Lub 8 Nti P Hom Silicon Wafer los ntawm VET Zog yog ib qho kev ua tau zoo silicon wafer tsim los rau ntau hom kev siv semiconductor, suav nrog lub hnub ci hlwb, MEMS cov khoom siv, thiab kev sib xyaw ua ke. Paub txog nws cov khoom siv hluav taws xob zoo heev thiab kev ua haujlwm zoo ib yam, qhov wafer no yog qhov kev xaiv zoo tshaj plaws rau cov tuam txhab nrhiav los tsim cov khoom siv hluav taws xob txhim khu kev qha thiab muaj txiaj ntsig zoo. VET Energy xyuas kom meej cov qib doping thiab ua tiav qhov zoo tshaj plaws rau kev tsim cov khoom siv zoo.
Cov 8 Nti P Hom Silicon Wafers tau ua tiav nrog ntau yam ntaub ntawv xws li SiC Substrate, SOI Wafer, SiN Substrate, thiab tsim nyog rau Epi Wafer txoj kev loj hlob, kom ntseeg tau ntau yam rau cov txheej txheem tsim khoom semiconductor. Cov wafers kuj tuaj yeem siv ua ke nrog lwm cov khoom siv high-tech xws li Gallium Oxide Ga2O3 thiab AlN Wafer, ua rau lawv zoo tagnrho rau kev siv hluav taws xob txuas ntxiv mus. Lawv cov qauv tsim muaj zog kuj haum seamlessly rau hauv Cassette-based systems, kom ntseeg tau tias muaj txiaj ntsig thiab ntim ntau lawm.
VET Energy muab cov neeg siv khoom nrog cov kev daws teeb meem wafer. Peb tuaj yeem hloov kho wafers nrog sib txawv resistivity, cov ntsiab lus oxygen, tuab, thiab lwm yam raws li cov neeg siv khoom xav tau tshwj xeeb. Tsis tas li ntawd, peb kuj muab kev pabcuam kev tshaj lij thiab kev pabcuam tomqab muag los pab cov neeg siv khoom daws teebmeem ntau yam uas tau ntsib thaum lub sijhawm tsim khoom.
WAFFERING SPECIFICATIONS
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating
Yam khoom | 8-Inch | 6-Inch | 4-Inch | ||
np | n- Pm | n-Ps | SI | SI | |
TVV (GBIR) | ≤ 6 hli | ≤ 6 hli | |||
Hneev (GF3YFCD) - Tus Nqi Tsis Muaj | ≤15μm | ≤15μm | ≤ 25μm | ≤15μm | |
Warp (GF3YFER) | ≤ 25μm | ≤ 25μm | ≤ 40μm | ≤ 25μm | |
LTV (SBIR)-10mmx10mm | < 2 m os | ||||
Wafer Ntug | Beveling |
NTAU NTAU
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating
Yam khoom | 8-Inch | 6-Inch | 4-Inch | ||
np | n- Pm | n-Ps | SI | SI | |
Nto tiav | Ob chav sab Optical Polish, Si- ntsej muag CMP | ||||
SurfaceRoughness | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
Ntug Chips | Tsis Muaj Kev Tso Cai (ntev thiab dav ≥0.5mm) | ||||
Indents | Tsis Muaj Tso Cai | ||||
Scratches (Si-Face) | Qty.≤ 5, Ua kom tiav | Qty.≤ 5, Ua kom tiav | Qty.≤ 5, Ua kom tiav | ||
Kev tawg | Tsis Muaj Tso Cai | ||||
Ntug Exclusion | 3mm ib |