Thepa bakeng sa theknoloji ea LMJ microjet laser

Thepa bakeng sa LMJ microjet laser technology Featured Image

Tlhaloso e Khutšoanyane:

Sefate sa laser se tsepamisitsoeng se kopantsoe le jete ea metsi e lebelo le phahameng, 'me lebone la matla le nang le kabo e ts'oanang ea matla a karolo ea sefapano se thehoa ka mor'a ho nahanisisa ka botlalo leboteng le ka hare la kholomo ea metsi.E na le litšoaneleho tsa bophara ba mohala o tlaase, matla a matla a matla, tataiso e laoloang le ho fokotsa nako ea sebele ea mocheso oa holim'a thepa e entsoeng, ho fana ka maemo a babatsehang bakeng sa ho qeta ho kopantsoe le ho sebetsa hantle ha thepa e thata le e brittle.

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Melemo ea ts'ebetso ea LMJ

Bofokoli ba tlhaho ba ts'ebetso ea kamehla ea laser bo ka hlōloa ka tšebeliso e bohlale ea theknoloji ea laser Laser micro jet (LMJ) ho phatlalatsa litšobotsi tsa optical tsa metsi le moea.Theknoloji ena e lumella maqhubu a laser hore a bonahatsoe ka ho feletseng ka jete ea metsi a hloekileng a phahameng ka mokhoa o sa tsitsang ho fihla sebakeng sa machining joaloka optical fiber.Ho latela pono ea ts'ebeliso, litšobotsi tsa mantlha tsa theknoloji ea LMJ ke tse latelang:

1.Lebone la laser ke sebopeho sa columnar (parallel).

2.Laser pulse e fetisetsoa ka har'a metsi joaloka fiber optical, e sirelelitsoeng ho kena-kenana leha e le efe ea tikoloho.

3.Lebone la laser le tsepamisitsoe ho thepa ea LMJ, 'me ha ho na phetoho bophahamong ba sebaka se entsoeng ka mochine nakong ea ts'ebetso eohle ea machining, e le hore ho se ke ha e-ba le tlhokahalo ea ho tsepamisa mohopolo ka ho tsoelang pele ka phetoho ea botebo ba ts'ebetso nakong ea ts'ebetso ea mochine.

4. Ntle le ho tlosoa ha lisebelisoa tsa mosebetsi ho etsahetse nakong e 'ngoe le e' ngoe ea laser pulses, hoo e ka bang 99% ea nako ka nako e 'ngoe le e' ngoe ea yuniti ho tloha qalong ea sekhahla se seng le se seng ho ea ho sekhahla se latelang, thepa e sebetsitsoeng e nakong ea pholileng ea nako ea sebele. metsi, ka hona hoo e batlang e le ho hlakola sebaka se amehileng ke mocheso le lera la remelting, empa ho boloka ts'ebetso e phahameng ea ts'ebetso.

5.Kena u hloekisa sebaka se sebetsitsoeng.

Tlhaloso e akaretsang	LCSA-100	LCSA-200
Molumo oa countertop	125 x 200 x 100	460×460×300
Linear axis XY	Enjene ea mola.Enjene ea mola	Enjene ea mola.Enjene ea mola
Linear axis Z	100	300
Ho beha ho nepahala μm	+/ - 5	+/- 3
Ho nepahala ha maemo a phetoang μm	+/- 2	+/- 1
Ho potlakisa G	0.5	1
Taolo ya dipalo	3-axis	3-axis
Laser
Mofuta oa laser	DPSS Nd: YAG	DPSS Nd: YAG, ho otla ha pelo
Wavelength nm	532/1064	532/1064
Matla a lekantsoeng W	50/100/200	200/400
Jete ea metsi
Nozzle bophara μm	25-80	25-80
Nozzle khatello ea bar	100-600	0-600
Boholo/ Boima ba mmele
Litekanyo (Mochini) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Litekanyo (khabinete ea taolo) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Boima (thepa) kg	1170	2500-3000
Boima (taolo ea khabinete) lik'hilograma	700-750	700-750
Tšebeliso e felletseng ea matla
Input	AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1%	AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%
Boleng ba tlhoro	2.5kVA	2.5kVA
Join	10 m thapo ea matla: P+N+E, 1.5 mm2	10 m thapo ea matla: P+N+E, 1.5 mm2
Lethathamo la ts'ebeliso ea basebelisi ba indasteri ea semiconductor	≤4 lisenthimithara tse pota-potileng ≤4 lilae tsa ingot tsa lisenthimithara tse 4 ≤4 lisenthimithara tse 4 tsa ho ngola	≤6 lisenthimithara tse pota-potileng ≤6 lilae tsa ingot tsa inch ≤6 lisenthimithara tse 6 tsa ho ngola Mochini o kopana le boleng ba 8-inch / slicing / slicing theory, mme liphetho tse sebetsang li hloka ho ntlafatsoa leano la ho itšeha.