UV Gutunganya Umufana-Hanze Wafer-Urwego rwo gupakira

Fan out wafer urwego rwo gupakira (FOWLP) nuburyo buhendutse mubikorwa bya semiconductor. Ariko ingaruka zisanzwe ziyi nzira zirimo kurwana no gukuramo chip. Nuburyo bukomeza kunoza urwego rwa wafer hamwe nurwego rwabafana urwego rwikoranabuhanga, ibi bibazo bijyanye no kubumba biracyahari.

Intambara iterwa no kugabanuka kwimiti ya compression yamashanyarazi (LCM) mugihe cyo gukiza no gukonjesha nyuma yo kubumba. Impamvu ya kabiri yo kurwana ni ukudahuza coefficient yo kwagura ubushyuhe (CTE) hagati ya chip ya silicon, ibikoresho bibumba, na substrate. Offset iterwa nuko ibikoresho byo kubumba ibishishwa birimo ibintu byinshi byuzuza bishobora gukoreshwa gusa mubushyuhe bwinshi hamwe numuvuduko mwinshi. Nkuko chip yashizwe kubitwara binyuze muguhuza byigihe gito, kongera ubushyuhe bizoroshya ibifatika, bityo bigabanye imbaraga zifatika kandi bigabanye ubushobozi bwo gutunganya chip. Impamvu ya kabiri yo guhagarika ni uko igitutu gisabwa kugirango kibumbwe gitera guhangayika kuri buri chip.

Kugirango tubone ibisubizo by'ibi bibazo, DELO yakoze ubushakashatsi bushoboka muguhuza chip yoroheje igereranya nuwitwaye. Kubijyanye no gushiraho, wafer yabatwara yashizwe hamwe nigihe gito cyo guhuza, kandi chip igashyirwa mumaso hasi. Icyakurikiyeho, wafer yabumbabumbwe hifashishijwe icyuma gito cya DELO gifata kandi gikiza imirasire ya ultraviolet mbere yo gukuraho wafer. Mubikorwa nkibi, ubukonje bwinshi bwa thermosetting molding composite ikoreshwa muburyo busanzwe.

DELO yagereranije kandi urupapuro rwibikoresho byo kubumba hamwe na UV byakize mubushakashatsi, kandi ibisubizo byerekanaga ko ibikoresho bisanzwe byo kubumba byari kurwara mugihe cyo gukonja nyuma yubushyuhe. Kubwibyo, gukoresha ubushyuhe bwicyumba ultraviolet gukiza aho gushyushya gukiza birashobora kugabanya cyane ingaruka ziterwa no kwaguka kwinshi kwubushyuhe bwumuriro hagati yikibumbano hamwe nuwitwaye, bityo bikagabanya intambara kuburyo bushoboka bwose.

Gukoresha ibikoresho bya ultraviolet bikiza birashobora kandi kugabanya ikoreshwa ryuzuza, bityo bikagabanya ubukonje hamwe na modulus ya Young. Ubwiza bwikigereranyo cyicyitegererezo gikoreshwa mugupimisha ni 35000 mPa · s, naho Modulus ya Young ni 1 GPa. Bitewe no kubura ubushyuhe cyangwa umuvuduko mwinshi kubikoresho bibumba, chip offset irashobora kugabanywa kuburyo bushoboka bwose. Ubwoko busanzwe bwo kubumba bufite ubwiza bwa mPa · s 800000 hamwe na Modulus ya Young murwego rwimibare ibiri.

Muri rusange, ubushakashatsi bwerekanye ko gukoresha ibikoresho UV byakize muguhindura ahantu hanini bifite akamaro mugukora chip umuyobozi wa chip hanze yapakira urwego rwa wafer, mugihe hagabanijwe urupapuro rwintambara na chip offset kuburyo bushoboka bwose. Nubwo hari itandukaniro rigaragara muri coefficient zo kwagura ubushyuhe hagati yibikoresho byakoreshejwe, iyi nzira iracyafite porogaramu nyinshi kubera kubura ubushyuhe butandukanye. Byongeye kandi, gukiza UV birashobora kandi kugabanya igihe cyo gukiza no gukoresha ingufu.

UV aho gukiza ubushyuhe igabanya warpage hanyuma igapfa guhinduka mubafana-wafer urwego

Kugereranya waferi ya santimetero 12 zifunze ukoresheje ubushyuhe bukize, bwuzuye-bwuzuye (A) hamwe na UV ikize (B)