Thepa bakeng sa theknoloji ea LMJ microjet laser

Thepa bakeng sa LMJ microjet laser technology Featured Image

Tlhaloso e Khutšoanyane:

Sefate sa laser se tsepamisitsoeng se kopantsoe le jete ea metsi e lebelo le phahameng, 'me lebone la matla le nang le kabo e ts'oanang ea matla a karolo ea sefapano se thehoa ka mor'a ho nahanisisa ka botlalo leboteng le ka hare la kholomo ea metsi. E na le litšoaneleho tsa bophara ba mohala o tlaase, matla a matla a matla, tataiso e laoloang le ho fokotsa nako ea sebele ea mocheso oa holim'a thepa e entsoeng, ho fana ka maemo a babatsehang bakeng sa ho qeta ho kopantsoe le ho sebetsa hantle ha thepa e thata le e brittle.

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Melemo ea ts'ebetso ea LMJ

Bofokoli ba tlhaho ba ts'ebetso ea kamehla ea laser bo ka hlōloa ka tšebeliso e bohlale ea theknoloji ea laser Laser micro jet (LMJ) ho phatlalatsa litšobotsi tsa optical tsa metsi le moea. Theknoloji ena e lumella maqhubu a laser hore a bonahatsoe ka ho feletseng ka jete ea metsi a hloekileng a phahameng ka mokhoa o sa tsitsang ho fihla sebakeng sa machining joaloka optical fiber. Ho latela pono ea ts'ebeliso, litšobotsi tsa mantlha tsa theknoloji ea LMJ ke tse latelang:

1.Lebone la laser ke sebopeho sa columnar (parallel).

2.Laser pulse e fetisetsoa ka har'a metsi joaloka fiber optical, e sirelelitsoeng ho kena-kenana leha e le efe ea tikoloho.

3.Lebala la laser le tsepamisitsoe ho thepa ea LMJ, 'me ha ho na phetoho bophahamong ba sebaka se entsoeng ka mochine nakong ea ts'ebetso eohle ea machining, e le hore ho se ke ha hlokahala hore u lule u tsepamisitse maikutlo ka phetoho ea botebo ba ts'ebetso nakong ea ts'ebetso ea mochine.

4. Ntle le ho tlosoa ha lisebelisoa tsa mosebetsi ho etsahetse nakong e 'ngoe le e' ngoe ea laser pulses, hoo e ka bang 99% ea nako ka nako e 'ngoe le e' ngoe ea yuniti ho tloha qalong ea sekhahla se seng le se seng ho ea ho sekhahla se latelang, thepa e sebetsitsoeng e nakong ea pholileng ea nako ea sebele. metsi, ka hona hoo e batlang e le ho hlakola sebaka se amehileng ke mocheso le lera la remelting, empa ho boloka ts'ebetso e phahameng ea ts'ebetso.

5.Kena u hloekisa sebaka se sebetsitsoeng.

Tlhaloso e akaretsang	LCSA-100	LCSA-200
Molumo oa countertop	125 x 200 x 100	460×460×300
Linear axis XY	Enjene ea mola. Enjene ea mola	Enjene ea mola. Enjene ea mola
Linear axis Z	100	300
Ho beha ho nepahala μm	+/ - 5	+/- 3
Ho nepahala ha maemo a phetoang μm	+/- 2	+/- 1
Ho potlakisa G	0.5	1
Taolo ya dipalo	3-axis	3-axis
Laser
Mofuta oa laser	DPSS Nd: YAG	DPSS Nd: YAG, ho otla ha pelo
Wavelength nm	532/1064	532/1064
Matla a lekantsoeng W	50/100/200	200/400
Jete ea metsi
Nozzle bophara μm	25-80	25-80
Nozzle khatello ea bar	100-600	0-600
Boholo/ Boima ba mmele
Litekanyo (Mochini) (W x L x H)	1050 x 800 x 1870	1200 x 1200 x 2000
Litekanyo (khabinete ea taolo) (W x L x H)	700 x 2300 x 1600	700 x 2300 x 1600
Boima (thepa) kg	1170	2500-3000
Boima (taolo ea khabinete) lik'hilograma	700-750	700-750
Tšebeliso e felletseng ea matla
Input	AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1%	AC 400 V +6%/-10%, 3-phase50/60 Hz ±1%
Boleng ba tlhoro	2.5kVA	2.5kVA
Join	10 m thapo ea matla: P+N+E, 1.5 mm2	10 m thapo ea matla: P+N+E, 1.5 mm2
Lethathamo la ts'ebeliso ea basebelisi ba indasteri ea semiconductor	≤4 lisenthimithara tse pota-potileng ≤4 lilae tsa ingot tsa lisenthimithara tse 4 ≤4 lisenthimithara tse 4 tsa ho ngola	≤6 lisenthimithara tse pota-potileng ≤6 lilae tsa ingot tsa inch ≤6 lisenthimithara tse 6 tsa ho ngola Mochini o kopana le boleng ba 8-inch / slicing / slicing theory, mme liphetho tse sebetsang li hloka ho ntlafatsoa leano la ho itšeha.