Izixhobo ze-LMJ microjet laser technology

Inkcazelo emfutshane:

I-laser beam egxininisiweyo idibaniswa kwijethi yamanzi e-high-speed, kwaye i-beam yamandla kunye nokusabalalisa okufanayo kwamandla ecandelo lomnqamlezo lenziwa emva kokubonakaliswa ngokupheleleyo kwindonga yangaphakathi yoluhlu lwamanzi.Ineempawu zobubanzi bomgca ophantsi, ubuninzi bamandla amakhulu, ulwalathiso olulawulekayo kunye nokunciphisa ixesha langempela lokushisa komhlaba wezinto ezicutshungulwayo, ukubonelela ngeemeko ezigqwesileyo zokugqitywa ngokudibeneyo kunye nokusebenza kakuhle kwezinto ezinzima kunye neziqhekezayo.

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Iinkcukacha zeMveliso

Iithegi zeMveliso

Izinto eziluncedo zokusetyenzwa kwe-LMJ

Iziphene zendalo zokusetyenzwa kwelaser rhoqo zinokoyiswa ngokusetyenziswa ngobuchule kwe-laser Laser micro jet (LMJ) itekhnoloji yokusasaza iimpawu zamanzi nomoya.Le teknoloji ivumela i-laser pulses ibonakaliswe ngokupheleleyo kwijethi yamanzi ecocekileyo esetyenzisiweyo ngendlela engaphazamisekiyo ukuze ifike kumphezulu we-machining njenge-fiber optical.Ngokombono wokusetyenziswa, iimpawu eziphambili zetekhnoloji ye-LMJ zezi zilandelayo:

1.I-laser beam yi-columnar (i-parallel) isakhiwo.

I-2.I-laser pulse idluliselwa kwi-waterjet njenge-fiber optical, ekhuselwe kuyo nayiphi na ukuphazamiseka kokusingqongileyo.

I-3.I-laser beam igxininiswe kwisixhobo se-LMJ, kwaye akukho tshintsho ekuphakameni kwendawo echongiweyo ngexesha lenkqubo yokucoca, ukwenzela ukuba kungabikho mfuneko yokugxila ngokuqhubekayo kunye nokuguqulwa kobunzulu bokusebenza ngexesha lenkqubo yokucoca.

4. Ukongeza ekukhutshweni kwezinto zokusebenza zenzeke ngexesha le-laser pulses nganye, malunga ne-99% yexesha kwiyunithi nganye yexesha ukusuka ekuqaleni kwe-pulse nganye ukuya kwi-pulse elandelayo, izinto ezicwangcisiweyo zikwixesha langempela lokupholisa. amanzi, ngaloo ndlela aphantse acima indawo echatshazelwe bubushushu kunye nomaleko wokunyibilikisa, kodwa kugcinwe ukusebenza kakuhle kokusetyenzwa.

5.Gcina ukucoca umgangatho owenziweyo.

i-micro-jet laser cutting technolgoy (1)

Iinkcukacha ngokubanzi	I-LCSA-100	I-LCSA-200
Umthamo we-countertop	125 x 200 x 100	460×460×300
Umgca ohamba ngomgca XY	Injini yomgca.Injini yomgca	Injini yomgca.Injini yomgca
Umgca ohamba ngomgca uZ	100	300
Ukubeka ukuchaneka μm	+/ - 5	+/- 3
Ukuchaneka kokubekwa okuphindaphindiweyo μm	+/- 2	+/- 1
Ukukhawuleza G	0.5	1
Ulawulo lwamanani	I-3-axis	I-3-axis
Laser
Uhlobo lweLaser	DPSS Nd: YAG	DPSS Nd: YAG, ukubetha
Ubude bobude nm	532/1064	532/1064
Amandla alinganisiweyo W	50/100/200	200/400
Ijethi yamanzi
Umbhobho wedayamitha μm	25-80	25-80
Ibha yoxinzelelo lweNozzle	100-600	0-600
Ubungakanani / Ubunzima
Imilinganiselo (Umatshini) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Imilinganiselo (ikhabhathi yolawulo) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Ubunzima (izixhobo) kg	1170	2500-3000
Ubunzima (ikhabhinethi yokulawula) kg	700-750	700-750
Ukusetyenziswa kwamandla ngokubanzi
Input	I-AC 230 V + 6%/ -10%, i-unidirectional 50/60 Hz ± 1%	AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%
Ixabiso eliphezulu	2.5kVA	2.5kVA
Joyile	I-10 m intambo yamandla: P + N + E, 1.5 mm2	I-10 m intambo yamandla: P + N + E, 1.5 mm2
Uluhlu lwesicelo somsebenzisi kwishishini leSemiconductor	≤4 intshi ezingqukuva ≤4 intshi ze-ingot izilayi ≤4 i-intshi ze-ingot scribing	≤6 intshi ezingqukuva ≤6 izilayi ze-ingot intshi ≤6 i-intshi ze-ingot scribing Umatshini udibana ne-8-intshi yesetyhula / ukusika / ukusika ixabiso lethiyori, kwaye iziphumo ezithile ezibonakalayo kufuneka ziphuculwe isicwangciso sokusika.