguva yekuumba maitiro. warp inogona kuverengerwa kune kemikari kuderera kwemuumbi wekuumba uye kusapindirana mune coefficient yekuwedzera kwemafuta, nepo kutanga kuchiitika nekuda kwekuwanda kwekuzadza mune syrupy molding zvinhu. Zvisinei, nerubatsiro rweAI isingaonekwe, mhinduro iri kutsvagisa kuti zvigadzirise matambudziko aya.
DELO, kambani inotungamira muindastiri, inoita ongororo inogoneka kugadzirisa nyaya iyi nekubatanidza zvishoma pane inotakura kushandiswa yakaderera viscosity adhesive zvinhu uye ultraviolet kuomesa. Nekuenzanisa iyo warpage yezvinhu zvakasiyana, zvakaonekwa kuti kuomarara kwe ultraviolet kunoderedza zvakanyanya warp panguva yekutonhodza nguva mushure mekuumbwa. Iko kushandiswa kweiyo ultraviolet kuomesa zvinhu haingodzikisi kudiwa kwekuzadza asi zvakare kuderedza viscosity uye Young's modulus, pakupedzisira kuderedza zvishoma kutanga. Uku kukwidziridzwa muhunyanzvi hwekugadzira tekinoroji kunoratidza mukana wekugadzira bit leader fan out wafer degree packaging ine shoma warpage uye bit kutanga.
Pakazere, tsvakiridzo iyi inosimbisa bhenefiti rekushandisa ultraviolet kuomesa mune yakakura-nzvimbo yekuumba maitiro, inopa mhinduro kune dambudziko rinotarisana nefan-out wafer-degree packaging. Nekugona kudzikisa warpage uye kufa kushanduka, ukuwo firimu kugadzirisa pasi pakuomesa nguva uye simba rekushandisa, ultraviolet kuomesa purofesa kuve vimbiso yehunyanzvi muindasitiri yesemiconductor. Kunyangwe paine mutsauko mukupisa kwekuwedzera coefficient pakati pezvinhu, kushandiswa kweultraviolet kuomarara kunopa sarudzo inogoneka yekuvandudza kushanda uye kunaka kwewafer degree kurongedza.
Nguva yekutumira: Oct-28-2024