I-Silicon Carbide (SiC) i-Epitaxial Wafer

Incazelo emfushane:

I-Silicon Carbide (SiC) Epitaxial Wafer evela ku-VET Energy ingaphansi elisebenza kahle eliklanyelwe ukuhlangabezana nezidingo ezidingekayo zamandla esizukulwane esilandelayo namadivayisi e-RF. I-VET Energy iqinisekisa ukuthi i-epitaxial wafer ngayinye ikhiqizwa ngokucophelela ukuze inikeze ukuguquguquka okushisayo okuphezulu, i-voltage ye-breakdown, kanye nokuhamba kwenkampani yenethiwekhi, okuyenza ilungele izinhlelo zokusebenza ezifana nezimoto zikagesi, ukuxhumana kwe-5G, namandla kagesi asebenza kahle kakhulu.


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

I-VET Energy silicon carbide (SiC) i-epitaxial wafer iyisici se-semiconductor ye-bandgap ephezulu esebenza kahle kakhulu enokumelana nezinga lokushisa eliphakeme kakhulu, imvamisa ephezulu nezici zamandla aphezulu. Kuyi-substrate ekahle yesizukulwane esisha samadivayisi kagesi kagesi. I-VET Energy isebenzisa ubuchwepheshe obuthuthukisiwe be-MOCVD be-epitaxial ukuze kukhule izendlalelo ze-SiC epitaxial zekhwalithi ephezulu kuma-substrates e-SiC, iqinisekisa ukusebenza okuhle kakhulu nokuvumelana kwe-wafer.

I-Silicon Carbide (SiC) yethu ye-Epitaxial Wafer inikezela ngokuhambisana okuhle kakhulu nezinhlobonhlobo zezinto zokwakha ze-semiconductor ezihlanganisa i-Si Wafer, i-SiC Substrate, i-SOI Wafer, ne-SiN Substrate. Ngongqimba oluqinile lwe-epitaxial, isekela izinqubo ezithuthukisiwe ezifana nokukhula kwe-Epi Wafer nokuhlanganiswa nezinto ezifana ne-Gallium Oxide Ga2O3 ne-AlN Wafer, iqinisekisa ukusetshenziswa okuhlukahlukene kubo bonke ubuchwepheshe obuhlukahlukene. Idizayinelwe ukuhambisana nezinhlelo zokuphatha amakhasethi ezisezingeni lemboni, iqinisekisa ukusebenza okusebenzayo nokulula ezindaweni zokwenziwa kwe-semiconductor.

Ulayini womkhiqizo we-VET Energy awukhawulelwe kuma-wafer e-SiC epitaxial. Siphinde futhi sinikeze ngezinhlobonhlobo zezinto ezisetshenziswayo ze-semiconductor substrate, okuhlanganisa i-Si Wafer, i-SiC Substrate, i-SOI Wafer, i-SiN Substrate, i-Epi Wafer, njll. Ngaphezu kwalokho, sithuthukisa futhi ngenkuthalo izinto ezintsha ze-bandgap semiconductor ezintsha, njenge-Gallium Oxide Ga2O3 ne-AlN. I-Wafer, ukuhlangabezana nesidingo semboni yezogesi zamandla esizayo samadivayisi asebenza kakhulu.

Ikhasi 6-36
Ikhasi 6-35

IMICIMBI YOKUFAKA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating

Into

8-Intshi

6-Intshi

4-Intshi

nP

n-Pm

n-IHu

SI

SI

I-TTV(GBIR)

≤6um

≤6um

Umnsalo(GF3YFCD)-Inani Eliphelele

≤15μm

≤15μm

≤25μm

≤15μm

I-Warp(GF3YFER)

≤25μm

≤25μm

≤40μm

≤25μm

I-LTV(SBIR)-10mmx10mm

<2μm

I-Wafer Edge

Beveling

UBUHLUNGU QEDA

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Grade,Sl=Semi-lnsulating

Into

8-Intshi

6-Intshi

4-Intshi

nP

n-Pm

n-IHu

SI

SI

I-Surface Qeda

I-Double side Optical Polish, i-Si- Face CMP

I-SurfaceRoughness

(10um x 10um) I-Si-FaceRa≤0.2nm
I-C-Face Ra≤ 0.5nm

(5umx5um) I-Si-Face Ra≤0.2nm
I-C-Face Ra≤0.5nm

Ama-Edge Chips

Akukho okuvunyelwe (ubude nobubanzi≥0.5mm)

Izindebe

Akukho Okuvunyelwe

Imihuzuko(Si-Face)

Ubuningi.≤5,Okuqoqekile
Ubude≤0.5× ububanzi bewafa

Ubuningi.≤5,Okuqoqekile
Ubude≤0.5× ububanzi bewafa

Ubuningi.≤5,Okuqoqekile
Ubude≤0.5× ububanzi bewafa

Imifantu

Akukho Okuvunyelwe

Ukukhishwa komkhawulo

3mm

tech_1_2_size
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