fan out wafer degree packaging (FOWLP) muruganda rwa semiconductor izwiho kuba igiciro cyinshi, ariko ntabwo ari ikibazo cyayo. Kimwe mubibazo nyamukuru guhangana ni warp na bit bitangira mugihe cyo kubumba. warp irashobora kuba ingirakamaro kugabanya imiti igabanya imiterere no kudahuza muri coefficente yo kwaguka kwinshi, mugihe itangira riba kubera ibintu byinshi byuzuza ibintu bya sirupi. Ariko, hamwe nubufasha bwaAI idashobora kumenyekana, igisubizo ni ubushakashatsi kugirango ubone neza ibyo bibazo.
DELO, isosiyete ikomeye mu nganda, ikora ubushakashatsi bushoboka kugira ngo iki kibazo gikemuke uhuza gato ku gutwara ibintu bitwara ibintu bike kandi bifata ultraviolet. Ugereranije urupapuro rwibikoresho bitandukanye, byagaragaye ko gukomera ultraviolet bigabanya cyane intambara mugihe cyo gukonja nyuma yo kubumba. Gukoresha ultraviolet gukomera ibintu ntibigabanya gusa ibyuzuzwa ahubwo binagabanya ubukonje hamwe na Modulus ya Young, amaherezo kugabanya bitangira. Iterambere mu ikoranabuhanga ryerekana ubushobozi bwo gutanga umusaruro wa bayobozi bafana hanze ya wafer ipakira hamwe na warpage ntoya kandi bitangiye.
Muri rusange, ubushakashatsi bwerekana inyungu zo gukoresha ultraviolet gukomera muburyo bunini bwo kubumba, bitanga igisubizo cyibibazo bihura nabyo mubipfunyika bwa wafer. Hamwe nubushobozi bwo kugabanya urupapuro rwintambara no gupfa guhindagurika, mugihe kandi hahinduwe firime mugihe cyo gukomera nigihe cyo gukoresha ingufu, umwarimu ukomeye wa ultraviolet kuba tekinike yamasezerano mubikorwa bya semiconductor. Nuburyo butandukanye bwo kwagura ubushyuhe bwumuriro hagati yibikoresho, ikoreshwa rya ultraviolet gukomera ryerekana uburyo bushoboka bwo kurushaho kunoza imikorere nubuziranenge bwapakira impamyabumenyi.
Igihe cyo kohereza: Ukwakira-28-2024