I-wafer warpage, yini okufanele uyenze?

Enqubweni ethile yokupakisha, izinto zokupakisha ezinama-coefficients ahlukene okwandisa ukushisa asetshenziswa. Phakathi nenqubo yokupakisha, i-wafer ifakwa ku-substrate yokupakisha, bese kwenziwa izinyathelo zokufudumeza nokupholisa ukuze kuqedelwe ukupakisha. Kodwa-ke, ngenxa yokungafani phakathi kwe-coefficient yokunweba okushisayo kwempahla yokupakisha kanye ne-wafer, ingcindezi yokushisa ibangela ukuthi i-wafer iguqe. Woza uzobheka nomhleli~

Yini i-wafer warpage?

I-waferI-warpage isho ukugoba noma ukusonteka kwewafa phakathi nenqubo yokupakisha.I-waferI-warpage ingase ibangele ukuchezuka kokuqondanisa, izinkinga zokushisela kanye nokonakala kokusebenza kwedivayisi phakathi nenqubo yokupakisha.

Ukwehliswa kokunemba kokupakisha:I-waferI-warpage ingase ibangele ukuchezuka kokuqondanisa phakathi nenqubo yokupakisha. Uma i-wafer ishintsha phakathi nenqubo yokupakisha, ukuqondanisa phakathi kwe-chip nedivayisi ehlanganisiwe kungase kuthinteke, okuholela ekuhlulekeni kokuqondisa ngokunembile izikhonkwane zokuxhuma noma amalunga e-solder. Lokhu kunciphisa ukunemba kwephakheji futhi kungase kubangele ukusebenza kwedivayisi okungazinzile noma okungathembekile.

Ukwenyuka kwengcindezi yemishini:I-waferI-warpage yethula ukucindezelwa komshini okwengeziwe. Ngenxa yokuguqulwa kwe-wafer ngokwayo, ukucindezeleka komshini okusetshenziswa ngesikhathi senqubo yokupakisha kungase kwande. Lokhu kungase kubangele ukugxiliswa kwengcindezi ngaphakathi kwewafa, kuthinte kabi okokusebenza nesakhiwo socingo, futhi kubangele nokulimala kwe-wafer yangaphakathi noma ukwehluleka kwedivayisi. 

Ukwehliswa kokusebenza:I-wafer warpage ingase ibangele ukonakala kokusebenza kwedivayisi. Izingxenye kanye nesakhiwo sesifunda ku-wafer yakhelwe ngokusekelwe endaweni eyisicaba. Uma i-wafer warps, ingase ithinte ukuxhumana kukagesi, ukudluliswa kwesignali nokuphathwa kokushisa phakathi kwamadivaysi. Lokhu kungase kubangele izinkinga ekusebenzeni kukagesi, isivinini, ukusetshenziswa kwamandla noma ukwethembeka kocingo.

Izinkinga zokushisela:I-wafer warpage ingase ibangele izinkinga zokushisela. Ngesikhathi senqubo yokushisela, uma i-wafer igobile noma isontekile, ukusatshalaliswa kwamandla ngesikhathi senqubo yokushisela kungase kungalingani, kubangele izinga eliphansi lamajoyini e-solder noma ngisho nokuphuka kwamalunga e-solder. Lokhu kuzoba nomthelela omubi ekuthembekeni kwephakheji.

Izinkinga ze-wafer warpage

Okulandelayo ezinye izici ezingase zibangeleisilucwecwanai-warpage:

1.Ingcindezi yokushisa:Phakathi nenqubo yokupakisha, ngenxa yokushintsha kwezinga lokushisa, izinto ezihlukene ku-wafer zizoba nama-coefficients angaguquki wokwandisa okushisayo, okuholela ku-wafer warpage.

2.I-inhomogeneity yezinto ezibonakalayo:Ngesikhathi senqubo yokukhiqiza ama-wafer, ukusatshalaliswa okungalingani kwezinto kungase kubangele i-wafer warpage. Isibonelo, ukuminyana kwempahla ehlukene noma ukujiya ezindaweni ezihlukene zewafa kuzodala ukuthi iwafa yonakale.

3.Amapharamitha okucubungula:Ukulawulwa okungalungile kweminye imingcele yenqubo enqubweni yokupakisha, njengezinga lokushisa, umswakama, umfutho womoya, njll., kungase futhi kubangele i-wafer warpage.

Isixazululo

Ezinye izinyathelo zokulawula i-wafer warpage:

Ukuthuthukisa inqubo:Yehlisa ubungozi be-wafer warpage ngokulungiselela amapharamitha enqubo yokupakisha. Lokhu kufaka phakathi amapharamitha okulawula afana nezinga lokushisa nokuswakama, amazinga okushisa nawokupholisa, nomfutho womoya phakathi nenqubo yokupakisha. Ukukhetha okunengqondo kwamapharamitha wenqubo kunganciphisa umthelela wokucindezeleka okushisayo futhi kunciphise amathuba e-wafer warpage.

Ukukhetha impahla yokupakisha:Khetha izinto zokupakisha ezifanele ukuze unciphise ubungozi be-wafer warpage. I-coefficient yokwandisa okushisayo yezinto zokupakisha kufanele ifane naleyo ye-wafer ukuze kuncishiswe ukuguqulwa kwe-wafer okubangelwa ukucindezeleka kokushisa. Ngasikhathi sinye, izici zomshini nokuzinza kwempahla yokupakisha nakho kudinga ukucatshangelwa ukuze kuqinisekiswe ukuthi inkinga ye-wafer warpage ingadanjiswa ngempumelelo.

Idizayini ye-wafer nokwenza ngcono ukukhiqiza:Ngesikhathi sokuklama kanye nenqubo yokukhiqiza iwafa, ezinye izinyathelo zingathathwa ukuze kuncishiswe ubungozi be-wafer warpage. Lokhu kuhlanganisa nokuthuthukisa ukusatshalaliswa okufanayo kwempahla, ukulawula ukujiya kanye nokuthambile kwendawo ye-wafer, njll. Ngokulawula kahle inqubo yokwenziwa kwe-wafer, ingozi yokuguqulwa kwe-wafer ngokwayo ingancishiswa.

Izinyathelo zokuphatha ezishisayo:Phakathi nenqubo yokupakisha, izinyathelo zokuphatha ezishisayo zithathwa ukuze kuncishiswe ingozi ye-wafer warpage. Lokhu kuhlanganisa ukusebenzisa izinto zokushisisa nokupholisa ezihambisana kahle nezinga lokushisa, ukulawula izinga lokushisa namazinga okushintsha kwezinga lokushisa, kanye nokuthatha izindlela zokupholisa ezifanele. Ukuphatha okushisayo okusebenzayo kunganciphisa umthelela wengcindezi yokushisa ku-wafer futhi kunciphise amathuba e-wafer warpage.

Izinyathelo zokuthola nokulungiswa:Phakathi nenqubo yokupakisha, kubaluleke kakhulu ukuthola njalo nokulungisa i-wafer warpage. Ngokusebenzisa okokusebenza kokuthola ukunemba okuphezulu, okufana nesistimu yokulinganisa i-optical noma imishini yokuhlola, izinkinga ze-wafer warpage zingatholwa kusenesikhathi futhi kuthathwe izinyathelo zokulungisa ezihambisanayo. Lokhu kungase kuhlanganise ukulungisa kabusha amapharamitha wokupakisha, ukushintsha izinto zokupakisha, noma ukulungisa inqubo yokukhiqiza amawafa.

Kufanele kuqashelwe ukuthi ukuxazulula inkinga ye-wafer warpage kuwumsebenzi oyinkimbinkimbi futhi kungase kudinge ukucatshangelwa okuphelele kwezici eziningi kanye nokwenza kahle okuphindaphindiwe nokulungiswa. Ezinhlelweni zangempela, izixazululo ezithile zingahluka kuye ngezinto ezifana nezinqubo zokupakisha, izinto eziyisiluphu, nezinto zokusebenza. Ngakho-ke, kuye ngesimo esithile, izinyathelo ezifanele zingakhethwa futhi zithathwe ukuxazulula inkinga ye-wafer warpage.