12 nti Silicon Wafer rau Semiconductor Fabrication muab los ntawm VET Zog yog tsim los ua kom tau raws li cov qauv tsim nyog hauv kev lag luam semiconductor. Raws li ib qho ntawm cov khoom lag luam hauv peb cov khoom lag luam, VET Zog ua kom cov wafers no tau tsim nrog kev ua kom zoo, purity, thiab nto zoo, ua rau lawv zoo tagnrho rau cov ntawv siv semiconductor, suav nrog microchips, sensors, thiab cov khoom siv hluav taws xob siab heev.
Cov wafer no tau sib xws nrog ntau yam khoom siv xws li Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, thiab Epi Wafer, muab kev ua tau zoo rau ntau yam txheej txheem fabrication. Tsis tas li ntawd, nws ua ke zoo nrog cov thev naus laus zis zoo li Gallium Oxide Ga2O3 thiab AlN Wafer, kom ntseeg tau tias nws tuaj yeem ua ke rau hauv cov ntawv thov tshwj xeeb. Rau kev ua haujlwm du, lub wafer yog qhov zoo rau kev siv nrog kev lag luam-tus qauv Cassette systems, kom ntseeg tau tias kev tuav tau zoo hauv kev tsim khoom semiconductor.
VET Energy cov khoom lag luam tsis txwv rau silicon wafers. Peb kuj muab ntau yam khoom siv semiconductor substrate, suav nrog SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, thiab lwm yam, nrog rau cov ntaub ntawv tshiab dav dav semiconductor xws li Gallium Oxide Ga2O3 thiab AlN Wafer. Cov khoom no tuaj yeem ua tau raws li daim ntawv thov kev xav tau ntawm cov neeg siv khoom sib txawv hauv lub zog hluav taws xob, xov tooj cua zaus, sensors thiab lwm yam.
Kev siv thaj chaw:
•Logic chips:Kev tsim cov txheej txheem kev ua haujlwm siab xws li CPU thiab GPU.
•Memory chips:Kev tsim cov chips nco xws li DRAM thiab NAND Flash.
•Analog chips:Kev tsim cov analog chips xws li ADC thiab DAC.
•Sensors:MEMS sensors, duab sensors, thiab lwm yam.
VET Energy muab cov neeg siv khoom nrog cov kev daws teeb meem wafer, thiab tuaj yeem hloov kho wafers nrog sib txawv resistivity, sib txawv oxygen cov ntsiab lus, txawv thickness thiab lwm yam specifications raws li cov kev xav tau ntawm cov neeg muas zaub. Tsis tas li ntawd, peb kuj muab kev txhawb nqa kev tshaj lij thiab kev pabcuam tomqab muag los pab cov neeg siv khoom txhim kho cov txheej txheem tsim khoom thiab txhim kho cov khoom lag luam.
WAFFERING SPECIFICATIONS
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating
Yam khoom | 8-Inch | 6-Inch | 4-Inch | ||
np | n- Pm | n-Ps | SI | SI | |
TVV (GBIR) | ≤ 6 hli | ≤ 6 hli | |||
Hneev (GF3YFCD) - Tus Nqi Tsis Muaj | ≤15μm | ≤15μm | ≤ 25μm | ≤15μm | |
Warp (GF3YFER) | ≤ 25μm | ≤ 25μm | ≤ 40μm | ≤ 25μm | |
LTV (SBIR)-10mmx10mm | <2 m | ||||
Wafer Ntug | Beveling |
NTAU NTAU
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating
Yam khoom | 8-Inch | 6-Inch | 4-Inch | ||
np | n- Pm | n-Ps | SI | SI | |
Nto tiav | Ob chav sab Optical Polish, Si- ntsej muag CMP | ||||
SurfaceRoughness | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
Ntug Chips | Tsis Muaj Kev Tso Cai (ntev thiab dav ≥0.5mm) | ||||
Indents | Tsis Muaj Tso Cai | ||||
Scratches (Si-Face) | Qty.≤ 5, Ua kom tiav | Qty.≤ 5, Ua kom tiav | Qty.≤ 5, Ua kom tiav | ||
Kev tawg | Tsis Muaj Tso Cai | ||||
Ntug Exclusion | 3mm ib |