Izisetshenziswa LMJ microjet laser technology

Izisetshenziswa ze-LMJ microjet laser technology Isithombe esifakiwe

Incazelo emfushane:

I-laser beam egxilile ihlanganiswe nejethi lamanzi elinesivinini esikhulu, futhi induku yamandla enokusabalalisa okufanayo kwamandla esigaba esiphambanayo kwakheka ngemva kokuboniswa okugcwele odongeni lwangaphakathi lwekholomu yamanzi.Inezici zobubanzi bomugqa ophansi, ukuminyana kwamandla aphezulu, isiqondiso esilawulekayo kanye nokunciphisa isikhathi sangempela sokushisa kwendawo yezinto ezicutshungulwayo, okuhlinzeka ngezimo ezinhle kakhulu zokuqeda okudidiyelwe nokusebenza kahle kwezinto eziqinile neziqinile.

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Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izinzuzo zokucutshungulwa kwe-LMJ

Ukukhubazeka okungokwemvelo kokucutshungulwa kwe-laser okujwayelekile kunganqotshwa ngokusebenzisa ubuchwepheshe be-laser Laser micro jet (LMJ) ukusabalalisa izici zokubona kwamanzi nomoya.Lobu buchwepheshe buvumela ama-laser pulses abonakale ngokugcwele kujethi yamanzi ahlanzekile acutshungulwe ngendlela engaphazamiseki ukuze afinyelele endaweni yomshini njengakufiber optical.Ngokombono wokusetshenziswa, izici eziyinhloko zobuchwepheshe be-LMJ zimi kanje:

I-1.I-laser beam iyisakhiwo sekholomu (i-parallel).

2.I-laser pulse idluliselwa ku-waterjet njenge-fiber optical, evikelekile kunoma yikuphi ukuphazamiseka kwemvelo.

I-3.I-laser beam igxile emishinini ye-LMJ, futhi akukho shintsho ekuphakameni kwendawo esebenza ngomshini phakathi nayo yonke inqubo yomshini, ukuze kungabikho isidingo sokugxila ngokuqhubekayo ngokushintsha kokujula kokucubungula ngesikhathi senqubo yomshini.

4.Ngaphezu kokukhishwa kwento yokwenza okuthile okwenzeka ngesikhathi sokushaywa kwe-laser ngakunye, cishe u-99% wesikhathi esikhathini seyunithi ngayinye kusukela ekuqaleni kokushaya ngakunye kuya ku-pulse elandelayo, okokusebenza okucutshunguliwe kukupholisa ngesikhathi sangempela. amanzi, ngaleyo ndlela acishe asule indawo ethinteke ukushisa kanye nongqimba oluncibilikayo, kodwa kugcinwe ukusebenza kahle okuphezulu kokucubungula.

5.Gcina ukuhlanza indawo esetshenziwe.

i-micro-jet laser cutting technolgoy (1)

Ukucaciswa okujwayelekile	I-LCSA-100	I-LCSA-200
Ivolumu ye-Countertop	125 x 200 x 100	460×460×300
I-eksisi yomugqa XY	Injini yomugqa.Injini yomugqa	Injini yomugqa.Injini yomugqa
I-eksisi yomugqa Z	100	300
Ukubeka ukunemba μm	+/- 5	+/- 3
Ukunemba kokuma okuphindaphindiwe μm	+/- 2	+/- 1
Ukusheshisa G	0.5	1
Ukulawula izinombolo	3-eksisi	3-eksisi
Li-aser
Uhlobo lwe-laser	I-DPSS Nd: YAG	I-DPSS Nd: YAG, ishayela
Ubude begagasi nm	532/1064	532/1064
Amandla alinganiselwe W	50/100/200	200/400
Indiza yamanzi
Ububanzi benozili μm	25-80	25-80
Ibha yokucindezela yeNozzle	100-600	0-600
Ubukhulu/Isisindo
Ubukhulu (Umshini) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Ubukhulu (ikhabethe lokulawula) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Isisindo (impahla) kg	1170	2500-3000
Isisindo (ikhabethe lokulawula) kg	700-750	700-750
Ukusetshenziswa kwamandla okuphelele
Input	I-AC 230 V +6%/ -10%, i-unidirectional 50/60 Hz ±1%	I-AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%
Inani eliphakeme	2.5kVA	2.5kVA
Juwoni	10 m ikhebula lamandla: P+N+E, 1.5 mm2	10 m ikhebula lamandla: P+N+E, 1.5 mm2
Ibanga lesicelo somsebenzisi wemboni ye-semiconductor	≤4 amayintshi ingot eyindilinga ≤4 amayintshi ama-ingot tincetu ≤4 amayintshi ama-ingot scribing	≤6 amayintshi ayindilinga ayindilinga ≤6 intshi izingcezu zengot ≤6 amayintshi ingot scribing Umshini uhlangabezana nevelu yethiyori eyindilinga engu-8-intshi/ukusika/ukusika, futhi imiphumela ethile ephathekayo idinga isu lokusika elithuthukisiwe.