Njengoba kuboniswe ngenhla, kuyinto ejwayelekile
Ingxenye yokuqala:
▪ I-Heating Element (ikhoyili yokushisisa):
etholakala eduze kweshubhu yesithando somlilo, ngokuvamile eyenziwe ngezintambo zokumelana, ezisetshenziselwa ukushisa ingaphakathi leshubhu lesithando somlilo.
▪ Ishubhu yequartz:
Umnyombo wesithando somlilo se-oxidation esishisayo, esenziwe nge-quartz ehlanzekile kakhulu engakwazi ukumelana namazinga okushisa aphezulu futhi ihlale ingenawo amakhemikhali.
▪ Okuphakelayo Kwegesi:
Itholakala phezulu noma ohlangothini lweshubhu yesithando somlilo, isetshenziselwa ukuthutha umoya-mpilo noma amanye amagesi ngaphakathi kweshubhu yesithando somlilo.
▪ I-SS Flange:
izingxenye ezixhuma amashubhu e-quartz nemigqa yegesi, iqinisekisa ukuqina nokuzinza koxhumano.
▪ Ilayini Okuphakelayo Kwegesi:
Amapayipi axhuma i-MFC esikhumulweni segesi sokuhambisa igesi.
▪ I-MFC (Isilawuli Sokugeleza Okuningi) :
Idivayisi elawula ukugeleza kwegesi ngaphakathi kweshubhu ye-quartz ukuze ilawule ngokunembile inani legesi elidingekayo.
▪ Isikhala:
Isetshenziselwa ukukhipha igesi ephuma ngaphakathi kweshubhu yesithando somlilo ukuya ngaphandle kwezinto zokusebenza.
Ingxenye engezansi:
▪ Ama-Silicon Wafers in Holder:
Ama-wafers e-silicon afakwa ku-Holder ekhethekile ukuqinisekisa ukushisa okufanayo ngesikhathi se-oxidation.
▪ Isibambi se-wafer:
Isetshenziselwa ukubamba i-silicon wafer futhi iqinisekise ukuthi i-silicon wafer ihlala izinzile phakathi nenqubo.
▪ Isisekelo:
Isakhiwo esibamba Isibambi se-silicon wafer, ngokuvamile esenziwe ngezinto ezimelana nezinga lokushisa eliphezulu.
▪ Ikheshi:
Isetshenziselwa ukuphakamisa izibambi ze-Wafer ukungena nokuphuma kumashubhu e-quartz ukuze kulayishwe ngokuzenzakalelayo futhi kulayishwe amawafa e-silicon.
▪ Irobhothi lokudlulisa i-Wafer:
ebekwe eceleni kwedivayisi yeshubhu yesithando somlilo, isetshenziselwa ukususa ngokuzenzakalelayo i-silicon wafer ebhokisini bese iyibeka kushubhu yesithando somlilo, noma ukuyisusa ngemva kokucubungula.
▪ I-Cassette Storage Carousel:
I-carousel yokugcina amakhasethi isetshenziselwa ukugcina ibhokisi eliqukethe ama-silicon wafers futhi lingazungeziswa ukuze kungene irobhothi.
▪ Ikhasethi le-Wafer:
I-wafer cassette isetshenziselwa ukugcina nokudlulisa amawafa e-silicon ukuze acutshungulwe.
Isikhathi sokuthumela: Apr-22-2024