Ukwenziwa kweUV yeFan-Out Wafer-Level Packaging

I-Fan out wafer level packaging (FOWLP) yindlela engabizi kakhulu kwishishini le-semiconductor. Kodwa iziphumo ebezingalindelekanga eziqhelekileyo zale nkqubo zi-warping kunye ne-chip offset. Ngaphandle kokuphuculwa okuqhubekayo kwenqanaba le-wafer kunye nenqanaba lephaneli yetekhnoloji yefenitshala, le miba inxulumene nokubumba isekhona.

I-Warping ibangelwa yi-chemical shrinkage ye-liquid compression molding compound (LCM) ngexesha lokunyanga kunye nokupholisa emva kokubumba. Isizathu sesibini se-warping kukungafani kwe-coefficient yokwanda kwe-thermal (CTE) phakathi kwe-silicon chip, imathiriyeli yokubumba, kunye ne-substrate. I-Offset ibangelwa kukuba izinto zokubumba i-viscous ezinomxholo ophezulu wokuzalisa ngokuqhelekileyo zinokusetyenziswa kuphela phantsi kobushushu obuphezulu kunye noxinzelelo oluphezulu. Njengoko i-chip igxininiswe kwi-carrier ngokusebenzisa i-bonding yesikhashana, ukunyuka kweqondo lokushisa kuya kuthambisa i-adhesive, ngaloo ndlela iyancipha amandla ayo okunamathela kunye nokunciphisa amandla ayo okulungisa i-chip. Isizathu sesibini se-offset kukuba uxinzelelo olufunekayo ekubumbeni ludala uxinzelelo kwi-chip nganye.

Ukuze kufumaneke izisombululo kule mingeni, iDELO yenze uphononongo lokwenzeka ngokubophelela itshiphu ye-analog kumthwali. Ngokumalunga nokuseta, i-wafer ye-carrier ifakwe nge-adhesive ye-bonding yesikhashana, kwaye i-chip ibekwe phantsi. Emva koko, i-wafer yabunjwa kusetyenziswa i-viscosity ephantsi ye-DELO adhesive kwaye yanyangwa ngemitha ye-ultraviolet ngaphambi kokususa i-wafer ye-carrier. Kwizicelo ezinjalo, i-viscosity ephezulu yokubumba i-thermosetting composite isetyenziswa ngokuqhelekileyo.

I-DELO iphinde yathelekisa i-warpage yezixhobo zokubumba ze-thermosetting kunye neemveliso eziphilisiweyo ze-UV kuvavanyo, kwaye iziphumo zabonisa ukuba izinto eziqhelekileyo zokubumba ziya kujika ngexesha lokupholisa emva kwe-thermosetting. Ke ngoko, ukusebenzisa ubushushu begumbi lokunyanga i-ultraviolet endaweni yokunyanga ukufudumeza kunokunciphisa kakhulu impembelelo yokwandiswa kwe-thermal coefficient engafaniyo phakathi kwekhompawundi yokubumba kunye nomthwali, ngaloo ndlela kuncitshiswe ukulwa kowona mgangatho unokwenzeka.

Ukusetyenziswa kwezixhobo zokunyanga i-ultraviolet kunokunciphisa ukusetyenziswa kweefayili, ngaloo ndlela ukunciphisa i-viscosity kunye ne-Young's modulus. I-viscosity ye-adhesive model esetyenziswe kuvavanyo yi-35000 mPa · s, kunye ne-Young's modulus yi-1 GPa. Ngenxa yokungabikho kokufudumeza okanye uxinzelelo oluphezulu kwizinto ezibunjwayo, i-chip offset inokuncitshiswa kakhulu kangangoko kunokwenzeka. Ikhompawundi yokubumba eqhelekileyo ine-viscosity emalunga ne-800000 mPa · s kunye ne-Young's modulus kuluhlu lwamanani amabini.

Lilonke, uphando lubonise ukuba ukusebenzisa izixhobo ezinyangwayo ze-UV zokubumba indawo enkulu kuluncedo ekuveliseni i-chip leader fan fan yokupakisha inqanaba le-wafer, ngelixa kuncitshiswa i-warpage kunye ne-chip offset ukuya kwinqanaba elikhulu kunokwenzeka. Nangona kukho ukungafani okuphawulekayo kwi-coefficients yokwandiswa kwe-thermal phakathi kwezinto ezisetyenzisiweyo, le nkqubo isenayo izicelo ezininzi ngenxa yokungabikho kokuhluka kweqondo lokushisa. Ukongeza, ukunyanga kwe-UV kunokunciphisa ixesha lokunyanga kunye nokusetyenziswa kwamandla.

I-UV endaweni yokunyanga i-thermal iyanciphisa i-warpage kwaye isweleke kwi-fan-out wafer-level package.

Ukuthelekisa ii-intshi ezili-12 zee-wafers ezicandiweyo kusetyenziswa ikhompawundi ephiliswe ngokushushu, ene-high-filler (A) kunye ne-UV-curred compound (B)