ukunyusa kwi-fan-Out wafer degree package Ngokuqiniswa kwe-ultraviolet

I-fan out wafer degree packaging ( FOWLP ) kwishishini le-semiconductor yaziwa ngokuba yindleko esebenzayo, kodwa ayikho ngaphandle komceli mngeni wayo. Omnye umba ophambili ojongene ne-warp kunye nokuqala kancinci ngexesha lenkqubo yokubumba. I-warp inokubalelwa ekucuthekeni kweekhemikhali kwikhompawundi yokubumba kunye nokungahambelani kwi-coefficient yokwanda kwe-thermal, ngelixa isiqalo senzeke ngenxa yesiqulatho sokugcwaliswa okuphezulu kwizinto zokubumba ezine-syrupy. Nangona kunjalo, ngoncedo lweI-AI engabonakaliyo, isisombululo luphando ukufumana ngcono le mingeni.

I-DELO, inkampani ekhokelayo kwishishini, yenza uphando olunokwenzeka ukujongana nale ngxaki ngokubopha kancinci kwi-carrier exploitation low viscosity adhesive material and ultraviolet harding. Ngokuthelekisa i-warpage yezinto ezahlukeneyo, kwafunyaniswa ukuba ukuqina kwe-ultraviolet kunciphisa kakhulu i-warp ngexesha lokupholisa emva kokubumba. Ukusetyenziswa kwemathiriyeli yokuqina kwe-ultraviolet ayinciphisi kuphela imfuno yokuzalisa kodwa ikwanciphisa i-viscosity kunye ne-Young's modulus, ekugqibeleni kuncitshiswe ukuqala kancinci. Olu nyuso kwitekhnoloji lubonisa amandla okuvelisa inkokeli encinci yabalandeli ukupakishwa kwedigri ye-wafer kunye nephepha elincinci lokulwa kunye nokuqala kancinci.

Ngokubanzi, uphando luqaqambisa inzuzo yokusetyenziswa kokuqina kwe-ultraviolet kwinkqubo yokubumba indawo enkulu, ibonelela ngesisombululo kumngeni ojongene nawo kwipakethe ye-fan-out wafer-degree. Ngokukwazi ukunciphisa i-warpage kunye ne-die shift, ngelixa ifilimu ihlelwa phantsi ngexesha elinzima kunye nokusetyenziswa kwamandla, uprofesa wokuqina kwe-ultraviolet ukuba abe yindlela yokuthembisa kwishishini le-semiconductor. Ngaphandle komehluko wokwandiswa kwe-thermal coefficient phakathi kwemathiriyeli, ukusetyenziswa kokuqina kwe-ultraviolet kubonisa inketho enokwenzeka yokuphucula ukusebenza kakuhle kunye nomgangatho wokupakishwa kwesidanga se-wafer.