4 Nti GaAs Wafer los ntawm VET Zog yog cov khoom siv tseem ceeb rau kev kub ceev thiab cov khoom siv hluav taws xob, suav nrog RF amplifiers, LEDs, thiab hnub ci hlwb. Cov wafers no paub txog lawv txoj kev txav hluav taws xob siab thiab muaj peev xwm ua haujlwm ntawm cov zaus ntau dua, ua rau lawv yog ib qho tseem ceeb hauv kev siv semiconductor siab heev. VET Energy ua kom zoo tshaj plaws GaAs wafers nrog cov tuab tuab thiab qhov tsis xws luag, haum rau ntau yam kev xav tau kev tsim khoom.
Cov 4 Inch GaAs Wafers no tau sib xws nrog ntau yam khoom siv semiconductor xws li Si Wafer, SiC Substrate, SOI Wafer, thiab SiN Substrate, ua rau lawv muaj ntau yam rau kev koom ua ke rau hauv cov cuab yeej sib txawv. Txawm hais tias siv rau Epi Wafer ntau lawm lossis nrog rau cov ntaub ntawv zoo li Gallium Oxide Ga2O3 thiab AlN Wafer, lawv muab lub hauv paus txhim khu kev qha rau cov khoom siv hluav taws xob txuas ntxiv mus. Tsis tas li ntawd, cov wafers tau ua tiav nrog Cassette-raws li kev tuav cov tshuab, ua kom muaj kev ua haujlwm zoo hauv ob qho tib si kev tshawb fawb thiab cov chaw tsim khoom loj.
VET Energy muaj cov ntaub ntawv nthuav dav ntawm cov khoom siv hluav taws xob semiconductor, suav nrog Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, Gallium Oxide Ga2O3, thiab AlN Wafer. Peb cov kab khoom sib txawv caters rau cov kev xav tau ntawm ntau yam kev siv hluav taws xob, los ntawm hluav taws xob hluav taws xob mus rau RF thiab optoelectronics.
VET Energy muab GaAs wafers customizable kom tau raws li koj cov kev xav tau tshwj xeeb, suav nrog ntau qib doping, kev taw qhia, thiab kev ua tiav. Peb pab pawg kws tshaj lij muab kev txhawb nqa thiab kev pabcuam tomqab muag kom ntseeg tau tias koj ua tiav.
WAFFERING SPECIFICATIONS
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating
Yam khoom | 8-Inch | 6-Inch | 4-Inch | ||
np | n- Pm | n-Ps | SI | SI | |
TVV (GBIR) | ≤ 6 hli | ≤ 6 hli | |||
Hneev (GF3YFCD) - Tus Nqi Tsis Muaj | ≤15μm | ≤15μm | ≤ 25μm | ≤15μm | |
Warp (GF3YFER) | ≤ 25μm | ≤ 25μm | ≤ 40μm | ≤ 25μm | |
LTV (SBIR)-10mmx10mm | < 2 m os | ||||
Wafer Ntug | Beveling |
NTAU NTAU
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating
Yam khoom | 8-Inch | 6-Inch | 4-Inch | ||
np | n- Pm | n-Ps | SI | SI | |
Nto tiav | Ob chav sab Optical Polish, Si- ntsej muag CMP | ||||
SurfaceRoughness | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
Ntug Chips | Tsis Muaj Kev Tso Cai (ntev thiab dav ≥0.5mm) | ||||
Indents | Tsis Muaj Tso Cai | ||||
Scratches (Si-Face) | Qty.≤ 5, Ua kom tiav | Qty.≤ 5, Ua kom tiav | Qty.≤ 5, Ua kom tiav | ||
Kev tawg | Tsis Muaj Tso Cai | ||||
Ntug Exclusion | 3mm ib |