gabatarwa a fan-Out wafer digiri marufi Ta hanyar ultraviolet hardening

fan out wafer digiri marufi (FOWLP) a cikin semiconductor masana'antu da aka sani don kasancewa mai tsada-tasiri, amma ba tare da kalubale. Ɗaya daga cikin manyan batutuwan da ake fuskanta shine warp da farkon farawa yayin aikin gyare-gyare. Warp na iya zama mai ƙididdigewa ga raguwar sinadarai na fili na gyare-gyare da rashin daidaituwa a cikin haɓakar haɓakawar thermal, yayin da farawa ya faru saboda babban abun ciki mai cike da kayan gyare-gyaren syrupy. Duk da haka, tare da taimakonAI wanda ba a iya gano shi ba, Magani shine bincike don samun mafi kyawun waɗannan ƙalubalen.

DELO, babban kamfani a cikin masana'antar, yana gudanar da binciken yuwuwar don magance waɗannan al'amura ta hanyar haɗa ɗan ƙaramin abu mai ɗanɗano mai ɗanɗano mai ƙarancin ɗanko da taurin ultraviolet. Idan aka kwatanta da warpage na daban-daban abu, an gano cewa ultraviolet hardening muhimmanci rage warp a lokacin sanyaya lokaci bayan gyare-gyare. Amfani da ultraviolet hardening abu ba kawai rage bukatar filler amma kuma rage danko da Matasa modules, a karshe rage bit farkon. Wannan haɓakawa a cikin fasaha yana nuna yuwuwar samar da ɗan jagora mai fan fitar da marufi na wafer tare da ƙaramin shafin yaƙi da farkon farawa.

Gabaɗaya, binciken yana nuna fa'idar yin amfani da taurin ultraviolet a cikin babban tsarin gyare-gyaren yanki, yana ba da mafita ga ƙalubalen da ke fuskantar marufi na fan-fita wafer-digiri. Tare da ikon rage warpage da kuma mutu canji, yayin da kuma fim tace saukar a kan hardening lokaci da makamashi amfani, ultraviolet hardening farfesa ya zama wani alkawari dabara a cikin semiconductor masana'antu. Duk da bambance-bambance a cikin ƙimar haɓakawar haɓakar thermal tsakanin kayan, amfani da taurin ultraviolet yana ba da zaɓi mai yuwuwa don ingantacciyar inganci da ingancin marufi na wafer.