I-Silicon Carbide (SiC) i-Epitaxial Wafer

Inkcazelo emfutshane:

I-Silicon Carbide (SiC) i-Epitaxial Wafer evela kwi-VET Energy i-substrate ephezulu yokusebenza eyenzelwe ukuhlangabezana neemfuno ezifunekayo zamandla esizukulwana esilandelayo kunye nezixhobo ze-RF. I-VET Amandla iqinisekisa ukuba i-epitaxial wafer nganye yenziwe ngokucokisekileyo ukubonelela nge-conductivity ephezulu ye-thermal, i-voltage ye-breakdown, kunye nokuhamba kwe-carrier, okwenza kube yinto efanelekileyo kwizicelo ezifana neenqwelo zombane, unxibelelwano lwe-5G, kunye ne-high-efficiency power electronics.


Iinkcukacha zeMveliso

Iithegi zeMveliso

I-VET Energy silicon carbide (SiC) i-epitaxial wafer yimathiriyeli ye-semiconductor ebanzi ebanzi esebenza kakhulu enokumelana nobushushu obuphezulu, i-frequency ephezulu kunye neempawu zamandla aphezulu. Yi-substrate efanelekileyo kwisizukulwana esitsha sezixhobo zombane zamandla. I-VET Amandla isebenzisa iteknoloji ye-MOCVD epitaxial ephucukileyo ukukhula umgangatho ophezulu we-SiC epitaxial layers kwii-substrates ze-SiC, ukuqinisekisa ukusebenza okugqwesileyo kunye nokuhambelana kwe-wafer.

I-Silicon Carbide yethu (i-SiC) ye-Epitaxial Wafer inikezela ngokuhambelana okugqwesileyo kunye nezixhobo ezahlukeneyo ze-semiconductor ezibandakanya i-Si Wafer, i-SiC Substrate, i-SOI Wafer, kunye ne-SiN Substrate. Ngomaleko wayo owomeleleyo we-epitaxial, ixhasa iinkqubo eziphambili ezifana nokukhula kwe-Epi Wafer kunye nokudityaniswa nezinto ezifana ne-Gallium Oxide Ga2O3 kunye ne-AlN Wafer, iqinisekisa ukusetyenziswa ngeendlela ezahlukeneyo kwiitekhnoloji ezahlukeneyo. Eyilwe ukuba ihambelane ne-industry-standard Cassette handling systems, iqinisekisa ukusebenza ngokufanelekileyo kunye nokulungelelaniswa kwemisebenzi kwiindawo zokwenziwa kwe-semiconductor.

Umgca wemveliso we-VET Energy awuphelelanga kwii-wafers ze-SiC epitaxial. Sikwabonelela ngoluhlu olubanzi lwezixhobo ze-semiconductor substrate, kubandakanya iSi Wafer, iSiC Substrate, i-SOI Wafer, iSiN Substrate, i-Epi Wafer, njl. Ukongeza, sikwaphuhlisa izixhobo ezintsha ze-semiconductor ze-bandgap, ezifana ne-Gallium Oxide Ga2O3 kunye ne-AlN I-Wafer, ukuhlangabezana nemfuno yeshishini le-elektroniki lexesha elizayo lezixhobo zokusebenza eziphezulu.

Umfanekiso we-6页-36
6页-35

IINGCACISO ZOKUXHAPHAZA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Into

8-intshi

6-Intshi

4-intshi

nP

n-Pm

n-Nd

SI

SI

TTV(GBIR)

≤6um

≤6um

I-Bow(GF3YFCD)-Ixabiso elipheleleyo

≤15μm

≤15μm

≤25μm

≤15μm

Warp(GF3YFER)

≤25μm

≤25μm

≤40μm

≤25μm

I-LTV(SBIR)-10mmx10mm

<2μm

Wafer Edge

Beveling

UBUPHAKAMBE GQIBELA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Into

8-intshi

6-Intshi

4-intshi

nP

n-Pm

n-Nd

SI

SI

Umphezulu Gqiba

Icala eliphindwe kabini le-Optical Polish, iSi- Face CMP

Ubunzima boMphezulu

(10um x 10um) Si-FaceRa≤0.2nm
I-C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
I-C-Face Ra≤0.5nm

IiChips zoMda

Akukho okuvunyelweyo (ubude nobubanzi≥0.5mm)

Iindenti

Akukho Ivumelekileyo

Imikrwelo(Si-Face)

Ubuninzi.≤5,Yongezeleka
Ubude≤0.5×i-wafer diameter

Ubuninzi.≤5,Yongezeleka
Ubude≤0.5×i-wafer diameter

Ubuninzi.≤5,Yongezeleka
Ubude≤0.5×i-wafer diameter

Iintanda

Akukho Ivumelekileyo

Ukungabandakanywa kuMda

3mm

ubuchwephesha_1_2_ubungakanani
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