Njengoko kubonisiwe ngasentla, yinto eqhelekileyo
Isiqingatha sokuqala:
▪ Into yokufudumeza (ikhoyili yokufudumeza) :
ibekwe malunga netyhubhu yesithando somlilo, edla ngokwenziwa ngeengcingo zokuxhathisa, ezisetyenziselwa ukufudumeza ngaphakathi kwityhubhu yesithando somlilo.
▪ Umbhobho weQuartz:
Undoqo wesithando somlilo se-oxidation, esenziwe nge-quartz ecocekileyo enokumelana nokushisa okuphezulu kwaye ihlale i-inert yekhemikhali.
▪ Ukutya kwerhasi:
Ifumaneka kwindawo ephezulu okanye kwicala lombhobho wesithando somlilo, isetyenziselwa ukuthutha i-oksijini okanye ezinye iigesi ukuya ngaphakathi kwiphubhu yesithando somlilo.
▪ I-SS Flange:
amacandelo adibanisa iibhubhu ze-quartz kunye nemigca yegesi, ukuqinisekisa ukuqina kunye nokuzinza koqhagamshelwano.
▪ Imizila yeGesi:
Imibhobho edibanisa i-MFC kwizibuko lokubonelela ngegesi yokuhambisa igesi.
▪ I-MFC (IsiLawuli sokuHamba kweSininzi) :
Isixhobo esilawula ukuhamba kwegesi ngaphakathi kwityhubhu yequartz ukulawula ngokuchanekileyo ubungakanani begesi efunekayo.
▪ Ukuvula:
Isetyenziselwa ukukhupha igesi yokukhupha ngaphakathi kwityhubhu yesithando somlilo ukuya ngaphandle kwesixhobo.
Inxalenye engezantsi:
▪ Ii-Silicon Wafers ezikwiSibambi:
Ii-silicone wafers zigcinwe kwi-Holder ekhethekileyo ukuqinisekisa ukushisa okufanayo ngexesha le-oxidation.
▪ IsiPhathi seWafer:
Isetyenziselwa ukubamba i-silicon wafer kunye nokuqinisekisa ukuba i-silicon wafer ihlala izinzile ngexesha lenkqubo.
▪ Isiseko:
Isakhiwo esibambe iSilicon wafer Holder, esihlala senziwe ngezinto ezinokumelana nobushushu obuphezulu.
▪ Ilifti:
Isetyenziselwa ukuphakamisa izibambi zeWafer ukungena nokuphuma kwiityhubhu zequartz zokulayisha ngokuzenzekelayo kunye nokothula ii-wafers zesilicon.
▪ Irobhothi yoKugqithisela iWafer:
ebekwe kwicala lesixhobo setyhubhu yesithando somlilo, isetyenziselwa ukususa ngokuzenzekelayo isiqwenga se-silicon ukusuka kwibhokisi kwaye sibeke kwityhubhu yesithando somlilo, okanye siyisuse emva kokucubungula.
▪ Ikhasethi Yokugcina Iikhasethi:
I-Cassette yokugcina i-carousel isetyenziselwa ukugcina ibhokisi equkethe ii-silicon wafers kwaye inokujikelezwa ukufikelela kwi-robot.
▪ Ikhasethi yeWafer:
I-wafer cassette isetyenziselwa ukugcina nokudlulisa ii-silicone wafers ukuba zisetyenzwe.
Ixesha lokuposa: Apr-22-2024