Ukuveliswa kwemveliso nganye ye-semiconductor kufuna amakhulu eenkqubo. Sahlula yonke inkqubo yokuvelisa ibe ngamanyathelo asibhozo:iqhekeza lesonkaprocessing-oxidation-photolithography-etching-thin film deposition-epitaxial ukukhula-diffusion-ion implantation.
Ukukunceda ukuba uqonde kwaye uqaphele i-semiconductors kunye neenkqubo ezinxulumeneyo, siya kutyhala amanqaku e-WeChat kumbandela ngamnye ukwazisa ngalinye kula manyathelo angasentla nganye nganye.
Kwinqaku elandulelayo, kwakhankanywa ukuba ukwenzela ukukhusela iiqhekeza lesonkakubumdaka obahlukeneyo, kwenziwa ifilim ye-oxide--oxidation process. Namhlanje siza kuxubusha "inkqubo ye-photolithography" yokufota isekethe yoyilo lwe-semiconductor kwi-wafer kunye nefilimu ye-oxide eyenziwe.
Inkqubo yePhotolithography
1. Yintoni inkqubo ye-photolithography
I-Photolithography kukwenza iisekethe kunye neendawo zokusebenza ezifunekayo kwimveliso ye-chip.
Ukukhanya okukhutshwe ngumatshini wefotolithography kusetyenziselwa ukuveza ifilimu ebhityileyo eboshwe ngefotoresist ngokusebenzisa imaski enepateni. I-photoresist iya kutshintsha iimpawu zayo emva kokubona ukukhanya, ukwenzela ukuba iphethini kwimaski ikopishwe kwifilimu encinci, ukwenzela ukuba ifilimu encinci inomsebenzi womzobo wesiphaluka se-elektroniki. Le yindima ye-photolithography, efana nokuthatha imifanekiso ngekhamera. Iifoto ezithathwe yikhamera ziprintwa kwifilimu, ngelixa i-photolithography ayikroli iifoto, kodwa imizobo yesiphaluka kunye nezinye izinto ze-elektroniki.
I-Photolithography yitekhnoloji ye-micro-machining echanekileyo
I-photolithography eqhelekileyo yinkqubo esebenzisa ukukhanya kwe-ultraviolet kunye ne-wavelength ye-2000 ukuya kwi-4500 angstroms njengomphathi wolwazi lomfanekiso, kwaye isebenzisa i-photoresist njengendlela ephakathi (ukurekhoda komfanekiso) ukufezekisa ukuguqulwa, ukuhanjiswa kunye nokulungiswa kwemizobo, kwaye ekugqibeleni idlulisele umfanekiso. ulwazi kwitshiphu (ubukhulu becala isilicon chip) okanye umaleko dielectric.
Kunokuthiwa ukuba i-photolithography isisiseko semiconductor yanamhlanje, i-microelectronics, kunye namashishini olwazi, kunye ne-photolithography ichaza ngokuthe ngqo inqanaba lophuhliso lobu buchwepheshe.
Kwiminyaka engaphezu kwama-60 ukususela ekuphunyezweni okuyimpumelelo kweesekethe ezidibeneyo kwi-1959, ububanzi bomgca wemizobo yayo buncitshiswe malunga nemiyalelo emine yobukhulu, kwaye ukuhlanganiswa kweesekethe kuye kwaphuculwa ngaphezu kwemiyalelo emithandathu yobukhulu. Inkqubela phambili ekhawulezileyo yezi teknoloji ibangelwa ikakhulu kuphuhliso lwe-photolithography.
(Iimfuno zeteknoloji ye-photolithography kumanqanaba ahlukeneyo ophuhliso lwemveliso yesekethe edibeneyo)
2. Imigaqo esisiseko ye-photolithography
Izinto ze-Photolithography zibhekisela kwi-photoresists, eyaziwa ngokuba yi-photoresists, ezona zinto zibaluleke kakhulu zokusebenza kwi-photolithography. Olu hlobo lwezinto luneempawu zokukhanya (kubandakanywa ukukhanya okubonakalayo, ukukhanya kwe-ultraviolet, i-electron beam, njl.) Ukusabela. Emva kwempendulo ye-photochemical, ukunyibilika kwayo kutshintsha kakhulu.
Phakathi kwabo, i-solubility ye-photoresist efanelekileyo kumphuhlisi iyanda, kwaye iphethini efunyenweyo iyafana ne-mask; I-photoresist engalunganga ichasene, oko kukuthi, ukunyibilika kuncipha okanye kunganyibiliki emva kokuvezwa kumphuhlisi, kwaye ipateni efunyenweyo ichasene nemaski. Iinkalo zesicelo zeentlobo ezimbini ze-photoresists zihlukile. Iifotoresists ezilungileyo zisetyenziswa ngokuqhelekileyo, zibalelwa ngaphezu kwe-80% yetotali.
Oku ngasentla ngumzobo wesicwangciso senkqubo ye-photolithography
(1) Ukuncamathelisa:
Oko kukuthi, ukwenza ifilimu ye-photoresist enobunzima obufanayo, ukunamathela okuqinileyo kwaye akukho ziphene kwi-silicon wafer. Ukuze kuphuculwe ukunamathela phakathi kwefilimu ye-photoresist kunye ne-silicon wafer, kudla ngokuyimfuneko ukuguqula kuqala umphezulu we-silicon wafer kunye nezinto ezifana ne-hexamethyldisilazane (HMDS) kunye ne-trimethylsilyldiethylamine (TMSDEA). Emva koko, ifilimu ye-photoresist ilungiselelwe nge-spin coating.
(2) Ukubhaka kwangaphambili:
Emva kokugquma i-spin, ifilimu ye-photoresist isenomlinganiselo othile we-solvent. Emva kokubhaka kwiqondo lokushisa eliphezulu, i-solvent inokususwa kancinane kangangoko kunokwenzeka. Emva kokubhaka kwangaphambili, umxholo we-photoresist uyancipha ube malunga ne-5%.
(3) Ukutyhileka:
Oko kukuthi, i-photoresist ibonakaliswe ekukhanyeni. Ngeli xesha, i-photoreaction iyenzeka, kwaye umehluko we-solubility phakathi kwendawo ekhanyisiweyo kunye nenxalenye engakhanyisiweyo yenzeke.
(4) Uphuhliso kunye nokuqina:
Imveliso intywiliselwe kumphuhlisi. Ngeli xesha, indawo eveziweyo ye-photoresist elungileyo kunye nendawo engavezwanga ye-photoresist engalunganga iya kunyibilika kuphuhliso. Oku kubonisa ipateni enamacala amathathu. Emva kophuhliso, i-chip idinga inkqubo yonyango lobushushu obuphezulu ukuze ibe yifilimu enzima, esebenza kakhulu ukuqhubela phambili ukunamathela kwe-photoresist kwi-substrate.
(5) Ukurhweba:
Izinto eziphantsi kwe-photoresist zifakwe. Ibandakanya ulwelo olumanzi kunye ne-gaseous etching eyomileyo. Ngokomzekelo, ukufakwa okumanzi kwe-silicon, isisombululo esine-acidic samanzi se-hydrofluoric acid sisetyenziswa; ukufakwa okumanzi kobhedu, isisombululo esinamandla se-asidi esifana ne-nitric acid kunye ne-asidi ye-sulfuric isetyenzisiweyo, ngelixa i-etching eyomileyo isoloko isebenzisa i-plasma okanye i-ion beams ephezulu yokonakalisa umphezulu wezinto kunye ne-etch it.
(6) Ukwenza i-degumming:
Ekugqibeleni, i-photoresist kufuneka isuswe kumphezulu we-lens. Eli nyathelo libizwa ngokuba yi-degumming.
Ukhuseleko ngowona mba ubalulekileyo kuyo yonke imveliso ye-semiconductor. Iigesi eziphambili ezinobungozi kunye neziyingozi ze-photolithography kwinkqubo ye-chip lithography zilandelayo:
1. I-hydrogen peroxide
I-hydrogen peroxide (H2O2) yi-oxidant eyomeleleyo. Ukuqhagamshelana ngokuthe ngqo kunokubangela ukuvutha kwesikhumba kunye namehlo kunye nokutshisa.
2. Xylene
I-Xylene sisinyibilikisi kunye nomphuhlisi osetyenziswa kwi-negative lithography. Iyatsha kwaye inobushushu obuphantsi obungama-27.3℃ kuphela (malunga nobushushu begumbi). Iqhuma xa i-concentration emoyeni i-1% -7%. Ukudibana ngokuphindaphindiweyo nexylene kunokubangela ukudumba kwesikhumba. Umphunga weXylene uswiti, ufana nevumba le-airplane tack; ukuba sesichengeni sexylene kunokubangela ukudumba kwamehlo, impumlo kunye nomqala. Ukuphefumla igesi kunokubangela intloko ebuhlungu, isiyezi, ukulahlekelwa ngumdla kunye nokudinwa.
3. I-Hexamethyldisilazane (HMDS)
I-Hexamethyldisilazane (i-HMDS) isetyenziswa ngokuqhelekileyo njenge-primer layer ukunyusa ukudibanisa kwe-photoresist ebusweni bemveliso. Inokutsha kwaye inokukhanya kwe-6.7°C. Iqhuma xa i-concentration emoyeni i-0.8% -16%. I-HMDS isabela ngamandla ngamanzi, utywala kunye ne-mineral acids ukukhupha i-ammonia.
4. I-Tetramethylammonium hydroxide
I-Tetramethylammonium hydroxide (TMAH) isetyenziswa ngokubanzi njengomphuhlisi we-lithography efanelekileyo. Inetyhefu kwaye iyadla. Inokubulala xa iginyiwe okanye idibana ngqo nolusu. Ukudibana nothuli okanye inkungu ye-TMAH kunokubangela ukudumba kwamehlo, ulusu, impumlo kunye nomqala. Ukuphefumla iqondo eliphezulu le-TMAH kuya kukhokelela ekufeni.
5. Iklorini kunye nefluorine
I-Chlorine (Cl2) kunye nefluorine (F2) zombini zisetyenziswa kwi-excimer lasers njengemithombo yokukhanya enzulu ye-ultraviolet kunye ne-ultraviolet (EUV) egqithisileyo. Zombini iigesi zinetyhefu, zibonakala ziluhlaza kancinci, kwaye zinevumba elibi elicaphukisayo. Ukuphefumla iqondo eliphezulu lerhasi kuya kukhokelela ekufeni. Irhasi yefluorine inokusabelana namanzi ukuvelisa igesi yehydrogen fluoride. Irhasi yeHydrogen fluoride yiasidi eyomeleleyo ecaphukisa ulusu, amehlo kunye nomgudu wokuphefumla kwaye inokubangela iimpawu ezinjengokutshisa kunye nobunzima bokuphefumla. Ukugxila okuphezulu kwe-fluoride kunokubangela ityhefu emzimbeni womntu, kubangele iimpawu ezinje ngentloko ebuhlungu, ukuhlanza, urhudo, kunye ne-coma.
6. Argon
I-Argon (Ar) yigesi ye-inert ehlala ingabangela ingozi ngokuthe ngqo kumzimba womntu. Kwiimeko eziqhelekileyo, abantu bomoya abaphefumulayo baqulethe malunga ne-0.93% ye-argon, kwaye le ngqwalasela ayinayo umphumo ocacileyo kumzimba womntu. Nangona kunjalo, kwezinye iimeko, i-argon inokubangela ingozi kumzimba womntu.
Nazi ezinye iimeko ezinokwenzeka: Kwindawo evaliweyo, ukuxinwa kwe-argon kunokunyuka, ngaloo ndlela kuncitshiswe i-oksijeni emoyeni kwaye kubangele i-hypoxia. Oku kunokubangela iimpawu ezifana nesiyezi, ukudinwa, nokuphefumla nzima. Ukongezelela, i-argon yigesi e-inert, kodwa inokuqhuma phantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu.
7. Neon
I-Neon (i-Ne) yigesi ezinzileyo, engenambala kunye nephunga elingenalo inxaxheba Igesi ye-neon ayibandakanyekanga kwinkqubo yokuphefumula komntu, ngoko ukuphefumla kwi-concentration ephezulu ye-neon gas kuya kubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezinjengentloko ebuhlungu, isicaphucaphu, nokugabha. Ukongeza, igesi ye-neon inokusabela kunye nezinye izinto phantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu oludala umlilo okanye ugqabhuko-dubulo.
8. Irhasi yeXenon
Igesi ye-Xenon (Xe) yigesi ezinzileyo, engenambala kwaye engenavumba engathathi nxaxheba kwinkqubo yokuphefumla komntu, ngoko ukuphefumla kwiqondo eliphezulu legesi ye-xenon kuya kubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezinjengentloko ebuhlungu, isicaphucaphu, nokugabha. Ukongeza, igesi ye-neon inokusabela kunye nezinye izinto phantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu oludala umlilo okanye ugqabhuko-dubulo.
9. Irhasi yeKrypton
I-Krypton gas (Kr) yigesi ezinzileyo, engenambala kunye nephunga elingenalo inxaxheba kwinkqubo yokuphefumula komntu, ngoko ukuphefumla kwiqondo eliphezulu legesi ye-krypton kuya kubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezinjengentloko ebuhlungu, isicaphucaphu, nokugabha. Ukongeza, igesi ye-xenon inokusabela kunye nezinye izinto phantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu olubangela umlilo okanye ugqabhuko-dubulo. Ukuphefumla kwindawo eneoksijini yokungabikho kunokubangela i-hypoxia. Ukuba ukwimeko ye-hypoxia ixesha elide, unokufumana iimpawu ezinjengentloko ebuhlungu, isicaphucaphu, nokugabha. Ukongeza, igesi yekrypton inokusabela kunye nezinye izinto phantsi kobushushu obuphezulu okanye uxinzelelo oluphezulu oludala umlilo okanye ugqabhuko-dubulo.
Izisombululo zokufumanisa igesi enobungozi kwishishini le-semiconductor
Ishishini le-semiconductor libandakanya imveliso, ukuveliswa, kunye nenkqubo yeegesi ezinokutsha, eziqhumayo, eziyityhefu kunye neziyingozi. Njengomsebenzisi weegesi kwimizi-mveliso ye-semiconductor, wonke umsebenzi kufuneka aqonde idatha yokhuseleko lweegesi ezahlukeneyo eziyingozi ngaphambi kokusetyenziswa, kwaye kufuneka azi indlela yokujongana neenkqubo zongxamiseko xa ezi gesi zivuzayo.
Kwimveliso, ukuveliswa kunye nokugcinwa kweshishini le-semiconductor, ukwenzela ukuba ugweme ukulahleka kobomi kunye nepropathi ebangelwa ukuvuza kwezi gesi ezinobungozi, kuyimfuneko ukufakela izixhobo zokufumanisa igesi ukufumanisa igesi ekujoliswe kuyo.
Izixhobo zokujonga igesi ziye zaba zizixhobo ezibalulekileyo zokubeka iliso kokusingqongileyo kwishishini lanamhlanje le-semiconductor, kwaye zikwazezona zixhobo zokubeka iliso ngokuthe ngqo.
U-Riken Keiki uye wahlala enikela ingqalelo ekuphuhlisweni okukhuselekileyo kweshishini lokuvelisa i-semiconductor, kunye nomsebenzi wokudala indawo ekhuselekileyo yokusebenza kubantu, kwaye uye wazinikela ekuphuhliseni izinzwa zegesi ezifanelekileyo kwishishini le-semiconductor, ukubonelela ngezisombululo ezifanelekileyo kwiingxaki ezahlukeneyo ezidibana nazo. abasebenzisi, kwaye ngokuqhubekayo nokuphucula imisebenzi yemveliso kunye nokuphucula iinkqubo.
Ixesha lokuposa: Jul-16-2024