Fan out wafer level packaging (FOWLP) ndi njira yotsika mtengo m'makampani a semiconductor. Koma zotsatira zoyipa za njirayi ndi warping ndi chip offset. Ngakhale ukadaulo wopitilira muyeso wa wafer level ndi ukadaulo wa fan out, nkhani zokhudzana ndi kuumba zidakalipo.
Warping imayamba chifukwa cha kuchepa kwa mankhwala a liquid compression molding molding compound (LCM) pochiritsa ndi kuziziritsa pambuyo pakuumba. Chifukwa chachiwiri chomenyera nkhondo ndi kusagwirizana kwa coefficient of thermal expansion (CTE) pakati pa silicon chip, zomangira, ndi gawo lapansi. Offset ndi chifukwa chakuti zida zomangira za viscous zokhala ndi zodzaza zambiri zimatha kugwiritsidwa ntchito pokhapokha kutentha kwambiri komanso kupanikizika kwambiri. Pamene chip chimayikidwa kwa chonyamulira kupyolera mu mgwirizano kwakanthawi, kutentha kowonjezereka kudzafewetsa zomatira, motero kufooketsa mphamvu zake zomatira ndikuchepetsa mphamvu yake yokonza chip. Chifukwa chachiwiri chochotserako ndikuti kukakamiza kofunikira pakuwumba kumapangitsa kupsinjika pa chip chilichonse.
Pofuna kupeza njira zothetsera mavutowa, DELO adachita kafukufuku wotheka polumikiza chip chosavuta cha analogi pa chonyamulira. Pankhani yokhazikitsa, chonyamulira chonyamuliracho chimakutidwa ndi zomatira zomangira kwakanthawi, ndipo chip chimayikidwa chakuyang'ana pansi. Pambuyo pake, chophatikiziracho chinapangidwa pogwiritsa ntchito zomatira za DELO zocheperako ndikuchiritsidwa ndi cheza cha ultraviolet musanachotse chotengera chonyamuliracho. Pazinthu zotere, makina opangira ma viscosity thermosetting amagwiritsidwa ntchito.
DELO adayerekezanso zida zomangira zopangira ma thermosetting ndi zinthu zomwe zidachiritsidwa ndi UV pakuyesa, ndipo zotsatira zake zidawonetsa kuti zida zomangira zimapindika panthawi yozizira pambuyo pa thermosetting. Choncho, kugwiritsa ntchito kutentha kwa chipinda cha ultraviolet m'malo mwa kutentha kwa kutentha kungachepetse kwambiri kusagwirizana kwa kutentha kwapakati pakati pa makina opangira ndi chonyamulira, potero kuchepetsa kumenyana kwambiri.
Kugwiritsa ntchito zida zochiritsira za ultraviolet kungachepetsenso kugwiritsa ntchito zodzaza, potero kuchepetsa mamasukidwe akayendedwe ndi modulus ya Young. Kukhuthala kwa zomatira zachitsanzo zomwe zimagwiritsidwa ntchito poyesa ndi 35000 mPa · s, ndipo modulus ya Young ndi 1 GPa. Chifukwa cha kusakhalapo kwa kutentha kapena kupanikizika kwakukulu pazitsulo zomangira, chip offset ikhoza kuchepetsedwa kwambiri momwe zingathere. A yodziwika akamaumba pawiri ali mamasukidwe akayendedwe pafupifupi 800000 mPa · s ndi Young modulus mu osiyanasiyana manambala awiri.
Ponseponse, kafukufuku wasonyeza kuti kugwiritsa ntchito zida zochiritsira za UV pakuumba m'dera lalikulu ndikopindulitsa kupanga ma chip leader fan out wafer level package, ndikuchepetsa zida zankhondo ndi chip offset kwambiri momwe zingathere. Ngakhale kuti pali kusiyana kwakukulu kwa ma coefficients owonjezera kutentha pakati pa zipangizo zomwe zimagwiritsidwa ntchito, njirayi imakhalabe ndi ntchito zambiri chifukwa cha kusakhalapo kwa kutentha. Kuphatikiza apo, kuchiritsa kwa UV kungachepetsenso kuchiritsa nthawi komanso kugwiritsa ntchito mphamvu.
UV m'malo mochiritsa matenthedwe amachepetsa kutha kwa nkhondo ndikusintha kwakufa pamapaketi amtundu wa fan-out wafer-level
Kuyerekeza zowotcha zomata 12-inch pogwiritsa ntchito mankhwala ochiritsidwa ndi thermally, high-filler compound (A) ndi UV-curred compound (B)
Nthawi yotumiza: Nov-05-2024