Graphite mold/Jigs / fixture for Semiconductor Encapsulations by Glass-to-Metal Sealing
Nā hiʻohiʻona o kā mākou mold graphite:
1. ʻO nā ʻāpana graphite kekahi o nā mea wela loa i kēia manawa.
2. Me ka maikaʻi o ka haʻalulu haʻalulu, ʻaʻohe māwae i ka wā wela a me ke anu
3. ʻOi aku ka maikaʻi o ka thermal conductivity a me nā waiwai conductive
4. ʻO ka lubrication maikaʻi a me ke kū'ē abrasion
5. ʻO ke kūpaʻa kemika, ka waikawa a me ke kūpaʻa alkali a me ka pale ʻana i ka corrosion, ʻaʻole maʻalahi ke hana me ka nui o nā metala
6. ʻO ka hale hana hoʻolako i ka graphite sintering mold maʻalahi e hana, maikaʻi ka hana ʻana i ka mīkini hana, hiki ke hana i ke ʻano paʻakikī a me ke kiʻekiʻe precision mold.
Palapala noi
Ua hoʻohana nui ʻia ka mold graphite ma nā ʻano:
1.Continuous hoolei mold
2.Pressure foundry mold
3.Glass molding me ka make
4.Sintering mold
5.Centrifugal hoʻoheheʻe ʻia
6. Smelt gula, kala, mea nani……
Ka nui o ka palaoa (μm) | 25 | 25 | 25 | 25 |
ʻAiʻi Nui (≥g/cm3) | 1.8 | 1.8 | 1.85 | 1.85 |
Ka ikaika hoʻopili (≥MPa) | 60 | 60 | 70 | 70 |
Ikaika Flexural (≥MPa) | 30 | 30 | 35 | 35 |
Porosity (≤%) | 21 | 21 | 18 | 18 |
Kū'ē Kūikawā (≤μΩm) | 12 | 12 | 12 | 12 |
Lehu maʻiʻo (≤%) | 0.08 | 0.08 | 0.08 | 0.08 |
Kahakai ʻoʻoleʻa | 48 | 48 | 50 | 50 |