6 Inch P Mofuta oa Silicon Wafer

Tlhaloso e Khutšoanyane:

VET Energy 6-inch P-silicon wafer ke thepa ea boleng bo holimo ea semiconductor, e sebelisoang haholo ha ho etsoa lisebelisoa tse fapaneng tsa elektroniki. VET Energy e sebelisa ts'ebetso e tsoetseng pele ea kholo ea CZ ho netefatsa hore sephaphatha se na le boleng bo holimo ba kristale, bofokoli bo tlase le ho tšoana ho holimo.

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Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Mohala oa sehlahisoa oa VET Energy ha o felle feela ho li-wafers tsa silicon. Re boetse re fana ka lisebelisoa tse ngata tse fapaneng tsa semiconductor substrate, ho kenyeletsoa SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, joalo-joalo, hammoho le lisebelisoa tse ncha tse pharalletseng tsa semiconductor tse kang Gallium Oxide Ga2O3 le AlN Wafer. Lihlahisoa tsena li ka fihlela litlhoko tsa ts'ebeliso ea bareki ba fapaneng ho lisebelisoa tsa motlakase tsa motlakase, maqhubu a seea-le-moea, li-sensor le likarolo tse ling.

Libaka tsa kopo:
•Li-circuits tse kopaneng:E le lisebelisoa tsa mantlha tsa tlhahiso e kopaneng ea potoloho, li-wafers tsa silicon tsa mofuta oa P li sebelisoa haholo lipotolohong tse fapaneng tsa mohopolo, mehopolo, jj.
•Lisebelisoa tsa motlakase:Li-wafer tsa silicon tsa mofuta oa P li ka sebelisoa ho etsa lisebelisoa tsa motlakase joalo ka li-transistors tsa motlakase le diode.
•Sensora:Li-wafers tsa silicon tsa mofuta oa P li ka sebelisoa ho etsa mefuta e fapaneng ea li-sensor, joalo ka li-sensor tsa khatello, li-sensor tsa mocheso, jj.
•Lisele tsa letsatsi:Li-wafers tsa silicon tsa mofuta oa P ke karolo ea bohlokoa ea lisele tsa letsatsi.

VET Energy e fa bareki litharollo tsa liphaephe tse ikhethileng, 'me e khona ho etsa li-wafers ka mokhoa o fapaneng oa ho hanyetsa, likahare tse fapaneng tsa oksijene, botenya bo fapaneng le litlhaloso tse ling ho latela litlhoko tse ikhethileng tsa bareki. Ntle le moo, re boetse re fana ka ts'ehetso ea botekgeniki le ts'ebeletso ea morao-rao ho thusa bareki ho rarolla mathata a fapaneng a kopaneng le ts'ebetso ea tlhahiso.

LIEKETSENG TSIETSO

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
Ntho	nP	n-Pm	n-Pes	SI	SI
TTV(GBIR)	≤6um	≤6um
Bow(GF3YFCD)-Boleng bo Felletseng	≤15μm	≤15μm	≤25μm		≤15μm
Warp(GF3YFER)	≤25μm	≤25μm	≤40μm		≤25μm
LTV(SBIR) -10mmx10mm	<2μm
Wafer Edge	Beveling

SEBAKA PHETHA

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
	nP	n-Pm	n-Pes	SI	SI
Surface Finish	Mahlakore a mabeli a Optical Polish, Si- Face CMP
SurfaceRoughness	(10um x 10um) Si-FaceRa≤0.2nm C-Face Ra≤ 0.5nm			(5umx5um) Si-Face Ra≤0.2nm C-Face Ra≤0.5nm
Li-Chips tsa Edge	Ha ho e dumellwe (bolelele le bophara≥0.5mm)
Li-indent	Ha ho le e 'ngoe e Lumelloang
Scratches(Si-Face)	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer			Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer
Mapetso	Ha ho le e 'ngoe e Lumelloang
Kenyelletso ea Edge	3mm