i-fan out wafer degree packaging ( FOWLP ) embonini ye-semiconductor yaziwa ngokuba iyonga kakhulu, kodwa ayinayo inselelo yakho. Enye yezinkinga eziyinhloko ezibhekene ne-warp kanye nokuqala kancane phakathi nenqubo yokubumba. I-warp ingabalelwa ekuncipheni kwamakhemikhali kwenhlanganisela ebumbayo kanye nokungafani kwe-coefficient yokunweba okushisayo, kuyilapho iqala ukwenzeka ngenxa yokuqukethwe okuphezulu kokugcwalisa kumpahla yokubumba enoshevu. Nokho, ngosizoI-AI engabonakali, isixazululo siwucwaningo ukuze sinqobe lezi zinselele.
I-DELO, inkampani eholayo embonini, yenza inhlolovo yokuthi kungenzeka yini ukubhekana nalolu daba ngokuhlanganisa kancane into enamathelayo enamathelayo e-viscosity ephansi ye-viscosity kanye nokuqina kwe-ultraviolet. Ngokuqhathanisa i-warpage yezinto ezihlukene, kwatholakala ukuthi ukuqina kwe-ultraviolet kunciphisa kakhulu i-warp phakathi nenkathi yokupholisa ngemva kokubumba. Ukusetshenziswa kwezinto eziqinisa i-ultraviolet akunciphisi kuphela isidingo sokugcwalisa kodwa futhi kunciphisa i-viscosity kanye ne-Young's modulus, ekugcineni kunciphisa ukuqala kancane. Le phromoshini yobuchwepheshe ibonisa amandla okufakwa kwe-wafer degree yabalandeli bokukhiqiza okunama-warpage amancane kanye nokuqala kancane.
Sekukonke, ucwaningo lugqamisa inzuzo yokusebenzisa ukuqina kwe-ultraviolet enqubweni yokubumba indawo enkulu, lunikeza isisombululo senselele ebhekene nokupakishwa kwe-fan-out wafer-degree. Ngekhono lokunciphisa i-warpage kanye ne-die shift, ngenkathi futhi ifilimu ihlelwa phansi ekuqinisweni kwesikhathi kanye nokusetshenziswa kwamandla, uprofesa wokuqina kwe-ultraviolet abe yindlela yesithembiso embonini ye-semiconductor. Naphezu komehluko ku-coefficient yokunweba okushisayo phakathi kwezinto, ukusetshenziswa kokuqina kwe-ultraviolet kuletha inketho engenzeka ukuze kube ngcono ukusebenza kahle kanye nekhwalithi yokupakishwa kwe-wafer degree.
Isikhathi sokuthumela: Oct-28-2024