8 Nti P Hom Silicon Wafer

Lus piav qhia luv luv:

Qhia tus hwm qib 8 Nti P Hom Silicon Wafer, lub cim ntawm kev ua tau zoo los ntawm VET Zog. Qhov tshwj xeeb wafer no, uas muaj P-hom doping profile, tau tsim kho kom zoo kom ua tau raws li cov qauv siab tshaj plaws ntawm kev ua tau zoo thiab kev ua tau zoo.


Product Detail

Khoom cim npe

Lub 8 Nti P Hom Silicon Wafer los ntawm VET Zog yog ib qho kev ua tau zoo silicon wafer tsim los rau ntau hom kev siv semiconductor, suav nrog lub hnub ci hlwb, MEMS cov khoom siv, thiab kev sib xyaw ua ke. Paub txog nws cov khoom siv hluav taws xob zoo heev thiab kev ua haujlwm zoo ib yam, qhov wafer no yog qhov kev xaiv zoo tshaj plaws rau cov tuam txhab nrhiav los tsim cov khoom siv hluav taws xob txhim khu kev qha thiab muaj txiaj ntsig zoo. VET Energy xyuas kom meej cov qib doping thiab ua tiav qhov zoo tshaj plaws rau kev tsim cov khoom siv zoo.

Cov 8 Nti P Hom Silicon Wafers tau ua tiav nrog ntau yam ntaub ntawv xws li SiC Substrate, SOI Wafer, SiN Substrate, thiab tsim nyog rau Epi Wafer txoj kev loj hlob, kom ntseeg tau ntau yam rau cov txheej txheem tsim khoom semiconductor. Cov wafers kuj tuaj yeem siv ua ke nrog lwm cov khoom siv high-tech xws li Gallium Oxide Ga2O3 thiab AlN Wafer, ua rau lawv zoo tagnrho rau kev siv hluav taws xob txuas ntxiv mus. Lawv cov qauv tsim muaj zog kuj haum seamlessly rau hauv Cassette-based systems, kom ntseeg tau tias muaj txiaj ntsig thiab ntim ntau lawm.

VET Energy muab cov neeg siv khoom nrog cov kev daws teeb meem wafer. Peb tuaj yeem hloov kho wafers nrog sib txawv resistivity, cov ntsiab lus oxygen, tuab, thiab lwm yam raws li cov neeg siv khoom xav tau tshwj xeeb. Tsis tas li ntawd, peb kuj muab kev pabcuam kev tshaj lij thiab kev pabcuam tomqab muag los pab cov neeg siv khoom daws teebmeem ntau yam uas tau ntsib thaum lub sijhawm tsim khoom.

Xov xwm 6-36
Nqe 6-35

WAFFERING SPECIFICATIONS

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating

Yam khoom

8-Inch

6-Inch

4-Inch

np

n- Pm

n-Ps

SI

SI

TVV (GBIR)

≤ 6 hli

≤ 6 hli

Hneev (GF3YFCD) - Tus Nqi Tsis Muaj

≤15μm

≤15μm

≤ 25μm

≤15μm

Warp (GF3YFER)

≤ 25μm

≤ 25μm

≤ 40μm

≤ 25μm

LTV (SBIR)-10mmx10mm

< 2 m os

Wafer Ntug

Beveling

NTAU NTAU

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating

Yam khoom

8-Inch

6-Inch

4-Inch

np

n- Pm

n-Ps

SI

SI

Nto tiav

Ob chav sab Optical Polish, Si- ntsej muag CMP

SurfaceRoughness

(10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm

Ntug Chips

Tsis Muaj Kev Tso Cai (ntev thiab dav ≥0.5mm)

Indents

Tsis Muaj Tso Cai

Scratches (Si-Face)

Qty.≤ 5, Ua kom tiav
Length≤0.5 × wafer txoj kab uas hla

Qty.≤ 5, Ua kom tiav
Length≤0.5 × wafer txoj kab uas hla

Qty.≤ 5, Ua kom tiav
Length≤0.5 × wafer txoj kab uas hla

Kev tawg

Tsis Muaj Tso Cai

Ntug Exclusion

3mm ib

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