ʻO ka Monocrystalline 8 Inch Silicon Wafer mai VET Energy kahi hopena alakaʻi alakaʻi no ka semiconductor a me nā mea uila uila. Ke hāʻawi nei i ka maʻemaʻe maikaʻi a me ka hoʻolālā crystalline, kūpono kēia mau wafers no nā noi hana kiʻekiʻe ma nā ʻoihana photovoltaic a me semiconductor. Hoʻomaopopo ʻo VET Energy i ka hana ʻia ʻana o kēlā me kēia wafer e hoʻokō i nā kūlana kiʻekiʻe loa, e hāʻawi ana i ka lokahi maikaʻi a me ka hoʻopau ʻana i ka ʻili maʻemaʻe, he mea nui ia no ka hana ʻana i nā mea uila.
Ua kūpono kēia mau Monocrystalline 8 Inch Silicon Wafers me nā ʻano mea like ʻole, me Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, a kūpono loa ia no ka ulu ʻana o Epi Wafer. ʻO kā lākou ʻoi aku ka maikaʻi o ka thermal conductivity a me nā waiwai uila e koho pono iā lākou no ka hana kiʻekiʻe. Hoʻohui ʻia, ua hoʻolālā ʻia kēia mau wafers e hana maʻalahi me nā mea e like me Gallium Oxide Ga2O3 a me AlN Wafer, e hāʻawi ana i kahi ākea o nā noi mai ka uila uila a i nā polokalamu RF. Ua kūpono pū nā wafers i nā ʻōnaehana Cassette no nā kaiapuni hoʻomohala kiʻekiʻe.
ʻAʻole i kaupalena ʻia ka laina huahana o VET Energy i nā wafer silika. Hāʻawi pū mākou i kahi ākea o nā mea semiconductor substrate, me SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, etc., a me nā mea semiconductor broadgap hou e like me Gallium Oxide Ga2O3 a me AlN Wafer. Hiki i kēia mau huahana ke hoʻokō i nā pono noi o nā mea kūʻai aku i ka uila uila, ka lekiō, nā sensor a me nā ʻano ʻē aʻe.
Hāʻawi ʻo VET Energy i nā mea kūʻai aku i nā hoʻonā wafer maʻamau. Hiki iā mākou ke hana i nā wafers me nā resistivity like ʻole, ka ʻike oxygen, ka mānoanoa, a me nā mea ʻē aʻe e like me nā pono kikoʻī o nā mea kūʻai aku. Eia kekahi, hāʻawi pū mākou i ke kākoʻo ʻenehana loea a me ka lawelawe ma hope o ke kūʻai aku e kōkua i nā mea kūʻai aku e hoʻoponopono i nā pilikia like ʻole i loaʻa i ka wā o ke kaʻina hana.
OLELO HOOLAHA WAFERING
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
'ikamu | 8-Inika | 6-Iniha | 4-Iniha | ||
nP | n-Pm | n-Ps | SI | SI | |
TTV(GBIR) | ≤6um | ≤6um | |||
Kakaka (GF3YFCD)-Waiwai Loa | ≤15μm | ≤15μm | ≤25μm | ≤15μm | |
Warp(GF3YFER) | ≤25μm | ≤25μm | ≤40μm | ≤25μm | |
LTV(SBIR)-10mmx10mm | <2μm | ||||
Wafer Edge | ʻO ka beveling |
ILI HOPE
*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating
'ikamu | 8-Inika | 6-Iniha | 4-Iniha | ||
nP | n-Pm | n-Ps | SI | SI | |
Hoʻopau ʻili | ʻaoʻao ʻelua Optical Polish, Si- Face CMP | ||||
ʻAhaʻulaʻula | (10um x 10um) Si-FaceRa≤0.2nm | (5umx5um) Si-Face Ra≤0.2nm | |||
ʻOpeʻa lihi | ʻAʻohe ʻae ʻia (lōʻihi a laula≥0.5mm) | ||||
Indents | ʻAʻole ʻae ʻia | ||||
Nā ʻōpala (Si-Face) | Ka nui.≤5, Huihui | Ka nui.≤5, Huihui | Ka nui.≤5, Huihui | ||
māwae | ʻAʻole ʻae ʻia | ||||
Hoʻokuʻu Edge | 3mm |