Monocrystalline 8 Inch Silicon Wafer

Tlhaloso e Khutšoanyane:

VET Energy single crystal 8-inch silicon wafer ke sesebelisoa sa motheo se hloekileng, sa boleng bo holimo sa semiconductor. VET Energy e sebelisa ts'ebetso e tsoetseng pele ea kholo ea CZ ho netefatsa hore sephaphatha se na le boleng bo holimo ba kristale, sekoli se tlase le ho ts'oana ho holimo, se fana ka karolo e tiileng le e tšepahalang bakeng sa lisebelisoa tsa hau tsa semiconductor.

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Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Monocrystalline 8 Inch Silicon Wafer e tsoang ho VET Energy ke tharollo e etelletseng pele indastering bakeng sa tlhahiso ea lisebelisoa tsa semiconductor le lisebelisoa tsa elektroniki. E fana ka bohloeki bo phahameng le sebopeho sa kristale, li-wafers tsena li loketse lits'ebetso tse sebetsang hantle indastering ea photovoltaic le semiconductor. VET Energy e netefatsa hore sephaphatha se seng le se seng se sebetsoa ka makhethe ho fihlela litekanyetso tse phahameng ka ho fetesisa, se fana ka ho ts'oana ho hoholo le sephetho se boreleli, tse bohlokoa bakeng sa tlhahiso e tsoetseng pele ea lisebelisoa tsa elektroniki.

Li-Silicon Wafers tsena tsa Monocrystalline 8 Inch li tsamaisana le mefuta e mengata ea lisebelisoa, ho kenyeletsoa Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, 'me li loketse haholo kholo ea Epi Wafer. Ts'ebetso ea bona e phahameng ea mocheso le thepa ea motlakase e etsa hore e be khetho e ka tšeptjoang bakeng sa tlhahiso e phahameng. Ho feta moo, li-wafers tsena li etselitsoe ho sebetsa ka mokhoa o se nang moeli ka lisebelisoa tse kang Gallium Oxide Ga2O3 le AlN Wafer, tse fanang ka mefuta e mengata ea lisebelisoa ho tloha ho motlakase oa motlakase ho ea ho lisebelisoa tsa RF. Li-wafers li boetse li lumellana hantle le lits'ebetso tsa Cassette bakeng sa maemo a phahameng a tlhahiso, a ikemetseng.

Mohala oa sehlahisoa oa VET Energy ha o felle feela ho li-wafers tsa silicon. Re boetse re fana ka lisebelisoa tse ngata tse fapaneng tsa semiconductor substrate, ho kenyeletsoa SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, joalo-joalo, hammoho le lisebelisoa tse ncha tse pharalletseng tsa semiconductor tse kang Gallium Oxide Ga2O3 le AlN Wafer. Lihlahisoa tsena li ka fihlela litlhoko tsa ts'ebeliso ea bareki ba fapaneng ho lisebelisoa tsa motlakase tsa motlakase, maqhubu a seea-le-moea, li-sensor le likarolo tse ling.

VET Energy e fa bareki litharollo tse ikhethileng tsa liphaephe. Re ka Customize li-wafers ka resistivity fapaneng, dikahare oksijene, botenya, joalo-joalo ho ea ka litlhoko tse khethehileng tsa bareki. Ntle le moo, re boetse re fana ka ts'ehetso ea botekgeniki le ts'ebeletso ea morao-rao ho thusa bareki ho rarolla mathata a fapaneng a kopaneng nakong ea tlhahiso.

LIEKETSENG TSIETSO

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
Ntho	nP	n-Pm	n-Pes	SI	SI
TTV(GBIR)	≤6um	≤6um
Bow(GF3YFCD)-Boleng bo Felletseng	≤15μm	≤15μm	≤25μm		≤15μm
Warp(GF3YFER)	≤25μm	≤25μm	≤40μm		≤25μm
LTV(SBIR) -10mmx10mm	<2μm
Wafer Edge	Beveling

SEBAKA PHETHA

*n-Pm=n-mofuta oa Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulation

Ntho	8-Intshi	6-Intshi			4-Intshi
	nP	n-Pm	n-Pes	SI	SI
Surface Finish	Mahlakore a mabeli a Optical Polish, Si- Face CMP
SurfaceRoughness	(10um x 10um) Si-FaceRa≤0.2nm C-Face Ra≤ 0.5nm			(5umx5um) Si-Face Ra≤0.2nm C-Face Ra≤0.5nm
Li-Chips tsa Edge	Ha ho e dumellwe (bolelele le bophara≥0.5mm)
Li-indent	Ha ho le e 'ngoe e Lumelloang
Scratches(Si-Face)	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer	Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer			Kty.≤5, Kakaretso Bolelele≤0.5× bophara ba wafer
Mapetso	Ha ho le e 'ngoe e Lumelloang
Kenyelletso ea Edge	3mm