Ukucutshungulwa kwe-UV ye-Fan-Out Wafer-Level Packaging

I-Fan out wafer level packaging (FOWLP) iyindlela engabizi kakhulu embonini ye-semiconductor. Kodwa imiphumela emibi evamile yale nqubo i-warping kanye ne-chip offset. Ngaphandle kokuthuthukiswa okuqhubekayo kwezinga le-wafer kanye neleveli yephaneli yobuchwepheshe befeni, lezi zinkinga ezihlobene nokubunjwa zisekhona.

I-Warping ibangelwa ukuncipha kwamakhemikhali kwenhlanganisela ye-liquid compression molding (LCM) ngesikhathi sokwelapha nokupholisa ngemva kokubunjwa. Isizathu sesibili sokungqubuzana ukungafani kwe-coefficient of thermal expansion (CTE) phakathi kwe-silicon chip, into yokubumba, ne-substrate. I-Offset ingenxa yokuthi izinto zokubumba ze-viscous ezinokuqukethwe okuphezulu kokugcwalisa ngokuvamile zingasetshenziswa kuphela ngaphansi kokushisa okuphezulu nokucindezela okukhulu. Njengoba i-chip igxiliwe kusithwali ngokusebenzisa isibopho sesikhashana, izinga lokushisa elikhulayo lizothambisa i-adhesive, ngaleyo ndlela yenze buthaka amandla ayo okunamathela futhi inciphise ikhono layo lokulungisa i-chip. Isizathu sesibili se-offset ukuthi ingcindezi edingekayo ekubumbeni idala ingcindezi ku-chip ngayinye.

Ukuze kutholwe izisombululo zalezi zinselele, i-DELO yenze ucwaningo lokuthi kungenzeka yini ngokuhlanganisa chip elula ye-analogi enkampanini yenethiwekhi. Mayelana nokusetha, iwafa yenkampani yenethiwekhi imbozwe nge-adhesive yesikhashana yokubopha, futhi i-chip ibekwe ibheke phansi. Kamuva, i-wafer yabunjwa kusetshenziswa ingcina ye-DELO ene-viscosity ephansi futhi yelashwa ngemisebe ye-ultraviolet ngaphambi kokukhipha i-wafer yenkampani. Kulezi zicelo, izinhlanganisela zokubumba ze-viscosity thermosetting eziphezulu zivame ukusetshenziswa.

I-DELO iphinde yaqhathanisa i-warpage yezinto zokubumba ze-thermosetting kanye nemikhiqizo ephulukisiwe ye-UV esivivinyweni, futhi imiphumela yabonisa ukuthi izinto zokubumba ezijwayelekile zingasonteka ngesikhathi sokupholisa ngemva kwe-thermosetting. Ngakho-ke, ukusebenzisa ukwelapha kwe-ultraviolet yegumbi esikhundleni sokwelapha ukushisa kunganciphisa kakhulu umthelela wokungafani kwe-coefficient yokwandisa okushisayo phakathi kwenhlanganisela yokubumba nesithwali, ngaleyo ndlela kuncishiswe ukungqubuzana ngezinga elikhulu ngangokunokwenzeka.

Ukusetshenziswa kwezinto zokuphulukisa ze-ultraviolet kunganciphisa nokusetshenziswa kokugcwalisa, ngaleyo ndlela kunciphise i-viscosity kanye ne-Young's modulus. I-viscosity ye-adhesive yemodeli esetshenziswe ekuhlolweni ngu-35000 mPa · s, futhi i-modulus ye-Young i-1 GPa. Ngenxa yokungabikho kokushisisa noma ukucindezela okuphezulu ezintweni ezibunjwayo, i-chip offset ingancishiswa kakhulu ngangokunokwenzeka. Inhlanganisela evamile yokubumba ine-viscosity engaba ngu-800000 mPa · s kanye ne-Young's modulus ebangeni lamadijithi amabili.

Sekukonke, ucwaningo luye lwabonisa ukuthi ukusebenzisa izinto ezilashwe yi-UV ekubumbeni indawo enkulu kunenzuzo ekukhiqizeni ukupakishwa kweleveli ye-wafer yabaphambili be-chip, kuyilapho kunciphisa i-warpage ne-chip offset ngezinga elikhulu ngangokunokwenzeka. Naphezu komehluko obalulekile kuma-coefficients wokwandisa okushisayo phakathi kwezinto ezisetshenzisiwe, le nqubo isenezinhlelo zokusebenza eziningi ngenxa yokungabikho kokuhlukahluka kwezinga lokushisa. Ngaphezu kwalokho, ukwelapha kwe-UV kunganciphisa isikhathi sokuphulukisa kanye nokusetshenziswa kwamandla.

I-UV esikhundleni sokwelapha okushisayo kunciphisa i-warpage kanye noshintsho olufayo ekufakweni kwezinga le-wafer-level fan-out

Ukuqhathaniswa kwamawafa anamayintshi angu-12 kusetshenziswa inhlanganisela elashwe ngokushisa, egcwala kakhulu (A) kanye nenhlanganisela elashwe yi-UV (B)