Imithombo yokungcola kanye nokuvimbela embonini yokukhiqiza ye-semiconductor

Ukukhiqizwa kwedivayisi ye-semiconductor ikakhulukazi kuhlanganisa amadivayisi ahlukene, amasekhethi ahlanganisiwe nezinqubo zawo zokupakisha.
Ukukhiqizwa kwe-semiconductor kungahlukaniswa ngezigaba ezintathu: ukukhiqizwa komzimba womkhiqizo, umkhiqizoisilucwecwanaukukhiqiza kanye nokuhlanganisa idivayisi. Phakathi kwazo, ukungcola okubi kakhulu yisiteji sokukhiqiza isicwecwana somkhiqizo.
Izinto ezingcolisayo zihlukaniswa kakhulu zibe amanzi angcolile, igesi engcolile kanye nemfucuza eqinile.

Inqubo yokukhiqiza i-chip:

Isicwecwana se-siliconngemva kokugaya kwangaphandle - ukuhlanza - i-oxidation - ukumelana neyunifomu - i-photolithography - ukuthuthukiswa - i-etching - ukusabalalisa, ukufakwa kwe-ion - ukufakwa komhwamuko wamakhemikhali - ukupholisha kwamakhemikhali - i-metallization, njll.

 

Amanzi angcolile

Inani elikhulu lamanzi angcolile likhiqizwa esinyathelweni ngasinye senqubo yokukhiqiza nokuhlola ukupakishwa kwe-semiconductor, ikakhulukazi amanzi angcolile ane-acid-base, amanzi angcolile aqukethe i-ammonia kanye namanzi angcolile aphilayo.

 

1. Amanzi angcolile aqukethe i-fluorine:

I-Hydrofluoric acid iba yincibilikisi eyinhloko esetshenziswa ezinqubweni ze-oxidation kanye ne-etching ngenxa yezakhiwo zayo zokuxilisa kanye nokugqwala. Amanzi angcolile aqukethe i-fluorine enqubweni ikakhulukazi avela enqubweni yokusabalalisa kanye nenqubo yokupholisha ngomshini wamakhemikhali enqubweni yokukhiqiza ama-chip. Enqubweni yokuhlanza ama-wafers e-silicon kanye nezitsha ezihlobene, i-hydrochloric acid nayo isetshenziswa izikhathi eziningi. Zonke lezi zinqubo ziqedwa emathangeni okufaka akhethekile noma izinto zokuhlanza, ukuze amanzi angcolile ane-fluorine akhishwe ngokuzimela. Ngokuhambisana nokugxila, ingahlukaniswa ngamanzi angcolile ane-fluorine ane-concentration ephezulu kanye namanzi angcolile aqukethe i-ammonia. Ngokuvamile, ukugcwala kwamanzi angcolile aqukethe i-ammonia angafinyelela ku-100-1200 mg/L. Izinkampani eziningi zisebenzisa kabusha le ngxenye yamanzi angcolile ngezinqubo ezingadingi izinga eliphezulu lamanzi.

2. Amanzi angcolile anesisekelo se-Acid:

Cishe yonke inqubo yokukhiqiza isekethe ehlanganisiwe idinga ukuthi i-chip ihlanzwe. Njengamanje, i-sulfuric acid ne-hydrogen peroxide iwuketshezi lokuhlanza olusetshenziswa kakhulu enqubweni yokukhiqiza yesekethe edidiyelwe. Ngesikhathi esifanayo, ama-acid-base reagents afana ne-nitric acid, i-hydrochloric acid namanzi e-ammonia nawo asetshenziswa.
Amanzi angcolile anesisekelo se-asidi wenqubo yokukhiqiza avela ikakhulukazi enqubweni yokuhlanza enqubweni yokukhiqiza ama-chip. Enqubweni yokupakisha, i-chip iphathwa ngesisombululo se-asidi-base ngesikhathi se-electroplating nokuhlaziywa kwamakhemikhali. Ngemuva kokwelashwa, idinga ukugezwa ngamanzi ahlanzekile ukuze kukhiqizwe amanzi angcolile okugeza i-acid-base. Ngaphezu kwalokho, ama-acid-base reagents afana ne-sodium hydroxide ne-hydrochloric acid nawo asetshenziswa esiteshini samanzi ahlanzekile ukuvuselela ama-anion nama-cation resins ukukhiqiza amanzi angcolile okuvuselela i-acid-base. Amanzi okugeza umsila nawo akhiqizwa ngesikhathi senqubo yokugeza igesi ye-acid-base. Ezinkampanini ezididiyelwe zokukhiqiza isekethe, inani lamanzi angcolile asekelwe e-acid likhulu kakhulu.

3. Amanzi angcolile aphilayo:

Ngenxa yezinqubo ezihlukene zokukhiqiza, inani lezincibilikisi eziphilayo ezisetshenziswa embonini ye-semiconductor lihluke kakhulu. Kodwa-ke, njengama-ejenti okuhlanza, izinyibilikisi ze-organic zisasetshenziswa kabanzi ezixhumanisini ezahlukahlukene zokupakishwa kokukhiqiza. Ezinye izincibilikisi ziba ukukhishwa kwamanzi angcolile.

4. Amanye amanzi angcolile:

Inqubo yokuhlanganisa yenqubo yokukhiqiza i-semiconductor izosebenzisa inani elikhulu le-ammonia, i-fluorine kanye namanzi ahlanzekile kakhulu ukuze kususwe ukungcola, ngaleyo ndlela kukhiqizwe ukuthululwa kwamanzi angcolile aqukethe i-ammonia.
Inqubo ye-electroplating iyadingeka kunqubo yokupakisha ye-semiconductor. I-chip idinga ukuhlanzwa ngemva kwe-electroplating, futhi amanzi angcolile okuhlanza i-electroplating azokhiqizwa kule nqubo. Njengoba ezinye izinsimbi zisetshenziswa e-electroplating, kuzoba khona ukukhishwa kwe-ion yensimbi emanzini angcolile okuhlanza i-electroplating, njengomthofu, ithini, i-disc, i-zinc, i-aluminium, njll.

 

Igesi emoshayo

Njengoba inqubo ye-semiconductor inezidingo eziphakeme kakhulu zokuhlanzeka kwegumbi lokuhlinza, abalandeli bavame ukusetshenziselwa ukukhipha izinhlobo ezahlukene zamagesi angcolile avuthiswe phakathi nenqubo. Ngakho-ke, ukukhishwa kwegesi engcolile embonini ye-semiconductor kubonakala ngevolumu enkulu yokukhipha kanye nokugxila okuncane kokukhipha. Ukukhishwa kwegesi eyimfucuza nakho kuguquguquka kakhulu.
Lokhu kukhishwa kwegesi engcolile kungahlukaniswa ikakhulukazi izigaba ezine: igesi ene-asidi, igesi ene-alkali, igesi yemfucuza yezinto eziphilayo kanye negesi enobuthi.

1. I-Acid-base waste gas:

I-Acid-base-waste gas ikakhulukazi ivela ekusakazeni,I-CVD, i-CMP kanye nezinqubo zokufaka, ezisebenzisa isisombululo sokuhlanza i-acid-base ukuhlanza isicwecwe.
Njengamanje, i-solvent yokuhlanza evame ukusetshenziswa kakhulu ekukhiqizeni i-semiconductor ingxube ye-hydrogen peroxide ne-sulfuric acid.
Igesi engcolile ekhiqizwa kulezi zinqubo ihlanganisa amagesi ane-acidic njenge-sulfuric acid, i-hydrofluoric acid, i-hydrochloric acid, i-nitric acid ne-phosphoric acid, kanti igesi ye-alkali ikakhulukazi i-ammonia.

2. I-Organic waste gas:

Igesi yemfucuza yezinto eziphilayo iphuma ikakhulukazi ezinqubweni ezifana ne-photolithography, ukuthuthukiswa, ukucwiliswa kanye nokusabalalisa. Kulezi zinqubo, isisombululo se-organic (njenge-isopropyl alcohol) sisetshenziselwa ukuhlanza ingaphezulu le-wafer, futhi igesi engcolile ekhiqizwa ukuvuthwa kwe-volatilization ingenye yemithombo ye-organic waste gas;
Ngasikhathi sinye, i-photoresist (photoresist) esetshenziswa enqubweni ye-photolithography kanye ne-etching iqukethe izinyibilikisi zemvelo eziguquguqukayo, njenge-butyl acetate, eshintshashintshayo emkhathini ngesikhathi senqubo yokucubungula i-wafer, okungomunye umthombo wegesi yemfucuza yemvelo.

3. Igesi yemfucuza enobuthi:

Igesi yemfucuza enobuthi iphuma ikakhulukazi ezinqubweni ezifana ne-crystal epitaxy, i-dry etching ne-CVD. Kulezi zinqubo, izinhlobonhlobo zamagesi akhethekile ahlanzekile kakhulu asetshenziselwa ukucubungula i-wafer, njenge-silicon (SiHj), i-phosphorus (PH3), i-carbon tetrachloride (CFJ), i-borane, i-boron trioxide, njll. Amanye amagesi akhethekile anobuthi, i-asphyxiating futhi iyagqwala.
Ngesikhathi esifanayo, kunqubo yokufaka okomile nokuhlanza ngemva kokufakwa komhwamuko wamakhemikhali ekukhiqizeni i-semiconductor, kudingeka inani elikhulu legesi ye-oxide (PFCS) egcwele, njenge-NFS, C2F&CR, C3FS, CHF3, SF6, njll. Lezi zinhlanganisela ezine-perfluorinated ukumuncwa okuqinile endaweni yokukhanya kwe-infrared futhi uhlale emkhathini isikhathi eside. Ngokuvamile zibhekwa njengomthombo oyinhloko we-greenhouse effect.

4. Inqubo yokupakisha igesi yemfucuza:

Uma kuqhathaniswa nenqubo yokukhiqiza i-semiconductor, igesi ewudoti ekhiqizwa inqubo yokupakisha ye-semiconductor ilula, ikakhulukazi igesi ene-asidi, i-epoxy resin nothuli.
Igesi yemfucuza ene-Acidic ikhiqizwa ikakhulukazi ezinqubweni ezifana ne-electroplating;
I-Baking waste gas ikhiqizwa ohlelweni lokubhaka ngemva kokunamathisela nokuvalwa komkhiqizo;
Umshini wokudayela ukhiqiza igesi eyimfucumfucu equkethe uthuli lwe-silicon ngesikhathi senqubo yokusika i-wafer.

 

Izinkinga zokungcoliswa kwemvelo

Ngezinkinga zokungcoliswa kwemvelo embonini ye-semiconductor, izinkinga ezinkulu ezidinga ukuxazululwa yilezi:
· Ukukhishwa kwesilinganiso esikhulu sokungcola komoya kanye nenhlanganisela yezinto eziphilayo ezishintshashintshayo (VOCs) kunqubo ye-photolithography;
· Ukukhishwa kwenhlanganisela ye-perfluorinated (PFCS) ku-plasma etching kanye nezinqubo zokubeka umhwamuko wamakhemikhali;
· Ukusetshenziswa okukhulu kwamandla namanzi ekukhiqizeni nasekuvikeleni ukuphepha kwabasebenzi;
· Ukugaywa kabusha kanye nokuqapha ukungcoliswa kwemikhiqizo etholakalayo;
· Izinkinga zokusebenzisa amakhemikhali ayingozi ezinhlelweni zokupakisha.

 

Ukukhiqiza okuhlanzekile

Ubuchwepheshe bokukhiqiza obuhlanzekile bedivayisi ye-semiconductor bungathuthukiswa kusuka ezintweni ezingavuthiwe, izinqubo kanye nokulawulwa kwenqubo.

 

Ukuthuthukisa izinto zokusetshenziswa kanye namandla

Okokuqala, ukuhlanzeka kwezinto kufanele kulawulwe ngokuqinile ukuze kuncishiswe ukwethulwa kokungcola kanye nezinhlayiya.
Okwesibili, izinga lokushisa elihlukahlukene, ukutholwa kokuvuza, ukudlidliza, ukushaqeka kukagesi we-voltage ephezulu nokunye ukuhlola kufanele kwenziwe ezingxenyeni ezingenayo noma emikhiqizweni ecishe iqedwe ngaphambi kokuthi ifakwe emkhiqizweni.
Ngaphezu kwalokho, ukuhlanzeka kwezinto ezisizayo kufanele kulawulwe ngokuqinile. Kunobuchwepheshe obuningi obungasetshenziselwa ukukhiqiza amandla ahlanzekile.

 

Lungiselela inqubo yokukhiqiza

Imboni ye-semiconductor ngokwayo ilwela ukunciphisa umthelela wayo endaweni ezungezile ngokusebenzisa ukuthuthukiswa kobuchwepheshe benqubo.
Isibonelo, ngawo-1970, izinyibilikisi eziphilayo zazisetshenziselwa ukuhlanza ama-wafers kubuchwepheshe bokuhlanza isifunda esihlanganisiwe. Ngawo-1980, izixazululo ze-asidi ne-alkali ezifana ne-sulfuric acid zasetshenziswa ukuhlanza amawafa. Kuze kube yiminyaka yawo-1990, ubuchwepheshe bokuhlanza umoya we-plasma benziwa.
Mayelana nokupakisha, izinkampani eziningi okwamanje zisebenzisa ubuchwepheshe be-electroplating, obuzodala ukungcoliswa kwensimbi esindayo emvelweni.
Kodwa-ke, izitshalo zokupakisha e-Shanghai azisasebenzisi ubuchwepheshe be-electroplating, ngakho-ke awukho umthelela wezinsimbi ezinzima endaweni ezungezile. Kungatholakala ukuthi imboni ye-semiconductor inciphisa kancane kancane umthelela wayo endaweni ezungezile ngokuthuthukiswa kwenqubo kanye nokufaka amakhemikhali esikhundleni senqubo yayo yokuthuthukisa, ephinde ilandele inkambiso yamanje yentuthuko yomhlaba wonke yenqubo yokumela kanye nokwakhiwa komkhiqizo okusekelwe endaweni ezungezile.

 

Okwamanje, ukuthuthukiswa kwezinqubo zasendaweni okwengeziwe kuyenziwa, okuhlanganisa:

·Ukushintshwa kanye nokwehliswa kwegesi ye-PFCS yonke eyi-ammonium, efana nokusebenzisa igesi ye-PFCs enomphumela ophansi wokushisa ukuze esikhundleni segesi ibe nomphumela ophezulu we-greenhouse, njengokuthuthukisa ukugeleza kwenqubo kanye nokunciphisa inani legesi ye-PFCS esetshenziswa kule nqubo;
·Ukuthuthukisa ukuhlanzwa kwama-wafer amaningi kuya ekuhlanzeni kwe-wafer eyodwa ukuze kuncishiswe inani lezinto zokuhlanza amakhemikhali ezisetshenziswa ohlelweni lokuhlanza.
·Ukulawula inqubo eqinile:
a. Ukubona okuzenzakalelayo kwenqubo yokukhiqiza, engakwazi ukubona ukucutshungulwa okunembile kanye nokukhiqizwa kwenqwaba, futhi kunciphise izinga eliphezulu lamaphutha okusebenza ngesandla;
b. Izinqubo ezihlanzekile kakhulu zemvelo, cishe u-5% noma ngaphansi kokulahlekelwa kwesivuno kubangelwa abantu nendawo. Izinqubo ezihlanzekile kakhulu zemvelo zihlanganisa ukuhlanzeka komoya, amanzi ahlanzekile kakhulu, umoya ocindezelweyo, i-CO2, i-N2, izinga lokushisa, umswakama, njll. Izinga lokuhlanzeka kwendawo yokusebenzela ehlanzekile livame ukukalwa ngenani eliphakeme lezinhlayiyana ezivunyelwe umthamo weyunithi ngayinye umoya, okungukuthi, ukugxilwa kwesibalo sezinhlayiyana;
c. Qinisa ukutholwa, bese ukhetha amaphuzu abalulekile afanelekile ukuze atholwe ezindaweni zokusebenza ezinenani elikhulu lemfucuza phakathi nenqubo yokukhiqiza.

 

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Isikhathi sokuthumela: Aug-13-2024
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