I-12 Intshi ye-SOI Wafer

Inkcazelo emfutshane:

Yiba namava okwenza izinto ezintsha ngendlela ongazange wazi ngayo ngaphambili nge-12 Intshi ye-SOI Wafer yaseburhulumenteni, ummangaliso wobugcisa oziswe kuwe nge-VET Energy. Yenziwe ngokuchaneka kunye nobuchule, esi siqwenga seSilicon-On-Insulator sichaza kwakhona imigangatho yoshishino, sinikezela ngomgangatho ongenakulinganiswa kunye nokusebenza.


Iinkcukacha zeMveliso

Iithegi zeMveliso

I-VET Energy i-12-intshi ye-SOI yafer sisixhobo se-semiconductor substrate esisebenza kakhulu, esithandwa kakhulu ngenxa yeempawu zayo zombane ezibalaseleyo kunye nesakhiwo esisodwa. Amandla e-VET asebenzisa iinkqubo zokwenziwa kwe-SOI ye-wafer ephucukileyo ukuqinisekisa ukuba i-wafer inokuvuza okuphantsi kakhulu ngoku, isantya esiphezulu kunye nokumelana nemitha, ibonelela ngesiseko esiluqilima kwiisekethe zakho ezisebenza ngokuphezulu ezidibeneyo.

Umgca wemveliso we-VET Energy awukhawulelwanga kwii-wafers ze-SOI. Sikwabonelela ngoluhlu olubanzi lwezixhobo zesemiconductor substrate, kubandakanya iSi Wafer, iSiC Substrate, iSiN Substrate, iEpi Wafer, njl. Ezi mveliso zinokuhlangabezana neemfuno zesicelo zabathengi abahlukeneyo kumandla ombane, iRF, abenzi boluvo kunye namanye amacandelo.

Ukuqwalasela ukugqwesa, ii-wafers zethu ze-SOI nazo zisebenzisa izinto eziphambili ezifana ne-gallium oxide Ga2O3, iikhasethi kunye ne-AlN wafers ukuqinisekisa ukuthembeka nokusebenza kakuhle kuwo wonke umgangatho wokusebenza. Thembela kwi-VET Energy ukuba ibonelele ngezisombululo ezikumgangatho ophezulu ezivula indlela yokuqhubela phambili kwezobuchwepheshe.

Khulula amandla eprojekthi yakho ngokusebenza okugqwesileyo kweVET Energy 12-intshi ye-SOI wafers. Yongeza izakhono zakho zokuqamba izinto ezintsha ngeewafers ezibandakanya umgangatho, ukuchaneka kunye nokuqamba izinto ezintsha, ubeka isiseko sempumelelo kwicandelo eliguqukayo letekhnoloji ye-semiconductor. Khetha Amandla e-VET kwizisombululo ze-SOI ze-wafer zeprimiyamu ezidlula ulindelo.

Umfanekiso we-6页-36
6页-35

IINGCACISO ZOKUXHAPHAZA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Into

8-intshi

6-Intshi

4-intshi

nP

n-Pm

n-Nd

SI

SI

TTV(GBIR)

≤6um

≤6um

I-Bow(GF3YFCD)-Ixabiso elipheleleyo

≤15μm

≤15μm

≤25μm

≤15μm

Warp(GF3YFER)

≤25μm

≤25μm

≤40μm

≤25μm

I-LTV(SBIR)-10mmx10mm

<2μm

Wafer Edge

Beveling

UBUPHAKAMBE GQIBELA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Into

8-intshi

6-Intshi

4-intshi

nP

n-Pm

n-Nd

SI

SI

Umphezulu Gqiba

Icala eliphindwe kabini le-Optical Polish, iSi- Face CMP

Ubunzima boMphezulu

(10um x 10um) Si-FaceRa≤0.2nm
I-C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
I-C-Face Ra≤0.5nm

IiChips zoMda

Akukho okuvunyelweyo (ubude nobubanzi≥0.5mm)

Iindenti

Akukho Ivumelekileyo

Imikrwelo(Si-Face)

Ubuninzi.≤5,Yongezeleka
Ubude≤0.5×i-wafer diameter

Ubuninzi.≤5,Yongezeleka
Ubude≤0.5×i-wafer diameter

Ubuninzi.≤5,Yongezeleka
Ubude≤0.5×i-wafer diameter

Iintanda

Akukho Ivumelekileyo

Ukungabandakanywa kuMda

3mm

ubuchwephesha_1_2_ubungakanani
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