Fan out wafer matakin marufi (FOWLP) hanya ce mai inganci a cikin masana'antar semiconductor. Amma illar illar wannan tsari shine warping da guntu diyya. Duk da ci gaba da haɓaka matakin wafer da matakin fan fitar da fasaha, waɗannan batutuwan da suka shafi gyare-gyare har yanzu suna wanzu.
Warping yana faruwa ta hanyar raguwar sinadarai na gyare-gyaren ruwa (LCM) yayin warkewa da sanyaya bayan gyare-gyare. Dalili na biyu na warping shine rashin daidaituwa a daidaitaccen haɓakar haɓakar thermal (CTE) tsakanin guntun siliki, kayan gyare-gyare, da ma'auni. Ragewa ya faru ne saboda gaskiyar cewa kayan gyare-gyaren danko tare da babban abun ciki na filler yawanci ana iya amfani da su ƙarƙashin babban zafin jiki da matsa lamba. Kamar yadda guntu ke daidaitawa ga mai ɗaukar hoto ta hanyar haɗin gwiwa na ɗan lokaci, ƙara yawan zafin jiki zai yi laushi ga abin ɗaure, ta haka yana raunana ƙarfin mannewa da rage ikonsa na gyara guntu. Dalili na biyu na biya diyya shine cewa matsa lamba da ake buƙata don yin gyare-gyare yana haifar da damuwa akan kowane guntu.
Domin nemo mafita ga waɗannan ƙalubalen, DELO ta gudanar da binciken yuwuwar ta hanyar haɗa guntu mai sauƙi na analog akan mai ɗauka. Dangane da saitin, an lulluɓe wafer ɗin mai ɗaukar hoto tare da mannen haɗin gwiwa na ɗan lokaci, kuma guntu an sanya shi ƙasa. Daga baya, an ƙera wafer ɗin ta amfani da ƙaramin ɗanko mai DELO kuma an warke tare da hasken ultraviolet kafin cire wafer mai ɗaukar hoto. A cikin irin waɗannan aikace-aikacen, ana amfani da ƙaƙƙarfan gyare-gyaren gyare-gyaren zafi mai ƙarfi.
DELO kuma ya kwatanta warpage na kayan gyare-gyaren thermosetting da samfuran da aka warkar da UV a cikin gwajin, kuma sakamakon ya nuna cewa kayan gyare-gyare na yau da kullun za su fashe yayin lokacin sanyaya bayan thermosetting. Sabili da haka, yin amfani da zafin jiki na ultraviolet warkewa maimakon dumama warkewa na iya rage tasirin rashin daidaituwar haɓakar haɓakar thermal mai ƙarfi tsakanin mahaɗan gyare-gyaren da mai ɗaukar hoto, ta haka rage warping zuwa mafi girman yiwuwar.
Yin amfani da kayan warkarwa na ultraviolet kuma na iya rage amfani da filaye, ta yadda zai rage danko da modulolin matasa. Dankowar abin manne samfurin da aka yi amfani da shi a gwajin shine 35000mPa · s, kuma ma'aunin Matasa shine 1 GPa. Saboda rashin dumama ko matsa lamba akan kayan gyare-gyare, za'a iya rage girman guntu zuwa mafi girman yiwuwar. Wurin gyare-gyare na yau da kullun yana da ɗanƙon kusan 800000 mPa · s da ma'aunin matashi a cikin kewayon lambobi biyu.
Gabaɗaya, bincike ya nuna cewa yin amfani da kayan warkarwa na UV don gyare-gyaren yanki mai girma yana da fa'ida don samar da jagorar guntu fan fitar da marufi matakin wafer, yayin da rage girman shafi da guntu diyya zuwa ga mafi girman yiwuwar. Duk da bambance-bambance masu mahimmanci a cikin haɓakar haɓakar zafin jiki tsakanin kayan da aka yi amfani da su, wannan tsari har yanzu yana da aikace-aikace da yawa saboda rashin bambancin zafin jiki. Bugu da kari, UV curing kuma iya rage curing lokaci da makamashi amfani.
UV maimakon maganin zafin jiki yana rage wargin kuma ya mutu canji a cikin fakitin matakin wafer.
Kwatanta wafers mai rufaffiyar inci 12 ta yin amfani da ingantaccen warkewa, fili mai filler (A) da fili mai warkewar UV (B)
Lokacin aikawa: Nuwamba-05-2024